DE202014104723U1 - Vapor Chamber cooler - Google Patents
Vapor Chamber cooler Download PDFInfo
- Publication number
- DE202014104723U1 DE202014104723U1 DE202014104723.9U DE202014104723U DE202014104723U1 DE 202014104723 U1 DE202014104723 U1 DE 202014104723U1 DE 202014104723 U DE202014104723 U DE 202014104723U DE 202014104723 U1 DE202014104723 U1 DE 202014104723U1
- Authority
- DE
- Germany
- Prior art keywords
- plate
- shaped connector
- chamber cooler
- vapor chamber
- cooler according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Vapor-Chamber-Kühler, umfassend einen Hauptkörper (1), der einen Hohlraum (11) aufweist, der eine erste Seite (111) und eine zweite Seite (112) sowie einen plattenförmigen Verbinder (12) besitzt, wobei die obere und untere Seite des plattenförmigen Verbinders (12) mit der ersten und zweiten Seite (111, 112) bündig sind, wobei um den plattenförmigen Verbinder (12) eine erste Kapillarstruktur (13) vorgesehen ist, wobei in den Hohlraum (11) ein Arbeitsfluid gefüllt wird.Vapor chamber cooler comprising a main body (1) having a cavity (11) having a first side (111) and a second side (112) and a plate-shaped connector (12), the upper and lower sides of the plate-shaped connector (12) are flush with the first and second sides (111, 112), a first capillary structure (13) being provided around the plate-shaped connector (12), a working fluid being filled into the cavity (11).
Description
Technisches Gebiet Technical area
Die Erfindung betrifft einen Vapor-Chamber-Kühler, der die Stützwirkung und die Wärmeleitwirkung erhöhen kann. The invention relates to a vapor-chamber cooler, which can increase the support effect and the thermal conductivity.
Stand der Technik State of the art
Mobilgerät, Personalcomputer, Server, Kommunikationskasten usw. besitzen eine Recheneinheit, deren Betriebswärme mit der Erhöhung der Rechengeschwindigkeit steigt. Um die Betriebswärme abzuleiten, ist ein Kühlelement, wie Kühlkörper, Wärmerohr, Vapor-Chamber-Kühler usw., erforderlich. Für eine großflächige Kühlung wird der Vapor-Chamber-Kühler verwendet, der mit einem Kühlventilator oder Kühlkörper kombiniert werden kann. Der Vapor-Chamber-Kühler ist plattenförmig und weist einen Hohlraum auf, in dem ein Arbeitsfluid zirkuliert. Um eine Verformung des Vapor-Chamber-Kühlers durch eine Außenkraft zu vermeiden, sind im Hohlrum eine Vielzahl von Stützstäbchen angeordnet. Mobile device, personal computer, server, communication box, etc. have a computing unit whose operation heat increases with the increase of the computational speed. In order to dissipate the operating heat, a cooling element, such as heat sink, heat pipe, vapor chamber cooler, etc., is required. For a large-area cooling, the Vapor Chamber cooler is used, which can be combined with a cooling fan or heat sink. The vapor-chamber cooler is plate-shaped and has a cavity in which circulates a working fluid. In order to avoid deformation of the vapor chamber cooler by an external force, a plurality of support rods are arranged in the hollow.
Der Vapor-Chamber-Kühler dient zu einem flächigen Wärmetransport. Um eine Verformung des Vapor-Chamber-Kühlers durch eine Außenkraft zu vermeiden, ist im Hohlrum eine Vielzahl von Stützstäbchen angeordnet. Dadurch werden die Herstellungskosten erhöht. Wenn die Stützstäbchen aus Kupferstäben mit gesintertem Ring gebildet sind, kann die Planheit des Bodens nicht gewährleistet werden. Die Kupferstäbe mit Rillen besitzen auch das gleiche Problem. Daher zielt der Erfinder darauf ab, einen Vapor-Chamber-Kühler anzubieten, die die Nachteile der herkömmlichen Lösung beseitigen kann. The Vapor Chamber cooler is used for a flat heat transport. In order to avoid deformation of the vapor chamber cooler by an external force, a plurality of support rods is arranged in the hollow. This increases the manufacturing costs. If the support rods are formed of copper rods with sintered ring, the flatness of the soil can not be guaranteed. The copper bars with grooves also have the same problem. Therefore, the inventor aims to provide a vapor chamber cooler which can eliminate the disadvantages of the conventional solution.
Aufgabe der Erfindung Object of the invention
Der Erfindung liegt die Aufgabe zugrunde, einen Vapor-Chamber-Kühler zu schaffen, der einen Hauptkörper umfasst, der einen Hohlraum aufweist, der eine erste Seite und eine zweite Seite sowie einen plattenförmigen Verbinder besitzt, wobei die obere und untere Seite der plattenförmigen Verbinder mit der ersten und zweiten Seite bündig sind, wobei um den plattenförmigen Verbinder eine erste Kapillarstruktur vorgesehen ist, wobei in den Hohlraum ein Arbeitsfluid gefüllt wird. The invention has for its object to provide a vapor chamber cooler comprising a main body having a cavity having a first side and a second side and a plate-shaped connector, wherein the upper and lower sides of the plate-shaped connector with the first and second side are flush, wherein a first capillary structure is provided around the plate-shaped connector, wherein in the cavity, a working fluid is filled.
Dadurch kann die Erfindung eine Verformung vermeiden und die Wärmeleitwirkung erhöhen. As a result, the invention can avoid deformation and increase the thermal conductivity.
Kurze Beschreibung der Zeichnungen Brief description of the drawings
Wege zur Ausführung der Erfindung Ways to carry out the invention
Weitere Einzelheiten, Merkmale und Vorteile der Erfindung ergeben sich aus der nachfolgenden detaillierten Beschreibung in Verbindung mit den anliegenden Zeichnungen. Further details, features and advantages of the invention will become apparent from the following detailed description taken in conjunction with the accompanying drawings.
Die
Der Hauptkörper
Der Hauptkörper
Der plattenförmigen Verbinder
Der plattenförmige Verbinder
Wie aus
Wenn der Hauptkörper
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE202014104723.9U DE202014104723U1 (en) | 2014-10-01 | 2014-10-01 | Vapor Chamber cooler |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE202014104723.9U DE202014104723U1 (en) | 2014-10-01 | 2014-10-01 | Vapor Chamber cooler |
Publications (1)
Publication Number | Publication Date |
---|---|
DE202014104723U1 true DE202014104723U1 (en) | 2014-11-24 |
Family
ID=52017763
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE202014104723.9U Expired - Lifetime DE202014104723U1 (en) | 2014-10-01 | 2014-10-01 | Vapor Chamber cooler |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE202014104723U1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110267485A (en) * | 2019-05-27 | 2019-09-20 | 西安交通大学 | A kind of evaporation-boiling capillary wick coupling fluid infusion capillary wick composite structure |
-
2014
- 2014-10-01 DE DE202014104723.9U patent/DE202014104723U1/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110267485A (en) * | 2019-05-27 | 2019-09-20 | 西安交通大学 | A kind of evaporation-boiling capillary wick coupling fluid infusion capillary wick composite structure |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R207 | Utility model specification |
Effective date: 20141231 |
|
R150 | Utility model maintained after payment of first maintenance fee after three years | ||
R151 | Utility model maintained after payment of second maintenance fee after six years | ||
R158 | Lapse of ip right after 8 years |