DE2122887A1 - Halbleiteranordnung, insbesondere Thyristor-Stromrichter, mit Kühleinrichtung. - Google Patents

Halbleiteranordnung, insbesondere Thyristor-Stromrichter, mit Kühleinrichtung.

Info

Publication number
DE2122887A1
DE2122887A1 DE19712122887 DE2122887A DE2122887A1 DE 2122887 A1 DE2122887 A1 DE 2122887A1 DE 19712122887 DE19712122887 DE 19712122887 DE 2122887 A DE2122887 A DE 2122887A DE 2122887 A1 DE2122887 A1 DE 2122887A1
Authority
DE
Germany
Prior art keywords
heat sink
arrangement according
lined
cooling
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19712122887
Other languages
German (de)
English (en)
Inventor
Erwin 8520 Erlangen Weidemann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Priority to DE19712122887 priority Critical patent/DE2122887A1/de
Priority to JP4456072A priority patent/JPS4745277A/ja
Publication of DE2122887A1 publication Critical patent/DE2122887A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Details Of Measuring And Other Instruments (AREA)
  • Rectifiers (AREA)
DE19712122887 1971-05-08 1971-05-08 Halbleiteranordnung, insbesondere Thyristor-Stromrichter, mit Kühleinrichtung. Pending DE2122887A1 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE19712122887 DE2122887A1 (de) 1971-05-08 1971-05-08 Halbleiteranordnung, insbesondere Thyristor-Stromrichter, mit Kühleinrichtung.
JP4456072A JPS4745277A (enrdf_load_stackoverflow) 1971-05-08 1972-05-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19712122887 DE2122887A1 (de) 1971-05-08 1971-05-08 Halbleiteranordnung, insbesondere Thyristor-Stromrichter, mit Kühleinrichtung.

Publications (1)

Publication Number Publication Date
DE2122887A1 true DE2122887A1 (de) 1972-11-23

Family

ID=5807308

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19712122887 Pending DE2122887A1 (de) 1971-05-08 1971-05-08 Halbleiteranordnung, insbesondere Thyristor-Stromrichter, mit Kühleinrichtung.

Country Status (2)

Country Link
JP (1) JPS4745277A (enrdf_load_stackoverflow)
DE (1) DE2122887A1 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002016851A3 (en) * 2000-08-22 2002-05-02 Metalspray Internat Lc A cooling system

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57636Y2 (enrdf_load_stackoverflow) * 1973-12-18 1982-01-06
JPS5235831A (en) * 1975-09-16 1977-03-18 Sansha Electric Mfg Co Ltd Electric appliance with cooling device
JPS5246776A (en) * 1975-10-09 1977-04-13 Mitsubishi Electric Corp Semiconductor device
JPS537617U (enrdf_load_stackoverflow) * 1976-07-05 1978-01-23
JPS545660A (en) * 1977-06-15 1979-01-17 Mitsubishi Electric Corp Cooling device for semiconductor device
JPS5722449Y2 (enrdf_load_stackoverflow) * 1977-12-28 1982-05-15
JPS5841778B2 (ja) * 1978-09-04 1983-09-14 富士通株式会社 大規模半導体装置用コ−ルドプレ−ト
JPS56149463U (enrdf_load_stackoverflow) * 1981-03-12 1981-11-10

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002016851A3 (en) * 2000-08-22 2002-05-02 Metalspray Internat Lc A cooling system

Also Published As

Publication number Publication date
JPS4745277A (enrdf_load_stackoverflow) 1972-12-25

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