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Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame.
Verfahren zum Belichten eines lichtempfindlichen Materials, das für die Herstellung einer Druckplatte bestimmt ist, sowie photographische Setzmaschine für die Durchführung des Verfahrens
Procedimento per formare strutture di superficie su una matrice,specialmente per produrre incisioni stampate su un nastro di pressatura in materiale sintetico o laminati in materiale sintetico