FR2121744A1 - - Google Patents

Info

Publication number
FR2121744A1
FR2121744A1 FR7200777A FR7200777A FR2121744A1 FR 2121744 A1 FR2121744 A1 FR 2121744A1 FR 7200777 A FR7200777 A FR 7200777A FR 7200777 A FR7200777 A FR 7200777A FR 2121744 A1 FR2121744 A1 FR 2121744A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7200777A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of FR2121744A1 publication Critical patent/FR2121744A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/153—Containers comprising an insulating or insulated base having interconnections in passages through the insulating or insulated base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
FR7200777A 1971-01-13 1972-01-11 Withdrawn FR2121744A1 (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7100410A NL7100410A (enExample) 1971-01-13 1971-01-13

Publications (1)

Publication Number Publication Date
FR2121744A1 true FR2121744A1 (enExample) 1972-08-25

Family

ID=19812245

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7200777A Withdrawn FR2121744A1 (enExample) 1971-01-13 1972-01-11

Country Status (7)

Country Link
US (1) US3780429A (enExample)
CA (1) CA953504A (enExample)
DE (1) DE2163855A1 (enExample)
FR (1) FR2121744A1 (enExample)
GB (1) GB1380644A (enExample)
IT (1) IT946430B (enExample)
NL (1) NL7100410A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996005615A1 (de) * 1994-08-10 1996-02-22 Doduco Gmbh + Co. Träger aus einem kunststoff für eine elektronische schaltung mit bondbaren kontaktstiften

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4100675A (en) * 1976-11-01 1978-07-18 Mansol Ceramics Company Novel method and apparatus for hermetic encapsulation for integrated circuits and the like
US4979289A (en) * 1989-02-10 1990-12-25 Honeywell Inc. Method of die bonding semiconductor chip by using removable non-wettable by solder frame
US5074036A (en) * 1989-02-10 1991-12-24 Honeywell Inc. Method of die bonding semiconductor chip by using removable frame
US5101550A (en) * 1989-02-10 1992-04-07 Honeywell Inc. Removable drop-through die bond frame
US5519332A (en) * 1991-06-04 1996-05-21 Micron Technology, Inc. Carrier for testing an unpackaged semiconductor die

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2526588A (en) * 1946-03-22 1950-10-17 Raytheon Mfg Co Molding apparatus
US2958100A (en) * 1955-05-16 1960-11-01 Erie Resistor Corp Mold for forming a plurality of electrical elements with embedded terminals
NL258072A (enExample) * 1960-11-17
US3379823A (en) * 1965-04-29 1968-04-23 Corning Glass Works Hermetic enclosure for electronic devices

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996005615A1 (de) * 1994-08-10 1996-02-22 Doduco Gmbh + Co. Träger aus einem kunststoff für eine elektronische schaltung mit bondbaren kontaktstiften

Also Published As

Publication number Publication date
GB1380644A (en) 1975-01-15
NL7100410A (enExample) 1972-07-17
IT946430B (it) 1973-05-21
US3780429A (en) 1973-12-25
CA953504A (en) 1974-08-27
DE2163855A1 (de) 1972-07-20

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Legal Events

Date Code Title Description
ST Notification of lapse