DE1903098B2 - Elektrisch isolierende epoxidharz einkapselungsmasse fuer halbleiterbauelementew - Google Patents
Elektrisch isolierende epoxidharz einkapselungsmasse fuer halbleiterbauelementewInfo
- Publication number
- DE1903098B2 DE1903098B2 DE19691903098 DE1903098A DE1903098B2 DE 1903098 B2 DE1903098 B2 DE 1903098B2 DE 19691903098 DE19691903098 DE 19691903098 DE 1903098 A DE1903098 A DE 1903098A DE 1903098 B2 DE1903098 B2 DE 1903098B2
- Authority
- DE
- Germany
- Prior art keywords
- epoxy resin
- electrically insulating
- semiconductor components
- resin encapsulation
- insulating epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/307—Other macromolecular compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/46—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes silicones
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US70072668A | 1968-01-26 | 1968-01-26 | |
US70072668 | 1968-01-26 |
Publications (3)
Publication Number | Publication Date |
---|---|
DE1903098A1 DE1903098A1 (de) | 1970-06-11 |
DE1903098B2 true DE1903098B2 (de) | 1971-04-22 |
DE1903098C3 DE1903098C3 (de) | 1977-09-15 |
Family
ID=
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2916954A1 (de) * | 1978-04-26 | 1979-10-31 | Tokyo Shibaura Electric Co | In kunststoff eingebettete halbleitervorrichtung |
DE3013470A1 (de) * | 1979-04-09 | 1980-10-23 | Plaskon Prod | Verfahren zur einkapselung einer halbleitereinrichtung und epoxyformmasse zur durchfuehrung des verfahrens |
DE3137883A1 (de) * | 1981-09-23 | 1983-07-28 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum isolieren von hallmagnetschranken |
WO1989007627A1 (en) * | 1988-02-15 | 1989-08-24 | Lucky, Ltd. | Epoxy resin compositions for sealing semiconductor devices |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2916954A1 (de) * | 1978-04-26 | 1979-10-31 | Tokyo Shibaura Electric Co | In kunststoff eingebettete halbleitervorrichtung |
DE3013470A1 (de) * | 1979-04-09 | 1980-10-23 | Plaskon Prod | Verfahren zur einkapselung einer halbleitereinrichtung und epoxyformmasse zur durchfuehrung des verfahrens |
DE3137883A1 (de) * | 1981-09-23 | 1983-07-28 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum isolieren von hallmagnetschranken |
WO1989007627A1 (en) * | 1988-02-15 | 1989-08-24 | Lucky, Ltd. | Epoxy resin compositions for sealing semiconductor devices |
Also Published As
Publication number | Publication date |
---|---|
DE1903098A1 (de) | 1970-06-11 |
GB1235413A (en) | 1971-06-16 |
NL6901148A (de) | 1969-07-29 |
FR2000839A1 (de) | 1969-09-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C3 | Grant after two publication steps (3rd publication) | ||
E77 | Valid patent as to the heymanns-index 1977 | ||
EHJ | Ceased/non-payment of the annual fee |