DE20311052U1 - Luftführung für eine Wärmesenke - Google Patents

Luftführung für eine Wärmesenke Download PDF

Info

Publication number
DE20311052U1
DE20311052U1 DE20311052U DE20311052U DE20311052U1 DE 20311052 U1 DE20311052 U1 DE 20311052U1 DE 20311052 U DE20311052 U DE 20311052U DE 20311052 U DE20311052 U DE 20311052U DE 20311052 U1 DE20311052 U1 DE 20311052U1
Authority
DE
Germany
Prior art keywords
heat sink
air duct
air
comb
outlet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE20311052U
Other languages
German (de)
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LIN HAI CHING
Lin Hai-Ching Dann Shoei Cheng
Original Assignee
LIN HAI CHING
Lin Hai-Ching Dann Shoei Cheng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LIN HAI CHING, Lin Hai-Ching Dann Shoei Cheng filed Critical LIN HAI CHING
Publication of DE20311052U1 publication Critical patent/DE20311052U1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE20311052U 2002-07-19 2003-07-17 Luftführung für eine Wärmesenke Expired - Lifetime DE20311052U1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW091211096 2002-07-19
TW091211096U TW527099U (en) 2002-07-19 2002-07-19 Heat dissipation plate having gained heat dissipation efficiency

Publications (1)

Publication Number Publication Date
DE20311052U1 true DE20311052U1 (de) 2003-12-04

Family

ID=28451985

Family Applications (1)

Application Number Title Priority Date Filing Date
DE20311052U Expired - Lifetime DE20311052U1 (de) 2002-07-19 2003-07-17 Luftführung für eine Wärmesenke

Country Status (4)

Country Link
US (1) US20040031589A1 (ja)
JP (1) JP3099275U (ja)
DE (1) DE20311052U1 (ja)
TW (1) TW527099U (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM248226U (en) * 2003-10-17 2004-10-21 Hon Hai Prec Ind Co Ltd Heat dissipating device
US7159649B2 (en) * 2004-03-11 2007-01-09 Thermal Corp. Air-to-air heat exchanger
US7038911B2 (en) * 2004-06-30 2006-05-02 International Business Machines Corporation Push-pull dual fan fansink
CN2752958Y (zh) * 2004-09-03 2006-01-18 东莞莫仕连接器有限公司 带导流结构的散热装置
US20060102319A1 (en) * 2004-11-16 2006-05-18 Asia Vital Component Co., Ltd. Heat dissipation enhancing device
TWI264271B (en) * 2005-05-13 2006-10-11 Delta Electronics Inc Heat sink
TWI289648B (en) * 2005-07-07 2007-11-11 Ama Precision Inc Heat sink structure
TWI308050B (en) * 2006-02-14 2009-03-21 Asustek Comp Inc Heat-sink with slant fins
TWM336475U (en) * 2008-03-03 2008-07-11 Tai Sol Electronics Co Ltd Heat dissipater with internal flow guiding function
TWM380512U (en) * 2009-10-29 2010-05-11 Wistron Corp Heat sink and heat-dissipation fins thereof
CN104602469B (zh) * 2015-01-15 2017-09-26 华为技术有限公司 机柜
EP4113049B1 (en) * 2021-06-29 2024-09-04 ABB Schweiz AG Heat exchanger, cooled device assembly comprising the heat exchanger, and method for manufacturing the heat exchanger

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH062314Y2 (ja) * 1989-08-30 1994-01-19 ナカミチ株式会社 放熱装置
US5158136A (en) * 1991-11-12 1992-10-27 At&T Laboratories Pin fin heat sink including flow enhancement
US5375655A (en) * 1993-03-31 1994-12-27 Lee; Yong N. Heat sink apparatus
TW307837B (ja) * 1995-05-30 1997-06-11 Fujikura Kk
US5734552A (en) * 1996-06-21 1998-03-31 Sun Microsystems, Inc. Airfoil deflector for cooling components
US5957194A (en) * 1996-06-27 1999-09-28 Advanced Thermal Solutions, Inc. Plate fin heat exchanger having fluid control means
US6110306A (en) * 1999-11-18 2000-08-29 The United States Of America As Represented By The Secretary Of The Navy Complexed liquid fuel compositions
US20020109970A1 (en) * 2000-12-18 2002-08-15 Samsung Electro-Mechanics Co., Ltd. Heat sink for cooling electronic chip
JP2002368468A (ja) * 2001-06-07 2002-12-20 Matsushita Electric Ind Co Ltd ヒートシンクとその製造方法およびそれを用いた冷却装置
TW529737U (en) * 2001-06-20 2003-04-21 Foxconn Prec Components Co Ltd Heat sink apparatus
US6637502B1 (en) * 2002-04-16 2003-10-28 Thermal Corp. Heat sink with converging device

Also Published As

Publication number Publication date
JP3099275U (ja) 2004-04-02
US20040031589A1 (en) 2004-02-19
TW527099U (en) 2003-04-01

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Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 20040115

R156 Lapse of ip right after 3 years

Effective date: 20070201