DE20217220U1 - Leiterplatte mit optimierter elektromagnetischer, elektrischer und mechanischer Kontaktierung - Google Patents

Leiterplatte mit optimierter elektromagnetischer, elektrischer und mechanischer Kontaktierung

Info

Publication number
DE20217220U1
DE20217220U1 DE20217220U DE20217220U DE20217220U1 DE 20217220 U1 DE20217220 U1 DE 20217220U1 DE 20217220 U DE20217220 U DE 20217220U DE 20217220 U DE20217220 U DE 20217220U DE 20217220 U1 DE20217220 U1 DE 20217220U1
Authority
DE
Germany
Prior art keywords
circuit board
printed circuit
electrical
radio device
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE20217220U
Other languages
German (de)
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE20217220U priority Critical patent/DE20217220U1/de
Publication of DE20217220U1 publication Critical patent/DE20217220U1/de
Priority to FR0312277A priority patent/FR2846846B3/fr
Priority to IT000514U priority patent/ITMI20030514U1/it
Priority to ES200302536U priority patent/ES1056010Y/es
Priority to BR8302617-7U priority patent/BR8302617U/pt
Priority to CNU2003201039966U priority patent/CN2673034Y/zh
Priority to KR20-2003-0034745U priority patent/KR200354556Y1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09181—Notches in edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Combinations Of Printed Boards (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Structure Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
DE20217220U 2002-11-06 2002-11-06 Leiterplatte mit optimierter elektromagnetischer, elektrischer und mechanischer Kontaktierung Expired - Lifetime DE20217220U1 (de)

Priority Applications (7)

Application Number Priority Date Filing Date Title
DE20217220U DE20217220U1 (de) 2002-11-06 2002-11-06 Leiterplatte mit optimierter elektromagnetischer, elektrischer und mechanischer Kontaktierung
FR0312277A FR2846846B3 (fr) 2002-11-06 2003-10-21 Plaquette a circuit imprime a mise en contact electromagnetique, electrique et mecanique optimisee
IT000514U ITMI20030514U1 (it) 2002-11-06 2003-11-04 Piastra a circuiti stampati con contattazione elettromagnetica elettrica e meccanica ottimizzata
ES200302536U ES1056010Y (es) 2002-11-06 2003-11-05 Placa de circuito impreso con contacto electro-magnetico, electrico y mecanico optimizado.
BR8302617-7U BR8302617U (pt) 2002-11-06 2003-11-05 Placa de circuito impresso com contactação eletromagnética, elétrica e mecânica otimizada
CNU2003201039966U CN2673034Y (zh) 2002-11-06 2003-11-06 带有优化的电磁、电和机械接触的印刷电路板
KR20-2003-0034745U KR200354556Y1 (ko) 2002-11-06 2003-11-06 전자기적, 전기적 및 기계적 접촉이 최적화된 프린트회로기판

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE20217220U DE20217220U1 (de) 2002-11-06 2002-11-06 Leiterplatte mit optimierter elektromagnetischer, elektrischer und mechanischer Kontaktierung

Publications (1)

Publication Number Publication Date
DE20217220U1 true DE20217220U1 (de) 2003-02-27

Family

ID=7976745

Family Applications (1)

Application Number Title Priority Date Filing Date
DE20217220U Expired - Lifetime DE20217220U1 (de) 2002-11-06 2002-11-06 Leiterplatte mit optimierter elektromagnetischer, elektrischer und mechanischer Kontaktierung

Country Status (7)

Country Link
KR (1) KR200354556Y1 (zh)
CN (1) CN2673034Y (zh)
BR (1) BR8302617U (zh)
DE (1) DE20217220U1 (zh)
ES (1) ES1056010Y (zh)
FR (1) FR2846846B3 (zh)
IT (1) ITMI20030514U1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004103037A1 (de) * 2003-05-12 2004-11-25 Siemens Aktiengesellschaft Bauelementemodul, insbesondere für mobile endgeräte mit optimierter basisband/hf-anordnung
WO2005027596A2 (de) * 2003-09-12 2005-03-24 Siemens Aktiengesellschaft Leiterplatte für ein funkmodul

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004103037A1 (de) * 2003-05-12 2004-11-25 Siemens Aktiengesellschaft Bauelementemodul, insbesondere für mobile endgeräte mit optimierter basisband/hf-anordnung
WO2005027596A2 (de) * 2003-09-12 2005-03-24 Siemens Aktiengesellschaft Leiterplatte für ein funkmodul
WO2005027596A3 (de) * 2003-09-12 2005-07-21 Siemens Ag Leiterplatte für ein funkmodul

Also Published As

Publication number Publication date
ES1056010U (es) 2004-02-16
ITMI20030514V0 (it) 2003-11-04
KR200354556Y1 (ko) 2004-06-25
BR8302617U (pt) 2004-12-07
ITMI20030514U1 (it) 2004-05-07
FR2846846B3 (fr) 2004-10-08
FR2846846A3 (fr) 2004-05-07
CN2673034Y (zh) 2005-01-19
ES1056010Y (es) 2004-06-01

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Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 20030403

R150 Utility model maintained after payment of first maintenance fee after three years

Effective date: 20060202

R157 Lapse of ip right after 6 years

Effective date: 20090603