DE1955130B2 - Verfahren zum Herstellen von Halbleiterbauelementen mit eindiffundierten Störstellenfronten geringer Eindringtiefe und mit hoher Störstellendichte an der Halbleiteroberfläche - Google Patents

Verfahren zum Herstellen von Halbleiterbauelementen mit eindiffundierten Störstellenfronten geringer Eindringtiefe und mit hoher Störstellendichte an der Halbleiteroberfläche

Info

Publication number
DE1955130B2
DE1955130B2 DE1955130A DE1955130A DE1955130B2 DE 1955130 B2 DE1955130 B2 DE 1955130B2 DE 1955130 A DE1955130 A DE 1955130A DE 1955130 A DE1955130 A DE 1955130A DE 1955130 B2 DE1955130 B2 DE 1955130B2
Authority
DE
Germany
Prior art keywords
diffusion
carrier gas
semiconductor
dopant
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE1955130A
Other languages
German (de)
English (en)
Other versions
DE1955130A1 (de
Inventor
Madhukar Laxman Walton Woods Vt. Joshi
Alan Lagrangeville Platt
Edward S. Poughkeepsie Wajda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE1955130A1 publication Critical patent/DE1955130A1/de
Publication of DE1955130B2 publication Critical patent/DE1955130B2/de
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P32/00—Diffusion of dopants within, into or out of wafers, substrates or parts of devices
    • H10P32/10—Diffusion of dopants within, into or out of semiconductor bodies or layers
    • H10P32/12—Diffusion of dopants within, into or out of semiconductor bodies or layers between a solid phase and a gaseous phase
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F17/00—Vertical ducts; Channels, e.g. for drainage
    • E04F17/02—Vertical ducts; Channels, e.g. for drainage for carrying away waste gases, e.g. flue gases; Building elements specially designed therefor, e.g. shaped bricks or sets thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P32/00—Diffusion of dopants within, into or out of wafers, substrates or parts of devices
    • H10P32/10—Diffusion of dopants within, into or out of semiconductor bodies or layers
    • H10P32/17—Diffusion of dopants within, into or out of semiconductor bodies or layers characterised by the semiconductor material
    • H10P32/171—Diffusion of dopants within, into or out of semiconductor bodies or layers characterised by the semiconductor material being group IV material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/003—Anneal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/04—Dopants, special
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/041—Doping control in crystal growth
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/079—Inert carrier gas

Landscapes

  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Formation Of Insulating Films (AREA)
  • Chemical Vapour Deposition (AREA)
DE1955130A 1968-11-04 1969-11-03 Verfahren zum Herstellen von Halbleiterbauelementen mit eindiffundierten Störstellenfronten geringer Eindringtiefe und mit hoher Störstellendichte an der Halbleiteroberfläche Ceased DE1955130B2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US77298368A 1968-11-04 1968-11-04

Publications (2)

Publication Number Publication Date
DE1955130A1 DE1955130A1 (de) 1970-05-27
DE1955130B2 true DE1955130B2 (de) 1979-11-29

Family

ID=25096808

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1955130A Ceased DE1955130B2 (de) 1968-11-04 1969-11-03 Verfahren zum Herstellen von Halbleiterbauelementen mit eindiffundierten Störstellenfronten geringer Eindringtiefe und mit hoher Störstellendichte an der Halbleiteroberfläche

Country Status (5)

Country Link
US (1) US3649388A (https=)
JP (1) JPS4822662B1 (https=)
DE (1) DE1955130B2 (https=)
FR (1) FR2022493A1 (https=)
GB (1) GB1266380A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3221180A1 (de) * 1981-06-05 1983-01-05 Mitsubishi Denki K.K., Tokyo Verfahren und vorrichtung zur herstellung einer halbleitervorrichtung

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3753809A (en) * 1970-01-09 1973-08-21 Ibm Method for obtaining optimum phosphorous concentration in semiconductor wafers
GB1332994A (en) * 1971-01-11 1973-10-10 Mullard Ltd Method of diffusing an impurity into a semiconductor body
US3836215A (en) * 1973-02-15 1974-09-17 Ingersoll Rand Co Shaft vibration dampening means and method
CN101980381B (zh) * 2010-09-29 2011-11-30 山东力诺太阳能电力股份有限公司 一种晶体硅太阳能电池双扩散工艺

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3221180A1 (de) * 1981-06-05 1983-01-05 Mitsubishi Denki K.K., Tokyo Verfahren und vorrichtung zur herstellung einer halbleitervorrichtung

Also Published As

Publication number Publication date
US3649388A (en) 1972-03-14
FR2022493A1 (https=) 1970-07-31
DE1955130A1 (de) 1970-05-27
JPS4822662B1 (https=) 1973-07-07
GB1266380A (https=) 1972-03-08

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Legal Events

Date Code Title Description
8235 Patent refused