DE2107319A1 - Halbleiteranordnung - Google Patents

Halbleiteranordnung

Info

Publication number
DE2107319A1
DE2107319A1 DE19712107319 DE2107319A DE2107319A1 DE 2107319 A1 DE2107319 A1 DE 2107319A1 DE 19712107319 DE19712107319 DE 19712107319 DE 2107319 A DE2107319 A DE 2107319A DE 2107319 A1 DE2107319 A1 DE 2107319A1
Authority
DE
Germany
Prior art keywords
heat
semiconductor element
semiconductor
arrangement according
heat exchanger
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19712107319
Other languages
German (de)
English (en)
Inventor
Gunnar Bylund Per Aake Vasteraas Mellgren (Schweden) P HOIl 7-44
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ABB Norden Holding AB
Original Assignee
ASEA AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASEA AB filed Critical ASEA AB
Publication of DE2107319A1 publication Critical patent/DE2107319A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE19712107319 1970-02-24 1971-02-16 Halbleiteranordnung Pending DE2107319A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE02336/70A SE354943B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1970-02-24 1970-02-24

Publications (1)

Publication Number Publication Date
DE2107319A1 true DE2107319A1 (de) 1971-09-09

Family

ID=20259779

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19712107319 Pending DE2107319A1 (de) 1970-02-24 1971-02-16 Halbleiteranordnung

Country Status (6)

Country Link
US (1) US3739234A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CA (1) CA926519A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE2107319A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
NO (1) NO129650B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
RO (1) RO56432A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
SE (1) SE354943B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE382282B (sv) * 1971-02-13 1976-01-19 Bbc Brown Boveri & Cie For minst en halvledarskivcell avsett tryckfeste med kylanordning, innefattande vermeror med inre kapillerstruktur.
DE2204589A1 (de) * 1972-02-01 1973-08-16 Siemens Ag Kuehlanordnung fuer flache halbleiterbauelemente
US4012770A (en) * 1972-09-28 1977-03-15 Dynatherm Corporation Cooling a heat-producing electrical or electronic component
US4036286A (en) * 1972-11-02 1977-07-19 Mcdonnell Douglas Corporation Permafrost stabilizing heat pipe assembly
US3989095A (en) * 1972-12-28 1976-11-02 Ckd Praha, Oborovy Podnik Semi conductor cooling system
CS159563B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1972-12-28 1975-01-31
US3852804A (en) * 1973-05-02 1974-12-03 Gen Electric Double-sided heat-pipe cooled power semiconductor device assembly
US3852806A (en) * 1973-05-02 1974-12-03 Gen Electric Nonwicked heat-pipe cooled power semiconductor device assembly having enhanced evaporated surface heat pipes
US3852805A (en) * 1973-06-18 1974-12-03 Gen Electric Heat-pipe cooled power semiconductor device assembly having integral semiconductor device evaporating surface unit
US3852803A (en) * 1973-06-18 1974-12-03 Gen Electric Heat sink cooled power semiconductor device assembly having liquid metal interface
US3826957A (en) * 1973-07-02 1974-07-30 Gen Electric Double-sided heat-pipe cooled power semiconductor device assembly using compression rods
CA1007875A (en) * 1974-04-22 1977-04-05 Mcdonnell Douglas Corporation Permafrost stabilizing heat pipe assembly
DE2638909A1 (de) * 1976-08-28 1978-03-02 Semikron Gleichrichterbau Halbleiteranordnung
US4145708A (en) * 1977-06-13 1979-03-20 General Electric Company Power module with isolated substrates cooled by integral heat-energy-removal means
US5229915A (en) * 1990-02-07 1993-07-20 Ngk Insulators, Ltd. Power semiconductor device with heat dissipating property
JPH0714029B2 (ja) * 1990-02-07 1995-02-15 日本碍子株式会社 電力用半導体素子
JP3067399B2 (ja) * 1992-07-03 2000-07-17 株式会社日立製作所 半導体冷却装置
US5405808A (en) * 1993-08-16 1995-04-11 Lsi Logic Corporation Fluid-filled and gas-filled semiconductor packages
JPH11121667A (ja) * 1997-10-20 1999-04-30 Fujitsu Ltd ヒートパイプ式冷却装置
US6044899A (en) * 1998-04-27 2000-04-04 Hewlett-Packard Company Low EMI emissions heat sink device
US6226178B1 (en) 1999-10-12 2001-05-01 Dell Usa, L.P. Apparatus for cooling a heat generating component in a computer
US6394175B1 (en) * 2000-01-13 2002-05-28 Lucent Technologies Inc. Top mounted cooling device using heat pipes
TW572246U (en) * 2001-07-26 2004-01-11 Jiun-Fu Liou Heat dissipating module with a self rapid heat conduction
US7124806B1 (en) 2001-12-10 2006-10-24 Ncr Corp. Heat sink for enhanced heat dissipation
US6732786B1 (en) * 2002-10-29 2004-05-11 Taiwan Trigem Information Co., Ltd. Edge-mounted heat dissipation device having top-and-bottom fan structure
CN2811736Y (zh) * 2005-03-31 2006-08-30 新灯源科技有限公司 具高散热效率的高功率发光二极管照明设备
US7922361B2 (en) * 2005-08-19 2011-04-12 Neobulb Technologies, Inc. Light-emitting diode illuminating equipment with high power and high heat dissipation efficiency
US7494249B2 (en) * 2006-07-05 2009-02-24 Jaffe Limited Multiple-set heat-dissipating structure for LED lamp
US7494248B2 (en) * 2006-07-05 2009-02-24 Jaffe Limited Heat-dissipating structure for LED lamp
US7740380B2 (en) * 2008-10-29 2010-06-22 Thrailkill John E Solid state lighting apparatus utilizing axial thermal dissipation
JP5489911B2 (ja) * 2010-08-18 2014-05-14 三菱電機株式会社 半導体パワーモジュール
CN106716582A (zh) * 2014-10-14 2017-05-24 矢崎总业株式会社 维修插头

Also Published As

Publication number Publication date
RO56432A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1974-07-01
CA926519A (en) 1973-05-15
SE354943B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1973-03-26
NO129650B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1974-05-06
US3739234A (en) 1973-06-12

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