DE1903098B2 - Elektrisch isolierende epoxidharz einkapselungsmasse fuer halbleiterbauelementew - Google Patents

Elektrisch isolierende epoxidharz einkapselungsmasse fuer halbleiterbauelementew

Info

Publication number
DE1903098B2
DE1903098B2 DE19691903098 DE1903098A DE1903098B2 DE 1903098 B2 DE1903098 B2 DE 1903098B2 DE 19691903098 DE19691903098 DE 19691903098 DE 1903098 A DE1903098 A DE 1903098A DE 1903098 B2 DE1903098 B2 DE 1903098B2
Authority
DE
Germany
Prior art keywords
epoxy resin
electrically insulating
semiconductor components
resin encapsulation
insulating epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19691903098
Other languages
English (en)
Other versions
DE1903098A1 (de
DE1903098C3 (de
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of DE1903098A1 publication Critical patent/DE1903098A1/de
Publication of DE1903098B2 publication Critical patent/DE1903098B2/de
Application granted granted Critical
Publication of DE1903098C3 publication Critical patent/DE1903098C3/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/307—Other macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/46—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes silicones
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
DE19691903098 1968-01-26 1969-01-22 Elektrisch isolierende Epoxidharz-Einkapselungsmasse für Halbleiterbauelemente Expired DE1903098C3 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US70072668A 1968-01-26 1968-01-26
US70072668 1968-01-26

Publications (3)

Publication Number Publication Date
DE1903098A1 DE1903098A1 (de) 1970-06-11
DE1903098B2 true DE1903098B2 (de) 1971-04-22
DE1903098C3 DE1903098C3 (de) 1977-09-15

Family

ID=

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2916954A1 (de) * 1978-04-26 1979-10-31 Tokyo Shibaura Electric Co In kunststoff eingebettete halbleitervorrichtung
DE3013470A1 (de) * 1979-04-09 1980-10-23 Plaskon Prod Verfahren zur einkapselung einer halbleitereinrichtung und epoxyformmasse zur durchfuehrung des verfahrens
DE3137883A1 (de) * 1981-09-23 1983-07-28 Siemens AG, 1000 Berlin und 8000 München Verfahren zum isolieren von hallmagnetschranken
WO1989007627A1 (en) * 1988-02-15 1989-08-24 Lucky, Ltd. Epoxy resin compositions for sealing semiconductor devices

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2916954A1 (de) * 1978-04-26 1979-10-31 Tokyo Shibaura Electric Co In kunststoff eingebettete halbleitervorrichtung
DE3013470A1 (de) * 1979-04-09 1980-10-23 Plaskon Prod Verfahren zur einkapselung einer halbleitereinrichtung und epoxyformmasse zur durchfuehrung des verfahrens
DE3137883A1 (de) * 1981-09-23 1983-07-28 Siemens AG, 1000 Berlin und 8000 München Verfahren zum isolieren von hallmagnetschranken
WO1989007627A1 (en) * 1988-02-15 1989-08-24 Lucky, Ltd. Epoxy resin compositions for sealing semiconductor devices

Also Published As

Publication number Publication date
DE1903098A1 (de) 1970-06-11
GB1235413A (en) 1971-06-16
NL6901148A (de) 1969-07-29
FR2000839A1 (de) 1969-09-12

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Legal Events

Date Code Title Description
C3 Grant after two publication steps (3rd publication)
E77 Valid patent as to the heymanns-index 1977
EHJ Ceased/non-payment of the annual fee