DE2163855A1 - Verfahren und Vorrichtung zum Herstellen eines Bodens für die Umhüllung eines elektrischen Bauelementes, sowie Boden für die Umhüllung eines elektrischen Bauelementes - Google Patents

Verfahren und Vorrichtung zum Herstellen eines Bodens für die Umhüllung eines elektrischen Bauelementes, sowie Boden für die Umhüllung eines elektrischen Bauelementes

Info

Publication number
DE2163855A1
DE2163855A1 DE19712163855 DE2163855A DE2163855A1 DE 2163855 A1 DE2163855 A1 DE 2163855A1 DE 19712163855 DE19712163855 DE 19712163855 DE 2163855 A DE2163855 A DE 2163855A DE 2163855 A1 DE2163855 A1 DE 2163855A1
Authority
DE
Germany
Prior art keywords
conductors
floor
insulating body
grid
longitudinal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19712163855
Other languages
German (de)
English (en)
Inventor
Hendrikus Johannes Christianes; Benschop Gerardus Cornells Marie; Nijmegen; Jonker Simon Eindhoven; Friebel (Niederlande). HOIj 29-86
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of DE2163855A1 publication Critical patent/DE2163855A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for individual devices of subclass H10D
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Casings For Electric Apparatus (AREA)
  • Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)
DE19712163855 1971-01-13 1971-12-22 Verfahren und Vorrichtung zum Herstellen eines Bodens für die Umhüllung eines elektrischen Bauelementes, sowie Boden für die Umhüllung eines elektrischen Bauelementes Pending DE2163855A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7100410A NL7100410A (enExample) 1971-01-13 1971-01-13

Publications (1)

Publication Number Publication Date
DE2163855A1 true DE2163855A1 (de) 1972-07-20

Family

ID=19812245

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19712163855 Pending DE2163855A1 (de) 1971-01-13 1971-12-22 Verfahren und Vorrichtung zum Herstellen eines Bodens für die Umhüllung eines elektrischen Bauelementes, sowie Boden für die Umhüllung eines elektrischen Bauelementes

Country Status (7)

Country Link
US (1) US3780429A (enExample)
CA (1) CA953504A (enExample)
DE (1) DE2163855A1 (enExample)
FR (1) FR2121744A1 (enExample)
GB (1) GB1380644A (enExample)
IT (1) IT946430B (enExample)
NL (1) NL7100410A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4428319A1 (de) * 1994-08-10 1996-04-25 Duerrwaechter E Dr Doduco Träger aus einem Kunststoff für eine elektronische Schaltung mit bondbaren Kontaktstiften

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4100675A (en) * 1976-11-01 1978-07-18 Mansol Ceramics Company Novel method and apparatus for hermetic encapsulation for integrated circuits and the like
US4979289A (en) * 1989-02-10 1990-12-25 Honeywell Inc. Method of die bonding semiconductor chip by using removable non-wettable by solder frame
US5074036A (en) * 1989-02-10 1991-12-24 Honeywell Inc. Method of die bonding semiconductor chip by using removable frame
US5101550A (en) * 1989-02-10 1992-04-07 Honeywell Inc. Removable drop-through die bond frame
US5519332A (en) * 1991-06-04 1996-05-21 Micron Technology, Inc. Carrier for testing an unpackaged semiconductor die

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2526588A (en) * 1946-03-22 1950-10-17 Raytheon Mfg Co Molding apparatus
US2958100A (en) * 1955-05-16 1960-11-01 Erie Resistor Corp Mold for forming a plurality of electrical elements with embedded terminals
NL128568C (enExample) * 1960-11-17
US3379823A (en) * 1965-04-29 1968-04-23 Corning Glass Works Hermetic enclosure for electronic devices

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4428319A1 (de) * 1994-08-10 1996-04-25 Duerrwaechter E Dr Doduco Träger aus einem Kunststoff für eine elektronische Schaltung mit bondbaren Kontaktstiften

Also Published As

Publication number Publication date
IT946430B (it) 1973-05-21
CA953504A (en) 1974-08-27
NL7100410A (enExample) 1972-07-17
GB1380644A (en) 1975-01-15
US3780429A (en) 1973-12-25
FR2121744A1 (enExample) 1972-08-25

Similar Documents

Publication Publication Date Title
EP0236260B1 (de) Bauelement für Baumodelle, insbesondere Bauspielzeuge
DE2920028A1 (de) Elektrischer kontakt fuer einen schalter sowie verfahren zur herstellung eines solchen kontaktes
DE2159530C3 (de) Verfahren zum Herstellen einer Halbleiteranordnung
DE1121139B (de) Verfahren zur Herstellung gedruckter Schaltungen
DE1540643B2 (de) Elektrische anschlussklemme mit einem klemmbolzen und verfah ren zu ihrer herstellung
DE1081619B (de) Verfahren zur Herstellung zusammengesetzter glasig-kristalliner Koerper
DE2700617A1 (de) Verfahren zum herstellen eines elektrischen bauteiles mit anschlussfahnen und mit diesem verfahren hergestellter bauteil
DE2103064A1 (de) Vorrichtung zur Herstellung von Modulelementen
DE1279799B (de) Verfahren zum Herstellen eines Isolierkoerpers mit nach aussen fuehrenden Anschluessen
DE1915114A1 (de) Aus Blech bestehendes elektrisches Kontaktelement
DE2163855A1 (de) Verfahren und Vorrichtung zum Herstellen eines Bodens für die Umhüllung eines elektrischen Bauelementes, sowie Boden für die Umhüllung eines elektrischen Bauelementes
DE2719262C2 (de) Kontaktfederleiste und Verfahren zu ihrer Herstellung
DE4001871A1 (de) Mehrstufige drucktastervorrichtung und verfahren zu ihrer herstellung
DE3237980A1 (de) Miniaturisierter elektrischer kontakt und schalter
DE3101995C2 (enExample)
DE3704240A1 (de) Elektrische anordnung mit einer mehrzahl von gleitelementen
DE2541222C2 (de) Auf einem Trägerkörper, insbesondere einer Leiterplatte, montierbare Steckvorrichtung
DE1614834C2 (de) Verfahren zum Herstellen einer Halb leiteranordnung
DE3786132T2 (de) Verfahren zum Verbinden metallischer Streifen beim Herstellen von elektrischen Bestandteilen und Bestandteile mit solchen Streifen.
EP0274067A1 (de) Putzträgerdämmplatte
DE2935182C2 (enExample)
DE4331724A1 (de) Ein Trägeraufbau für ein Heizelement für eine Herdplatte
DE1986059U (de) Anschlussorgan fuer eine elektronische vorrichtung mit einer flachen grundplatte.
DE1294647B (de) Verfahren und Vorrichtung zum Verbinden von dicht aneinanderliegenden Bauteilen, von denen mindestens eines aus thermoplastischem Kunststoff besteht
DE3886580T2 (de) Starrfestsetzungsverfahren eines Metallstückes auf eine thermoplastische Unterlage, und elektrischer Kontakt aus Metall und aus thermoplastischem Material.