GB1267320A - Wafer mounting - Google Patents

Wafer mounting

Info

Publication number
GB1267320A
GB1267320A GB55762/70A GB5576270A GB1267320A GB 1267320 A GB1267320 A GB 1267320A GB 55762/70 A GB55762/70 A GB 55762/70A GB 5576270 A GB5576270 A GB 5576270A GB 1267320 A GB1267320 A GB 1267320A
Authority
GB
United Kingdom
Prior art keywords
wafer
support
bonding agent
bonding
highest point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB55762/70A
Other languages
English (en)
Inventor
Thomas Anthony Anzelone Jr
Harold Albert Larson
Alfred Alois Stricker
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of GB1267320A publication Critical patent/GB1267320A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01365—Thermally treating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07311—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S228/00—Metal fusion bonding
    • Y10S228/903—Metal to nonmetal

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
GB55762/70A 1969-12-30 1970-11-24 Wafer mounting Expired GB1267320A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US88911269A 1969-12-30 1969-12-30

Publications (1)

Publication Number Publication Date
GB1267320A true GB1267320A (en) 1972-03-15

Family

ID=25394526

Family Applications (1)

Application Number Title Priority Date Filing Date
GB55762/70A Expired GB1267320A (en) 1969-12-30 1970-11-24 Wafer mounting

Country Status (5)

Country Link
US (1) US3677853A (https=)
JP (1) JPS4817739B1 (https=)
DE (1) DE2060264A1 (https=)
FR (1) FR2072110B1 (https=)
GB (1) GB1267320A (https=)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49142843U (https=) * 1973-04-04 1974-12-10
JPS5029634U (https=) * 1973-07-11 1975-04-03
JPS5039241U (https=) * 1973-08-08 1975-04-22
US3916506A (en) * 1973-10-18 1975-11-04 Mallory Composites Method of conforming a flexible self-supporting means to the surface contour of a substrate
JPS5086444U (https=) * 1973-12-12 1975-07-23
JPS5121249A (ja) * 1974-08-13 1976-02-20 Daikin Ind Ltd Paneruhiita
JPS5121248A (ja) * 1974-08-13 1976-02-20 Daikin Ind Ltd Paneruhiita
US4177098A (en) * 1976-02-10 1979-12-04 Usm Corporation Method for stiffening flexible workpieces
GB8410341D0 (en) * 1984-04-19 1984-05-31 Coopervision Optics Blocking machines
JP3537688B2 (ja) * 1998-11-24 2004-06-14 富士通株式会社 磁気ヘッドの加工方法
US8808870B2 (en) 2011-11-28 2014-08-19 Kennametal Inc. Functionally graded coating
US9862029B2 (en) 2013-03-15 2018-01-09 Kennametal Inc Methods of making metal matrix composite and alloy articles
US9346101B2 (en) 2013-03-15 2016-05-24 Kennametal Inc. Cladded articles and methods of making the same
US10221702B2 (en) 2015-02-23 2019-03-05 Kennametal Inc. Imparting high-temperature wear resistance to turbine blade Z-notches
US11117208B2 (en) 2017-03-21 2021-09-14 Kennametal Inc. Imparting wear resistance to superalloy articles

Also Published As

Publication number Publication date
FR2072110B1 (https=) 1974-03-22
JPS4817739B1 (https=) 1973-05-31
DE2060264A1 (de) 1971-07-01
US3677853A (en) 1972-07-18
FR2072110A1 (https=) 1971-09-24

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