DE2013684A1 - Halbleiteranordnung - Google Patents
HalbleiteranordnungInfo
- Publication number
- DE2013684A1 DE2013684A1 DE19702013684 DE2013684A DE2013684A1 DE 2013684 A1 DE2013684 A1 DE 2013684A1 DE 19702013684 DE19702013684 DE 19702013684 DE 2013684 A DE2013684 A DE 2013684A DE 2013684 A1 DE2013684 A1 DE 2013684A1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor
- heat
- pins
- dissipating body
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/117—Stacked arrangements of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE404469A SE337263B (ja) | 1969-03-24 | 1969-03-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE2013684A1 true DE2013684A1 (de) | 1971-02-04 |
Family
ID=20263401
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19702013684 Pending DE2013684A1 (de) | 1969-03-24 | 1970-03-21 | Halbleiteranordnung |
Country Status (6)
Country | Link |
---|---|
JP (1) | JPS4934026B1 (ja) |
CH (1) | CH508983A (ja) |
DE (1) | DE2013684A1 (ja) |
FR (1) | FR2039914A5 (ja) |
GB (1) | GB1294532A (ja) |
SE (1) | SE337263B (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2640000A1 (de) * | 1976-09-04 | 1978-03-09 | Bbc Brown Boveri & Cie | Kuehldose fuer fluessigkeitsgekuehlte leistungshalbleiterbauelemente und verfahren zur herstellung derselben |
DE2758166A1 (de) * | 1977-02-18 | 1978-08-24 | Ckd Praha | Leistungshalbleiterbauelement |
DE3010363A1 (de) * | 1980-03-14 | 1981-09-24 | Siemens AG, 1000 Berlin und 8000 München | Geraetekombination fuer den bergbau mit bauelementen der leistungselektronik |
DE3611811A1 (de) * | 1985-04-10 | 1986-10-16 | Hitachi, Ltd., Tokio/Tokyo | Vorrichtung zur dampfkuehlung eines halbleiters |
DE4131739A1 (de) * | 1991-09-24 | 1993-04-01 | Behr Industrietech Gmbh & Co | Kuehleinrichtung fuer elektrische bauelemente |
DE4302816A1 (de) * | 1993-01-28 | 1994-10-06 | Aeg Westinghouse Transport | Anordnung zur Kühlung von druckkontaktierbaren Leistungs-Scheibenhalbleitern |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2337694C2 (de) * | 1973-07-25 | 1984-10-25 | SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg | Halbleitergleichrichteranordnung hoher Strombelastbarkeit |
EP1284503A1 (de) * | 2001-08-13 | 2003-02-19 | Abb Research Ltd. | Leistungshalbleitermodul |
EP1672692B1 (de) * | 2004-12-16 | 2015-01-07 | ABB Research Ltd | Leistungshalbleiter-Modul |
DE102011004541B4 (de) * | 2011-02-22 | 2014-07-17 | Infineon Technologies Bipolar Gmbh & Co. Kg | Verbessertes Leistungshalbleitermodul, Anordnung aus Modul und Kühlkörper sowie Verwendung des Moduls |
-
1969
- 1969-03-24 SE SE404469A patent/SE337263B/xx unknown
-
1970
- 1970-03-19 CH CH421670A patent/CH508983A/de not_active IP Right Cessation
- 1970-03-21 DE DE19702013684 patent/DE2013684A1/de active Pending
- 1970-03-23 GB GB1390770A patent/GB1294532A/en not_active Expired
- 1970-03-24 JP JP2417370A patent/JPS4934026B1/ja active Pending
- 1970-03-24 FR FR7010526A patent/FR2039914A5/fr not_active Expired
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2640000A1 (de) * | 1976-09-04 | 1978-03-09 | Bbc Brown Boveri & Cie | Kuehldose fuer fluessigkeitsgekuehlte leistungshalbleiterbauelemente und verfahren zur herstellung derselben |
DE2758166A1 (de) * | 1977-02-18 | 1978-08-24 | Ckd Praha | Leistungshalbleiterbauelement |
DE3010363A1 (de) * | 1980-03-14 | 1981-09-24 | Siemens AG, 1000 Berlin und 8000 München | Geraetekombination fuer den bergbau mit bauelementen der leistungselektronik |
DE3611811A1 (de) * | 1985-04-10 | 1986-10-16 | Hitachi, Ltd., Tokio/Tokyo | Vorrichtung zur dampfkuehlung eines halbleiters |
DE4131739A1 (de) * | 1991-09-24 | 1993-04-01 | Behr Industrietech Gmbh & Co | Kuehleinrichtung fuer elektrische bauelemente |
DE4302816A1 (de) * | 1993-01-28 | 1994-10-06 | Aeg Westinghouse Transport | Anordnung zur Kühlung von druckkontaktierbaren Leistungs-Scheibenhalbleitern |
Also Published As
Publication number | Publication date |
---|---|
CH508983A (de) | 1971-06-15 |
FR2039914A5 (ja) | 1971-01-15 |
JPS4934026B1 (ja) | 1974-09-11 |
GB1294532A (en) | 1972-11-01 |
SE337263B (ja) | 1971-08-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
OHN | Withdrawal |