DE20302356U1 - Metallträger (Leadframe) zur Kontaktierung elektrischer oder optoelektrischer Bauelemente - Google Patents

Metallträger (Leadframe) zur Kontaktierung elektrischer oder optoelektrischer Bauelemente

Info

Publication number
DE20302356U1
DE20302356U1 DE20302356U DE20302356U DE20302356U1 DE 20302356 U1 DE20302356 U1 DE 20302356U1 DE 20302356 U DE20302356 U DE 20302356U DE 20302356 U DE20302356 U DE 20302356U DE 20302356 U1 DE20302356 U1 DE 20302356U1
Authority
DE
Germany
Prior art keywords
metal carrier
carrier according
web
conductive structure
contacting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE20302356U
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Priority to DE20302356U priority Critical patent/DE20302356U1/de
Publication of DE20302356U1 publication Critical patent/DE20302356U1/de
Priority to US10/773,975 priority patent/US20040195663A1/en
Priority to JP2004000468U priority patent/JP3103230U/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49558—Insulating layers on lead frames, e.g. bridging members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05599—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/85399—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Description

Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt

Claims (8)

1. Metallträger (Leadframe) zur Kontaktierung elektrischer oder optoelektronischer Bauelemente mit einer Vielzahl von Kontaktbeinchen, die jeweils mit einem Ende eines Bonddrahts zur Kontaktierung eines Bauelements verbindbar sind, gekennzeichnet durch mindestens eine elektrisch nichtleitende Struktur (61, 62, 63), die mindestens zwei Kontaktbeinchen (11, 12, 13, 14) mechanisch miteinander verbindet.
2. Metallträger nach Anspruch 1, dadurch gekennzeichnet, dass die nichtleitende Struktur (61, 62, 63) aus einem spritzfähigen Kunststoffmaterial besteht, mit dem mindestens zwei Kontaktbeinchen (11, 12, 13, 14) umspritzt sind.
3. Metallträger nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass die nichtleitende Struktur in Form mindestens eines Steges (61, 62, 63) ausgebildet ist, der jeweils mindestens zwei Kontaktbeinchen (11, 12, 13, 14) miteinander verbindet.
4. Metallträger nach Anspruch 3, dadurch gekennzeichnet, dass der Steg (61, 62, 63) im wesentlichen senkrecht zur Längsrichtung der Kontaktbeinchen (11, 12, 13, 14) verläuft.
5. Metallträger nach mindestens einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass die Bondbereiche (3) der Kontaktbeinchen (11, 12, 13, 14) zumindest in der Mehrzahl im Bereich der Enden (A) der Kontaktbeinchen angeordnet sind, die benachbart einem zu kontaktierenden Bauelement liegen.
6. Metallträger nach mindestens einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass mehrere stegförmige Strukturen (61. 62, 63) nebeneinander und/oder parallel zueinander und oder versetzt zueinander vorhanden sind.
7. Metallträger nach Anspruch 6, dadurch gekennzeichnet, dass die stegförmigen Strukturen (61, 62, 63) eine unterschiedliche Länge aufweisen.
8. Metallträger nach mindestens einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass die thermische Ausdehnung der nichtleitenden Struktur (61, 62, 63) an die thermische Ausdehnung einer Vergußmasse angepasst ist, mit der der Metallträger (1) und das Bauelement nach fertiger Montage vergossen wird.
DE20302356U 2003-02-07 2003-02-07 Metallträger (Leadframe) zur Kontaktierung elektrischer oder optoelektrischer Bauelemente Expired - Lifetime DE20302356U1 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE20302356U DE20302356U1 (de) 2003-02-07 2003-02-07 Metallträger (Leadframe) zur Kontaktierung elektrischer oder optoelektrischer Bauelemente
US10/773,975 US20040195663A1 (en) 2003-02-07 2004-02-06 Metal support (leadframe) for the bonding of electrical or optoelectronic components
JP2004000468U JP3103230U (ja) 2003-02-07 2004-02-06 電気部品または光電子部品のボンディング用金属支持体（リードフレーム）

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE20302356U DE20302356U1 (de) 2003-02-07 2003-02-07 Metallträger (Leadframe) zur Kontaktierung elektrischer oder optoelektrischer Bauelemente

Publications (1)

Publication Number Publication Date
DE20302356U1 true DE20302356U1 (de) 2003-04-30

Family

ID=7980030

Family Applications (1)

Application Number Title Priority Date Filing Date
DE20302356U Expired - Lifetime DE20302356U1 (de) 2003-02-07 2003-02-07 Metallträger (Leadframe) zur Kontaktierung elektrischer oder optoelektrischer Bauelemente

Country Status (3)

Country Link
US (1) US20040195663A1 (de)
JP (1) JP3103230U (de)
DE (1) DE20302356U1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2290281A2 (de) 2009-08-25 2011-03-02 odelo GmbH Leuchtmittel sowie Leuchte

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3581339B2 (ja) * 2001-08-02 2004-10-27 メルク株式会社 高耐腐食性薄片状金属顔料、その製造方法、およびそれをベースとする金属光沢干渉発色顔料

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03136267A (ja) * 1989-10-20 1991-06-11 Texas Instr Japan Ltd 半導体装置及びその製造方法
EP1128405A1 (de) * 2000-02-21 2001-08-29 Cherry GmbH Mikroschalterbaueinheit

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2290281A2 (de) 2009-08-25 2011-03-02 odelo GmbH Leuchtmittel sowie Leuchte
DE102009038523A1 (de) 2009-08-25 2011-03-10 Odelo Gmbh Leuchtmittel sowie Leuchte

Also Published As

Publication number Publication date
JP3103230U (ja) 2004-07-29
US20040195663A1 (en) 2004-10-07

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Legal Events

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Effective date: 20030605

R150 Utility model maintained after payment of first maintenance fee after three years

Effective date: 20060502

R151 Utility model maintained after payment of second maintenance fee after six years

Effective date: 20090504

R158 Lapse of ip right after 8 years

Effective date: 20110901