DE2060264A1 - Haltevorrichtung fuer Halbleiterplaettechen und Verfahren zum Verbinden der Haltevorrichtung mit dem Halbleiterplaettchen - Google Patents
Haltevorrichtung fuer Halbleiterplaettechen und Verfahren zum Verbinden der Haltevorrichtung mit dem HalbleiterplaettchenInfo
- Publication number
- DE2060264A1 DE2060264A1 DE19702060264 DE2060264A DE2060264A1 DE 2060264 A1 DE2060264 A1 DE 2060264A1 DE 19702060264 DE19702060264 DE 19702060264 DE 2060264 A DE2060264 A DE 2060264A DE 2060264 A1 DE2060264 A1 DE 2060264A1
- Authority
- DE
- Germany
- Prior art keywords
- holding device
- semiconductor wafer
- binder
- semiconductor
- carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/013—Manufacture or treatment of die-attach connectors
- H10W72/01365—Thermally treating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07311—Treating the bonding area before connecting, e.g. by applying flux or cleaning
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07331—Connecting techniques
- H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S228/00—Metal fusion bonding
- Y10S228/903—Metal to nonmetal
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US88911269A | 1969-12-30 | 1969-12-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE2060264A1 true DE2060264A1 (de) | 1971-07-01 |
Family
ID=25394526
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19702060264 Pending DE2060264A1 (de) | 1969-12-30 | 1970-12-08 | Haltevorrichtung fuer Halbleiterplaettechen und Verfahren zum Verbinden der Haltevorrichtung mit dem Halbleiterplaettchen |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3677853A (https=) |
| JP (1) | JPS4817739B1 (https=) |
| DE (1) | DE2060264A1 (https=) |
| FR (1) | FR2072110B1 (https=) |
| GB (1) | GB1267320A (https=) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49142843U (https=) * | 1973-04-04 | 1974-12-10 | ||
| JPS5029634U (https=) * | 1973-07-11 | 1975-04-03 | ||
| JPS5039241U (https=) * | 1973-08-08 | 1975-04-22 | ||
| US3916506A (en) * | 1973-10-18 | 1975-11-04 | Mallory Composites | Method of conforming a flexible self-supporting means to the surface contour of a substrate |
| JPS5086444U (https=) * | 1973-12-12 | 1975-07-23 | ||
| JPS5121249A (ja) * | 1974-08-13 | 1976-02-20 | Daikin Ind Ltd | Paneruhiita |
| JPS5121248A (ja) * | 1974-08-13 | 1976-02-20 | Daikin Ind Ltd | Paneruhiita |
| US4177098A (en) * | 1976-02-10 | 1979-12-04 | Usm Corporation | Method for stiffening flexible workpieces |
| GB8410341D0 (en) * | 1984-04-19 | 1984-05-31 | Coopervision Optics | Blocking machines |
| JP3537688B2 (ja) * | 1998-11-24 | 2004-06-14 | 富士通株式会社 | 磁気ヘッドの加工方法 |
| US8808870B2 (en) | 2011-11-28 | 2014-08-19 | Kennametal Inc. | Functionally graded coating |
| US9862029B2 (en) | 2013-03-15 | 2018-01-09 | Kennametal Inc | Methods of making metal matrix composite and alloy articles |
| US9346101B2 (en) | 2013-03-15 | 2016-05-24 | Kennametal Inc. | Cladded articles and methods of making the same |
| US10221702B2 (en) | 2015-02-23 | 2019-03-05 | Kennametal Inc. | Imparting high-temperature wear resistance to turbine blade Z-notches |
| US11117208B2 (en) | 2017-03-21 | 2021-09-14 | Kennametal Inc. | Imparting wear resistance to superalloy articles |
-
1969
- 1969-12-30 US US889112A patent/US3677853A/en not_active Expired - Lifetime
-
1970
- 1970-11-24 GB GB55762/70A patent/GB1267320A/en not_active Expired
- 1970-11-26 FR FR7043235A patent/FR2072110B1/fr not_active Expired
- 1970-12-03 JP JP45106399A patent/JPS4817739B1/ja active Pending
- 1970-12-08 DE DE19702060264 patent/DE2060264A1/de active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| GB1267320A (en) | 1972-03-15 |
| FR2072110B1 (https=) | 1974-03-22 |
| JPS4817739B1 (https=) | 1973-05-31 |
| US3677853A (en) | 1972-07-18 |
| FR2072110A1 (https=) | 1971-09-24 |
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