DE2124887C3 - Elektrisches Bauelement, vorzugsweise Halbleiterbauelement, mit Folienkontaktierung - Google Patents

Elektrisches Bauelement, vorzugsweise Halbleiterbauelement, mit Folienkontaktierung

Info

Publication number
DE2124887C3
DE2124887C3 DE2124887A DE2124887A DE2124887C3 DE 2124887 C3 DE2124887 C3 DE 2124887C3 DE 2124887 A DE2124887 A DE 2124887A DE 2124887 A DE2124887 A DE 2124887A DE 2124887 C3 DE2124887 C3 DE 2124887C3
Authority
DE
Germany
Prior art keywords
film
electrical component
conductor tracks
component
component according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2124887A
Other languages
German (de)
English (en)
Other versions
DE2124887B2 (de
DE2124887A1 (de
Inventor
Bengi 2000 Hamburg Goetze
Edward 2081 Tangstedt Uden
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Intellectual Property and Standards GmbH
Original Assignee
Philips Patentverwaltung GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Patentverwaltung GmbH filed Critical Philips Patentverwaltung GmbH
Priority to DE2124887A priority Critical patent/DE2124887C3/de
Priority to NL7206491A priority patent/NL7206491A/xx
Priority to AU42266/72A priority patent/AU466740B2/en
Priority to IT68531/72A priority patent/IT958885B/it
Priority to JP4776972A priority patent/JPS5428715B1/ja
Priority to GB2295772A priority patent/GB1363805A/en
Priority to FR7217421A priority patent/FR2137934B1/fr
Priority to CA142,537A priority patent/CA964380A/en
Publication of DE2124887A1 publication Critical patent/DE2124887A1/de
Priority to US449850A priority patent/US3930115A/en
Publication of DE2124887B2 publication Critical patent/DE2124887B2/de
Application granted granted Critical
Publication of DE2124887C3 publication Critical patent/DE2124887C3/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/184—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components inserted in holes through the PCBs and wherein terminals of the components are connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/056—Folded around rigid support or component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • ing And Chemical Polishing (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE2124887A 1971-05-19 1971-05-19 Elektrisches Bauelement, vorzugsweise Halbleiterbauelement, mit Folienkontaktierung Expired DE2124887C3 (de)

Priority Applications (9)

Application Number Priority Date Filing Date Title
DE2124887A DE2124887C3 (de) 1971-05-19 1971-05-19 Elektrisches Bauelement, vorzugsweise Halbleiterbauelement, mit Folienkontaktierung
NL7206491A NL7206491A (OSRAM) 1971-05-19 1972-05-13
AU42266/72A AU466740B2 (en) 1971-05-19 1972-05-15 Electric component, preferably a semiconductor device, having a foil contacting
JP4776972A JPS5428715B1 (OSRAM) 1971-05-19 1972-05-16
IT68531/72A IT958885B (it) 1971-05-19 1972-05-16 Componente elettrico particolarmen te dispositivo semiconduttore con contatto fogliforme
GB2295772A GB1363805A (en) 1971-05-19 1972-05-16 Electrical components particularly semiconductor devices
FR7217421A FR2137934B1 (OSRAM) 1971-05-19 1972-05-16
CA142,537A CA964380A (en) 1971-05-19 1972-05-19 Electric component having foil supported contacts
US449850A US3930115A (en) 1971-05-19 1974-03-11 Electric component assembly comprising insulating foil bearing conductor tracks

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2124887A DE2124887C3 (de) 1971-05-19 1971-05-19 Elektrisches Bauelement, vorzugsweise Halbleiterbauelement, mit Folienkontaktierung

Publications (3)

Publication Number Publication Date
DE2124887A1 DE2124887A1 (de) 1972-12-07
DE2124887B2 DE2124887B2 (de) 1979-08-02
DE2124887C3 true DE2124887C3 (de) 1980-04-17

Family

ID=5808355

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2124887A Expired DE2124887C3 (de) 1971-05-19 1971-05-19 Elektrisches Bauelement, vorzugsweise Halbleiterbauelement, mit Folienkontaktierung

Country Status (8)

Country Link
JP (1) JPS5428715B1 (OSRAM)
AU (1) AU466740B2 (OSRAM)
CA (1) CA964380A (OSRAM)
DE (1) DE2124887C3 (OSRAM)
FR (1) FR2137934B1 (OSRAM)
GB (1) GB1363805A (OSRAM)
IT (1) IT958885B (OSRAM)
NL (1) NL7206491A (OSRAM)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1403371A (en) * 1972-01-12 1975-08-28 Mullard Ltd Semiconductor device arrangements
GB1574699A (en) 1975-10-10 1980-09-10 Luc Technologies Ltd Conductive connections
ZA783270B (en) * 1977-07-06 1979-06-27 Motorola Inc Molded circuit board
DE2752655A1 (de) * 1977-09-23 1979-06-07 Blaupunkt Werke Gmbh Elektronisches bauelement
NL191959B (nl) * 1981-03-24 1996-07-01 Gao Ges Automation Org Identificatiekaart met IC-bouwsteen en dragerelement voor een IC-bouwsteen.
EP0115514B1 (en) * 1982-08-10 1986-11-12 BROWN, David, Frank Chip carrier
US4528748A (en) * 1982-11-29 1985-07-16 General Electric Company Method for fabricating a printed circuit board of desired shape
DE3627372C3 (de) * 1986-08-12 1994-04-14 Loewe Opta Gmbh Anordnung, bestehend aus einer Leiterplatte, einem Kühlkörper und zu kühlenden elektronischen Bauelementen
JPH0740600B2 (ja) * 1987-04-30 1995-05-01 三菱電機株式会社 半導体装置
US6842325B2 (en) * 2001-09-19 2005-01-11 Square D Company Flexible circuit adhered to metal frame of device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2923860A (en) * 1957-08-22 1960-02-02 Miller John Dawson Printed circuit board

Also Published As

Publication number Publication date
JPS5428715B1 (OSRAM) 1979-09-18
DE2124887B2 (de) 1979-08-02
AU4226672A (en) 1973-11-22
FR2137934B1 (OSRAM) 1980-04-04
AU466740B2 (en) 1975-11-06
FR2137934A1 (OSRAM) 1972-12-29
NL7206491A (OSRAM) 1972-11-21
IT958885B (it) 1973-10-30
GB1363805A (en) 1974-08-21
CA964380A (en) 1975-03-11
DE2124887A1 (de) 1972-12-07

Similar Documents

Publication Publication Date Title
DE2554965C2 (OSRAM)
DE1615957C3 (OSRAM)
DE102007006706B4 (de) Schaltungsanordnung mit Verbindungseinrichtung sowie Herstellungsverfahren hierzu
DE69819216T2 (de) Freitragende Kugelverbindung für integrierte Schaltungschippackung
DE2603575C2 (de) Einsteckmodul für eine elektronische Einrichtung
DE102007017831B4 (de) Halbleitermodul und ein Verfahren zur Herstellung eines Halbleitermoduls
DE3524002A1 (de) Montagevorrichtung fuer dickfilmbauelemente, insbesondere fuer elektronische module
DE10016132A1 (de) Elektronisches Bauelement mit flexiblen Kontaktierungsstellen und Verfahren zu dessen Herstellung
DE102009037257A1 (de) Leistungshalbleitermodul mit Schaltungsträger und Lastanschlusselement sowie Herstellungsverfahren hierzu
DE102008012256A1 (de) Elektronik-Komponenten-Montageplatte
DE4026972A1 (de) Loetverbinder und verfahren zur herstellung einer elektrischen schaltung mit diesem loetverbinder
DE3627372C2 (OSRAM)
DE2124887B2 (de) Elektrisches Bauelement, vorzugsweise Halbleiterbauelement, mit Folienkontaktierung
DE102014102899A1 (de) Leistungshalbleiter-Zusammenbau und -Modul
DE3932213A1 (de) Verbundanordnung mit leiterplatte
DE102006003137A1 (de) Elektronikpackung und Packungsverfahren
DE3930858C2 (de) Modulaufbau
DE69609921T2 (de) Herstellungsverfahren einer halbleiteranordnung geeignet zur oberflächenmontage
DE3545527A1 (de) Flexible elektrische verbindungsvorrichtung und verfahren zu ihrer herstellung
DE9012638U1 (de) Im Spritzgußverfahren hergestellte Leiterplatte
WO2016146613A1 (de) Elektronische steuervorrichtung
DE2508702A1 (de) Elektrisches bauelement fuer den einsatz in schichtschaltungen
DE4021872C2 (de) Hochintegriertes elektronisches Bauteil
DE112011103520B4 (de) Bonden und elektrisches Koppeln von Komponenten
DE102016101757A1 (de) Schaltungsmodul mit oberflächenmontierbaren unterlagsblöcken zum anschliessen einer leiterplatte

Legal Events

Date Code Title Description
C3 Grant after two publication steps (3rd publication)
8339 Ceased/non-payment of the annual fee