CA953504A - Manufacturing a base for the envelope of an electrical component - Google Patents
Manufacturing a base for the envelope of an electrical componentInfo
- Publication number
- CA953504A CA953504A CA131,999A CA131999A CA953504A CA 953504 A CA953504 A CA 953504A CA 131999 A CA131999 A CA 131999A CA 953504 A CA953504 A CA 953504A
- Authority
- CA
- Canada
- Prior art keywords
- envelope
- manufacturing
- base
- electrical component
- electrical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)
- Casings For Electric Apparatus (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL7100410A NL7100410A (en) | 1971-01-13 | 1971-01-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
CA953504A true CA953504A (en) | 1974-08-27 |
Family
ID=19812245
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA131,999A Expired CA953504A (en) | 1971-01-13 | 1972-01-10 | Manufacturing a base for the envelope of an electrical component |
Country Status (7)
Country | Link |
---|---|
US (1) | US3780429A (en) |
CA (1) | CA953504A (en) |
DE (1) | DE2163855A1 (en) |
FR (1) | FR2121744A1 (en) |
GB (1) | GB1380644A (en) |
IT (1) | IT946430B (en) |
NL (1) | NL7100410A (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4100675A (en) * | 1976-11-01 | 1978-07-18 | Mansol Ceramics Company | Novel method and apparatus for hermetic encapsulation for integrated circuits and the like |
US5074036A (en) * | 1989-02-10 | 1991-12-24 | Honeywell Inc. | Method of die bonding semiconductor chip by using removable frame |
US5101550A (en) * | 1989-02-10 | 1992-04-07 | Honeywell Inc. | Removable drop-through die bond frame |
US4979289A (en) * | 1989-02-10 | 1990-12-25 | Honeywell Inc. | Method of die bonding semiconductor chip by using removable non-wettable by solder frame |
US5519332A (en) * | 1991-06-04 | 1996-05-21 | Micron Technology, Inc. | Carrier for testing an unpackaged semiconductor die |
DE4428319C2 (en) * | 1994-08-10 | 1996-08-14 | Duerrwaechter E Dr Doduco | Carrier made of plastic for an electronic circuit with bondable contact pins |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2526588A (en) * | 1946-03-22 | 1950-10-17 | Raytheon Mfg Co | Molding apparatus |
US2958100A (en) * | 1955-05-16 | 1960-11-01 | Erie Resistor Corp | Mold for forming a plurality of electrical elements with embedded terminals |
NL258072A (en) * | 1960-11-17 | |||
US3379823A (en) * | 1965-04-29 | 1968-04-23 | Corning Glass Works | Hermetic enclosure for electronic devices |
-
1971
- 1971-01-13 NL NL7100410A patent/NL7100410A/xx unknown
- 1971-12-22 DE DE19712163855 patent/DE2163855A1/en active Pending
- 1971-12-23 US US00211277A patent/US3780429A/en not_active Expired - Lifetime
-
1972
- 1972-01-10 IT IT19193/72A patent/IT946430B/en active
- 1972-01-10 CA CA131,999A patent/CA953504A/en not_active Expired
- 1972-01-10 GB GB99272A patent/GB1380644A/en not_active Expired
- 1972-01-11 FR FR7200777A patent/FR2121744A1/fr not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
DE2163855A1 (en) | 1972-07-20 |
US3780429A (en) | 1973-12-25 |
GB1380644A (en) | 1975-01-15 |
NL7100410A (en) | 1972-07-17 |
FR2121744A1 (en) | 1972-08-25 |
IT946430B (en) | 1973-05-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CA973946A (en) | Electrical terminal | |
AU472546B2 (en) | Integrated circuit package connectors | |
CA940212A (en) | Electrical contact | |
CA933620A (en) | Lead locking configuration for electrical components | |
CA953277A (en) | Base mounting | |
AU467322B2 (en) | Electrical tool | |
CA983139A (en) | Electrical socket assembly | |
CA938670A (en) | Electrical circuit arrangement | |
CA953504A (en) | Manufacturing a base for the envelope of an electrical component | |
CA931276A (en) | High voltage hold down circuit | |
CA970079A (en) | Method of soldering a semiconductor plate | |
CA955636A (en) | Electrical generators | |
AU459637B2 (en) | Semiconductor circuit | |
CA961923A (en) | Series-parallel electrical circuit | |
AU3409871A (en) | Electrical fitting | |
CA885648A (en) | Electrical component | |
CA878743A (en) | Electrical component | |
CA873000A (en) | Multi-impedance electrical component | |
CA968070A (en) | Semiconductor assembly | |
CA874306A (en) | Vacuum base | |
CA868056A (en) | Electrical connection | |
CA872411A (en) | Surge-resistant electrical devices | |
CA864713A (en) | Electrical component terminal assembly | |
CA913804A (en) | Methods of manufacturing an electrical component | |
CA875753A (en) | Electrical contacts |