DE2028910C3 - Einrichtung zum Sortieren von elektrischen Schaltungselementen - Google Patents
Einrichtung zum Sortieren von elektrischen SchaltungselementenInfo
- Publication number
- DE2028910C3 DE2028910C3 DE2028910A DE2028910A DE2028910C3 DE 2028910 C3 DE2028910 C3 DE 2028910C3 DE 2028910 A DE2028910 A DE 2028910A DE 2028910 A DE2028910 A DE 2028910A DE 2028910 C3 DE2028910 C3 DE 2028910C3
- Authority
- DE
- Germany
- Prior art keywords
- chips
- test
- elements
- chip
- individual
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0611—Sorting devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/344—Sorting according to other particular properties according to electric or electromagnetic properties
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S209/00—Classifying, separating, and assorting solids
- Y10S209/936—Plural items tested as group
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US83759569A | 1969-06-30 | 1969-06-30 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| DE2028910A1 DE2028910A1 (de) | 1971-01-07 |
| DE2028910B2 DE2028910B2 (de) | 1979-01-11 |
| DE2028910C3 true DE2028910C3 (de) | 1979-09-06 |
Family
ID=25274909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE2028910A Expired DE2028910C3 (de) | 1969-06-30 | 1970-06-12 | Einrichtung zum Sortieren von elektrischen Schaltungselementen |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3584741A (https=) |
| JP (1) | JPS4827501B1 (https=) |
| DE (1) | DE2028910C3 (https=) |
| FR (1) | FR2052380A5 (https=) |
| GB (1) | GB1305593A (https=) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS539508B2 (https=) * | 1971-06-25 | 1978-04-06 | ||
| US3811182A (en) * | 1972-03-31 | 1974-05-21 | Ibm | Object handling fixture, system, and process |
| US3915784A (en) * | 1972-04-26 | 1975-10-28 | Ibm | Method of semiconductor chip separation |
| US3762426A (en) * | 1972-04-26 | 1973-10-02 | Ibm | Semiconductor chip separation apparatus |
| US3847284A (en) * | 1973-05-11 | 1974-11-12 | Teledyne Inc | Magnetic tape die sorting system |
| US3915850A (en) * | 1973-11-14 | 1975-10-28 | Gti Corp | Component handler and method and apparatus utilizing same |
| US3894633A (en) * | 1974-10-24 | 1975-07-15 | Western Electric Co | Method and apparatus for sorting articles |
| CA1044379A (en) * | 1974-12-28 | 1978-12-12 | Sony Corporation | Wafer transfer device |
| US4406373A (en) * | 1981-08-03 | 1983-09-27 | Palomar Systems & Machines, Inc. | Means and method for testing and sorting miniature electronic units |
| JPS59110758U (ja) * | 1983-01-18 | 1984-07-26 | 大谷 均 | ダブルタイヤの石取器 |
| EP0468153B1 (de) * | 1990-07-25 | 1995-10-11 | atg test systems GmbH | Kontaktierungsvorrichtung für Prüfzwecke |
| US6078188A (en) * | 1995-09-04 | 2000-06-20 | Advantest Corporation | Semiconductor device transporting and handling apparatus |
| US6024526A (en) * | 1995-10-20 | 2000-02-15 | Aesop, Inc. | Integrated prober, handler and tester for semiconductor components |
| US6246251B1 (en) * | 1998-04-24 | 2001-06-12 | International Rectifier Corp. | Test process and apparatus for testing singulated semiconductor die |
| US6505665B1 (en) * | 1998-09-17 | 2003-01-14 | Intermedics, Inc. | Method and apparatus for use in assembling electronic devices |
| US6222145B1 (en) | 1998-10-29 | 2001-04-24 | International Business Machines Corporation | Mechanical strength die sorting |
| US6521853B1 (en) * | 2000-05-08 | 2003-02-18 | Micro Component Technology, Inc. | Method and apparatus for sorting semiconductor devices |
| US6570374B1 (en) * | 2000-06-23 | 2003-05-27 | Honeywell International Inc. | Vacuum chuck with integrated electrical testing points |
| US7851721B2 (en) * | 2009-02-17 | 2010-12-14 | Asm Assembly Automation Ltd | Electronic device sorter comprising dual buffers |
| CN103708713A (zh) * | 2013-12-26 | 2014-04-09 | 深圳市华星光电技术有限公司 | 夹持机构、液晶面板切割机以及液晶面板切割工艺 |
| US10173246B1 (en) * | 2018-05-30 | 2019-01-08 | Nanotronics Imaging, Inc. | Systems, apparatus, and methods for sorting components using illumination |
| CN109454023A (zh) * | 2018-12-21 | 2019-03-12 | 义乌臻格科技有限公司 | 一种用于拾取微型芯片的吸嘴装置及分选装置 |
| CN113426682B (zh) * | 2021-06-04 | 2023-06-30 | 江苏暖阳半导体科技有限公司 | 一种MiniLED的检测分选工艺 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1153008A (en) * | 1965-09-18 | 1969-05-21 | Telefunken Patent | Method of and apparatus for Measuring and Sorting the Individual Elements in a Semiconductor Wafer |
-
1969
- 1969-06-30 US US837595A patent/US3584741A/en not_active Expired - Lifetime
-
1970
- 1970-05-12 FR FR7017097A patent/FR2052380A5/fr not_active Expired
- 1970-06-11 JP JP45049959A patent/JPS4827501B1/ja active Pending
- 1970-06-12 DE DE2028910A patent/DE2028910C3/de not_active Expired
- 1970-06-15 GB GB2877870A patent/GB1305593A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4827501B1 (https=) | 1973-08-23 |
| GB1305593A (https=) | 1973-02-07 |
| DE2028910A1 (de) | 1971-01-07 |
| DE2028910B2 (de) | 1979-01-11 |
| FR2052380A5 (https=) | 1971-04-09 |
| US3584741A (en) | 1971-06-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE2028910C3 (de) | Einrichtung zum Sortieren von elektrischen Schaltungselementen | |
| DE112009000200B4 (de) | Betätigungsvorrichtungen für eine Vorrichtung und ein Verfahren zum Ausrichten und Halten einer Mehrzahl singulierter Halbleiterbauelemente in Aufnahmetaschen eines Klemmträgers | |
| AT405775B (de) | Verfahren und vorrichtung zum ausgerichteten zusammenführen von scheibenförmigen halbleitersubstraten | |
| DE3546587C2 (https=) | ||
| DE2315402A1 (de) | Verfahren zum automatischen zerschneiden von halbleiterplaettchen in chips und zum orientierten aufloeten von chips auf modulsubstrate | |
| DE2834836C2 (de) | Vorrichtung zum Herstellen einer Hybrid-Leiterplatte durch Aufbringen elektronischer Bauelemente auf ein Substrat | |
| DE4230175C2 (de) | Vorrichtung zur automatischen Entladung von Test- und Sortieranlagen | |
| DE10004193C2 (de) | Trägerhandhabungsvorrichtung für ein IC-Modulhandhabungsgerät sowie Verfahren dafür | |
| DE19616809B4 (de) | Prüfmanipulator mit Drehtisch | |
| DE10349847B3 (de) | Positionierungsvorrichtung und -Verfahren für die Übertragung elektronischer Bauteile | |
| DE10133448A1 (de) | Ausrichtungsverfahren und -vorrichtung zum Ausrichten eines Schneidmessers | |
| DE19626611C2 (de) | Transportvorrichtung für Halbleitervorrichtungen | |
| DE19738151A1 (de) | IC-Montage-/Demontagesystem sowie Montage-/Demontagekopf dafür | |
| DE19947015B4 (de) | Verfahren zum Schneiden und Trennen einer gebogenen CSP-Platte mit erheblicher Biegung in einzelne kleine Teile | |
| DE3232859A1 (de) | Vorrichtung fuer den zusammenbau von mikrobauelementen | |
| EP0204291B1 (de) | Einrichtung zum Prüfen und Sortieren von elektronischen Bauelementen, insbesondere integrierten Chips | |
| DE2738989A1 (de) | Vorrichtung zum bedrucken gruener keramischer folien | |
| DE19826314A1 (de) | Halbleiterbauelement-Testgerät | |
| EP0005727B1 (de) | Abfühlvorrichtung zum Feststellen des Ortes von elektrisch leitenden Punkten | |
| EP0133879A1 (de) | Einrichtung zur Oberflächenprüfung plattenförmiger Werkstücke | |
| DE19746955A1 (de) | Prüfsystem für Halbleiterbauelemente | |
| DE2209252C2 (de) | Einrichtung zum Ausrichten eines kleinen plattenförmigen, rechteckigen Werkstückes | |
| DE19610125C1 (de) | Einrichtung in einer Halbleiterfertigungsanlage, insbesondere für integrierte Schaltungen | |
| EP0787421B1 (de) | Rundtischmaschine zum bestücken von substraten mit bauelementen | |
| DE102013113580B4 (de) | Verfahren zum Positionieren eines Trägers mit einer Vielzahl elektronischer Bauteile in einer Einrichtung zum Prüfen der elektronischen Bauteile |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C3 | Grant after two publication steps (3rd publication) | ||
| 8339 | Ceased/non-payment of the annual fee |