DE2021809B2 - - Google Patents

Info

Publication number
DE2021809B2
DE2021809B2 DE2021809A DE2021809A DE2021809B2 DE 2021809 B2 DE2021809 B2 DE 2021809B2 DE 2021809 A DE2021809 A DE 2021809A DE 2021809 A DE2021809 A DE 2021809A DE 2021809 B2 DE2021809 B2 DE 2021809B2
Authority
DE
Germany
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE2021809A
Other languages
German (de)
Other versions
DE2021809A1 (de
Inventor
John Joseph Endwell N.Y. Curtis
Carl Edward Boston Mass. Ruoff
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE2021809A1 publication Critical patent/DE2021809A1/de
Publication of DE2021809B2 publication Critical patent/DE2021809B2/de
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/20—Interconnections within wafers or substrates, e.g. through-silicon vias [TSV]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/021—Manufacture or treatment of interconnections within wafers or substrates
DE19702021809 1969-05-05 1970-05-04 Elektrische Verbindungsanordnung zwischen Mehrlagen-Metallisierungsebenen auf einem Halbleiterkristall Ceased DE2021809A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US82159269A 1969-05-05 1969-05-05

Publications (2)

Publication Number Publication Date
DE2021809A1 DE2021809A1 (de) 1970-11-19
DE2021809B2 true DE2021809B2 (https=) 1980-02-28

Family

ID=25233779

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19702021809 Ceased DE2021809A1 (de) 1969-05-05 1970-05-04 Elektrische Verbindungsanordnung zwischen Mehrlagen-Metallisierungsebenen auf einem Halbleiterkristall

Country Status (5)

Country Link
US (1) US3577036A (https=)
JP (1) JPS4813877B1 (https=)
DE (1) DE2021809A1 (https=)
FR (1) FR2046204A5 (https=)
GB (1) GB1252097A (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3774079A (en) * 1971-06-25 1973-11-20 Ibm Monolithically fabricated tranistor circuit with multilayer conductive patterns
US4109275A (en) * 1976-12-22 1978-08-22 International Business Machines Corporation Interconnection of integrated circuit metallization
JPH08130246A (ja) * 1994-10-28 1996-05-21 Ricoh Co Ltd 半導体装置とその製造方法
DE19824400C2 (de) * 1998-05-30 2000-05-18 Bosch Gmbh Robert Leiterbahn-Kontaktierungsanordnung

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3303071A (en) * 1964-10-27 1967-02-07 Bell Telephone Labor Inc Fabrication of a semiconductive device with closely spaced electrodes
US3419765A (en) * 1965-10-01 1968-12-31 Texas Instruments Inc Ohmic contact to semiconductor devices

Also Published As

Publication number Publication date
JPS4813877B1 (https=) 1973-05-01
GB1252097A (https=) 1971-11-03
DE2021809A1 (de) 1970-11-19
FR2046204A5 (https=) 1971-03-05
US3577036A (en) 1971-05-04

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Legal Events

Date Code Title Description
8235 Patent refused