DE1564694C3 - - Google Patents

Info

Publication number
DE1564694C3
DE1564694C3 DE19661564694 DE1564694A DE1564694C3 DE 1564694 C3 DE1564694 C3 DE 1564694C3 DE 19661564694 DE19661564694 DE 19661564694 DE 1564694 A DE1564694 A DE 1564694A DE 1564694 C3 DE1564694 C3 DE 1564694C3
Authority
DE
Germany
Prior art keywords
heat sinks
semiconductor cells
heat sink
semiconductor
parallel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE19661564694
Other languages
German (de)
English (en)
Other versions
DE1564694B2 (de
DE1564694A1 (de
Inventor
Werner Dipl.-Ing. Wettingen Faust (Schweiz)
Paul Dr.Rer.Nat. Fries
Manfred Dipl.-Ing. Hoffmann
Karl-Friedrich Dipl.-Ing. Leowald
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC Brown Boveri AG Switzerland
Siemens AG
Original Assignee
Brown Boveri und Cie AG Switzerland
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Brown Boveri und Cie AG Switzerland, Siemens AG filed Critical Brown Boveri und Cie AG Switzerland
Publication of DE1564694A1 publication Critical patent/DE1564694A1/de
Publication of DE1564694B2 publication Critical patent/DE1564694B2/de
Application granted granted Critical
Publication of DE1564694C3 publication Critical patent/DE1564694C3/de
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/10Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D
    • H01L25/117Stacked arrangements of devices
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/02Conversion of AC power input into DC power output without possibility of reversal
    • H02M7/04Conversion of AC power input into DC power output without possibility of reversal by static converters
    • H02M7/12Conversion of AC power input into DC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M7/145Conversion of AC power input into DC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a thyratron or thyristor type requiring extinguishing means
    • H02M7/155Conversion of AC power input into DC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a thyratron or thyristor type requiring extinguishing means using semiconductor devices only
    • H02M7/19Conversion of AC power input into DC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a thyratron or thyristor type requiring extinguishing means using semiconductor devices only arranged for operation in series, e.g. for voltage multiplication
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Rectifiers (AREA)
DE19661564694 1966-08-27 1966-08-27 Gleichrichteranordnung für hohe Spannung Granted DE1564694B2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES0105562 1966-08-27

Publications (3)

Publication Number Publication Date
DE1564694A1 DE1564694A1 (de) 1970-02-12
DE1564694B2 DE1564694B2 (de) 1974-08-08
DE1564694C3 true DE1564694C3 (enrdf_load_stackoverflow) 1975-03-27

Family

ID=7526680

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19661564694 Granted DE1564694B2 (de) 1966-08-27 1966-08-27 Gleichrichteranordnung für hohe Spannung

Country Status (1)

Country Link
DE (1) DE1564694B2 (enrdf_load_stackoverflow)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2643072C2 (de) * 1976-09-24 1982-06-03 Siemens AG, 1000 Berlin und 8000 München Kühldose für Thyristoren
CH629913A5 (de) * 1977-07-12 1982-05-14 Asea Ab Fluessigkeitsgekuehltes thyristorventil.
FR2451632A1 (fr) * 1979-03-12 1980-10-10 Alsthom Atlantique Montage de semi-conducteurs de puissance refroidis par un flugene
DE3007168C2 (de) * 1980-02-26 1984-11-22 Siemens AG, 1000 Berlin und 8000 München Flüssigkeitsgekühlte Halbleitersäule
CH651994A5 (de) * 1981-03-10 1985-10-15 Injecta Ag Fluessigkeitsgekuehlte elektrische baugruppe sowie verfahren zu deren herstellung.
DE3238516C2 (de) * 1982-10-18 1986-07-10 Siemens AG, 1000 Berlin und 8000 München Flüssigkeitsgekühlter Thyristorbaustein
DE3307703A1 (de) * 1983-03-04 1984-09-06 BBC Aktiengesellschaft Brown, Boveri & Cie., Baden, Aargau Dosen-siedekuehleinrichtung fuer leistungshalbleiterelemente
US4631573A (en) * 1985-05-24 1986-12-23 Sundstrand Corporation Cooled stack of electrically isolated semiconductors
US5043797A (en) * 1990-04-03 1991-08-27 General Electric Company Cooling header connection for a thyristor stack
JPH0637219A (ja) * 1992-07-16 1994-02-10 Fuji Electric Co Ltd パワー半導体装置の冷却装置
DE4420564C2 (de) * 1994-06-13 1999-10-14 Abb Patent Gmbh Spannverband eines Stromrichters zur Flüssigkeitskühlung elektrischer Bauelemente
FR2751132A1 (fr) * 1996-07-09 1998-01-16 Gec Alsthom Transport Sa Plaque a fluide de refroidissement et dispositif a semi-conducteurs de puissance comportant une telle plaque
RU2393619C1 (ru) * 2008-11-24 2010-06-27 Государственное образовательное учреждение высшего профессионального образования Новосибирский государственный технический университет Многоуровневый автономный инвертор напряжения
RU2411629C1 (ru) * 2009-10-19 2011-02-10 Открытое акционерное общество "Всероссийский научно-исследовательский проектно-конструкторский и технологический институт релестроения с опытным производством" Многоуровневый транзисторный преобразователь частоты для управления электродвигателем переменного тока
EP2704190A1 (en) 2012-09-03 2014-03-05 ABB Technology AG Modular cooling system

Also Published As

Publication number Publication date
DE1564694B2 (de) 1974-08-08
DE1564694A1 (de) 1970-02-12

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Legal Events

Date Code Title Description
C3 Grant after two publication steps (3rd publication)
E77 Valid patent as to the heymanns-index 1977