NL7100410A - - Google Patents

Info

Publication number
NL7100410A
NL7100410A NL7100410A NL7100410A NL7100410A NL 7100410 A NL7100410 A NL 7100410A NL 7100410 A NL7100410 A NL 7100410A NL 7100410 A NL7100410 A NL 7100410A NL 7100410 A NL7100410 A NL 7100410A
Authority
NL
Netherlands
Application number
NL7100410A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to NL7100410A priority Critical patent/NL7100410A/xx
Priority to DE19712163855 priority patent/DE2163855A1/de
Priority to US00211277A priority patent/US3780429A/en
Priority to CA131,999A priority patent/CA953504A/en
Priority to IT19193/72A priority patent/IT946430B/it
Priority to GB99272A priority patent/GB1380644A/en
Priority to FR7200777A priority patent/FR2121744A1/fr
Publication of NL7100410A publication Critical patent/NL7100410A/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/153—Containers comprising an insulating or insulated base having interconnections in passages through the insulating or insulated base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
NL7100410A 1971-01-13 1971-01-13 NL7100410A (enExample)

Priority Applications (7)

Application Number Priority Date Filing Date Title
NL7100410A NL7100410A (enExample) 1971-01-13 1971-01-13
DE19712163855 DE2163855A1 (de) 1971-01-13 1971-12-22 Verfahren und Vorrichtung zum Herstellen eines Bodens für die Umhüllung eines elektrischen Bauelementes, sowie Boden für die Umhüllung eines elektrischen Bauelementes
US00211277A US3780429A (en) 1971-01-13 1971-12-23 Method for manufacturing a base for the envelope of an electric component
CA131,999A CA953504A (en) 1971-01-13 1972-01-10 Manufacturing a base for the envelope of an electrical component
IT19193/72A IT946430B (it) 1971-01-13 1972-01-10 Metodo e dispositivo per la fabbri cazione di una base per un conteni tore di un componente elettrico e base per il com ponente elettrico
GB99272A GB1380644A (en) 1971-01-13 1972-01-10 Manufacture of bases for electrical-component envelopes
FR7200777A FR2121744A1 (enExample) 1971-01-13 1972-01-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7100410A NL7100410A (enExample) 1971-01-13 1971-01-13

Publications (1)

Publication Number Publication Date
NL7100410A true NL7100410A (enExample) 1972-07-17

Family

ID=19812245

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7100410A NL7100410A (enExample) 1971-01-13 1971-01-13

Country Status (7)

Country Link
US (1) US3780429A (enExample)
CA (1) CA953504A (enExample)
DE (1) DE2163855A1 (enExample)
FR (1) FR2121744A1 (enExample)
GB (1) GB1380644A (enExample)
IT (1) IT946430B (enExample)
NL (1) NL7100410A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4100675A (en) * 1976-11-01 1978-07-18 Mansol Ceramics Company Novel method and apparatus for hermetic encapsulation for integrated circuits and the like
US5074036A (en) * 1989-02-10 1991-12-24 Honeywell Inc. Method of die bonding semiconductor chip by using removable frame
US5101550A (en) * 1989-02-10 1992-04-07 Honeywell Inc. Removable drop-through die bond frame
US4979289A (en) * 1989-02-10 1990-12-25 Honeywell Inc. Method of die bonding semiconductor chip by using removable non-wettable by solder frame
US5519332A (en) * 1991-06-04 1996-05-21 Micron Technology, Inc. Carrier for testing an unpackaged semiconductor die
DE4428319C2 (de) * 1994-08-10 1996-08-14 Duerrwaechter E Dr Doduco Träger aus einem Kunststoff für eine elektronische Schaltung mit bondbaren Kontaktstiften

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2526588A (en) * 1946-03-22 1950-10-17 Raytheon Mfg Co Molding apparatus
US2958100A (en) * 1955-05-16 1960-11-01 Erie Resistor Corp Mold for forming a plurality of electrical elements with embedded terminals
NL258072A (enExample) * 1960-11-17
US3379823A (en) * 1965-04-29 1968-04-23 Corning Glass Works Hermetic enclosure for electronic devices

Also Published As

Publication number Publication date
US3780429A (en) 1973-12-25
IT946430B (it) 1973-05-21
DE2163855A1 (de) 1972-07-20
CA953504A (en) 1974-08-27
GB1380644A (en) 1975-01-15
FR2121744A1 (enExample) 1972-08-25

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