DE2223210A1 - Hitzeableitungsgeraet fuer Halbleiter - Google Patents

Hitzeableitungsgeraet fuer Halbleiter

Info

Publication number
DE2223210A1
DE2223210A1 DE19722223210 DE2223210A DE2223210A1 DE 2223210 A1 DE2223210 A1 DE 2223210A1 DE 19722223210 DE19722223210 DE 19722223210 DE 2223210 A DE2223210 A DE 2223210A DE 2223210 A1 DE2223210 A1 DE 2223210A1
Authority
DE
Germany
Prior art keywords
mount
base
heat sink
approach
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19722223210
Other languages
German (de)
English (en)
Inventor
Roback Kenneth John
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of DE2223210A1 publication Critical patent/DE2223210A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE19722223210 1971-05-17 1972-05-12 Hitzeableitungsgeraet fuer Halbleiter Pending DE2223210A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14387571A 1971-05-17 1971-05-17

Publications (1)

Publication Number Publication Date
DE2223210A1 true DE2223210A1 (de) 1972-12-21

Family

ID=22506050

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19722223210 Pending DE2223210A1 (de) 1971-05-17 1972-05-12 Hitzeableitungsgeraet fuer Halbleiter

Country Status (2)

Country Link
DE (1) DE2223210A1 (cs)
FR (1) FR2137969A1 (cs)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2485255A1 (en) * 2011-02-04 2012-08-08 Green Energy Material Technology Ltd. Laminated heat sink having enhanced heat dissipation capacity

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3633625A1 (de) * 1985-12-04 1987-06-11 Vdo Schindling Traegerplatte

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2485255A1 (en) * 2011-02-04 2012-08-08 Green Energy Material Technology Ltd. Laminated heat sink having enhanced heat dissipation capacity

Also Published As

Publication number Publication date
FR2137969A1 (cs) 1972-12-29

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