DE2149344A1 - Verfahren und Anordnung zur Beaufschlagung genau angeordneter Gebiete eines Elementes mit einem Elektronenstrahl bestimmter Gestalt - Google Patents

Verfahren und Anordnung zur Beaufschlagung genau angeordneter Gebiete eines Elementes mit einem Elektronenstrahl bestimmter Gestalt

Info

Publication number
DE2149344A1
DE2149344A1 DE19712149344 DE2149344A DE2149344A1 DE 2149344 A1 DE2149344 A1 DE 2149344A1 DE 19712149344 DE19712149344 DE 19712149344 DE 2149344 A DE2149344 A DE 2149344A DE 2149344 A1 DE2149344 A1 DE 2149344A1
Authority
DE
Germany
Prior art keywords
alignment
electron beam
component
coincidence
mark
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19712149344
Other languages
German (de)
English (en)
Inventor
Malmberg Paul R
O'keeffe Terence W
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Westinghouse Electric Corp
Original Assignee
Westinghouse Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Electric Corp filed Critical Westinghouse Electric Corp
Publication of DE2149344A1 publication Critical patent/DE2149344A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/304—Controlling tubes by information coming from the objects or from the beam, e.g. correction signals
    • H01J37/3045—Object or beam position registration
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/20—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity
    • G01N25/48—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity on solution, sorption, or a chemical reaction not involving combustion or catalytic oxidation
    • G01N25/4806—Details not adapted to a particular type of sample
    • G01N25/4813—Details not adapted to a particular type of sample concerning the measuring means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/102—Mask alignment

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Biochemistry (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Combustion & Propulsion (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Electron Beam Exposure (AREA)
  • Electron Sources, Ion Sources (AREA)
  • Image-Pickup Tubes, Image-Amplification Tubes, And Storage Tubes (AREA)
  • Control Of Position Or Direction (AREA)
DE19712149344 1970-10-06 1971-10-02 Verfahren und Anordnung zur Beaufschlagung genau angeordneter Gebiete eines Elementes mit einem Elektronenstrahl bestimmter Gestalt Pending DE2149344A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US7850570A 1970-10-06 1970-10-06

Publications (1)

Publication Number Publication Date
DE2149344A1 true DE2149344A1 (de) 1972-04-13

Family

ID=22144444

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19712149344 Pending DE2149344A1 (de) 1970-10-06 1971-10-02 Verfahren und Anordnung zur Beaufschlagung genau angeordneter Gebiete eines Elementes mit einem Elektronenstrahl bestimmter Gestalt

Country Status (7)

Country Link
US (1) US3710101A (enExample)
JP (1) JPS5128467B1 (enExample)
CA (1) CA930078A (enExample)
DE (1) DE2149344A1 (enExample)
FR (1) FR2111008A5 (enExample)
GB (1) GB1361804A (enExample)
IT (1) IT938979B (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2727733A1 (de) * 1976-06-30 1978-01-05 Ibm Elektronenstrahllithographieanordnung
EP0065143A3 (en) * 1981-05-07 1983-11-09 Tokyo Shibaura Denki Kabushiki Kaisha Electron beam pattern transfer device and method for aligning mask and semiconductor wafer

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2146106B1 (enExample) * 1971-07-16 1977-08-05 Thomson Csf
US3879613A (en) * 1971-12-13 1975-04-22 Philips Corp Methods of manufacturing semiconductor devices
US3832560A (en) * 1973-06-13 1974-08-27 Westinghouse Electric Corp Method and apparatus for electron beam alignment with a member by detecting cathodoluminescence from oxide layers
US3895234A (en) * 1973-06-15 1975-07-15 Westinghouse Electric Corp Method and apparatus for electron beam alignment with a member
US3840749A (en) * 1973-06-19 1974-10-08 Westinghouse Electric Corp Method and apparatus for electron beam alignment with a semiconductor member
US3875414A (en) * 1973-08-20 1975-04-01 Secr Defence Brit Methods suitable for use in or in connection with the production of microelectronic devices
US3849659A (en) * 1973-09-10 1974-11-19 Westinghouse Electric Corp Alignment of a patterned electron beam with a member by electron backscatter
US4008402A (en) * 1974-07-18 1977-02-15 Westinghouse Electric Corporation Method and apparatus for electron beam alignment with a member by detecting X-rays
GB1520925A (en) * 1975-10-06 1978-08-09 Mullard Ltd Semiconductor device manufacture
GB1557064A (en) * 1976-09-09 1979-12-05 Mullard Ltd Masks suitable for use in electron image projectors
GB1578259A (en) * 1977-05-11 1980-11-05 Philips Electronic Associated Methods of manufacturing solid-state devices apparatus for use therein and devices manufactured thereby
GB1604004A (en) * 1977-10-11 1981-12-02 Fujitsu Ltd Method and apparatus for processing semi-conductor wafers
JPS5827663B2 (ja) * 1979-06-04 1983-06-10 富士通株式会社 半導体装置の製造方法
JPS6088536U (ja) * 1983-11-24 1985-06-18 住友電気工業株式会社 化合物半導体ウエハ
JPS60201626A (ja) * 1984-03-27 1985-10-12 Canon Inc 位置合わせ装置
KR910000756B1 (en) * 1984-11-20 1991-02-06 Fujitsu Ltd Method for projection photoelectron image
US4871919A (en) * 1988-05-20 1989-10-03 International Business Machines Corporation Electron beam lithography alignment using electric field changes to achieve registration
US6875624B2 (en) * 2002-05-08 2005-04-05 Taiwan Semiconductor Manufacturing Co. Ltd. Combined E-beam and optical exposure semiconductor lithography
US7414403B2 (en) * 2003-07-31 2008-08-19 Chiodo Chris D Imaging machine / MRI positioning assembly for magnet coils and specimens at the sweet spot of an imaging field
CN108615250B (zh) * 2018-05-31 2022-04-26 上海联影医疗科技股份有限公司 图像重建方法、装置、系统和计算机可读存储介质

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3236707A (en) * 1963-05-24 1966-02-22 Sperry Rand Corp Electrical circuitry and method
US3326176A (en) * 1964-10-27 1967-06-20 Nat Res Corp Work-registration device including ionic beam probe
US3551734A (en) * 1968-12-18 1970-12-29 Westinghouse Electric Corp Multi-coil electron image control apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2727733A1 (de) * 1976-06-30 1978-01-05 Ibm Elektronenstrahllithographieanordnung
EP0065143A3 (en) * 1981-05-07 1983-11-09 Tokyo Shibaura Denki Kabushiki Kaisha Electron beam pattern transfer device and method for aligning mask and semiconductor wafer

Also Published As

Publication number Publication date
CA930078A (en) 1973-07-10
IT938979B (it) 1973-02-10
JPS5128467B1 (enExample) 1976-08-19
US3710101A (en) 1973-01-09
FR2111008A5 (enExample) 1972-06-02
GB1361804A (en) 1974-07-30

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Legal Events

Date Code Title Description
OHA Expiration of time for request for examination