DE1539773A1 - Leistungs-Halbleiterbauelement - Google Patents

Leistungs-Halbleiterbauelement

Info

Publication number
DE1539773A1
DE1539773A1 DE19661539773 DE1539773A DE1539773A1 DE 1539773 A1 DE1539773 A1 DE 1539773A1 DE 19661539773 DE19661539773 DE 19661539773 DE 1539773 A DE1539773 A DE 1539773A DE 1539773 A1 DE1539773 A1 DE 1539773A1
Authority
DE
Germany
Prior art keywords
electrode
base plate
cylindrical
semiconductor component
component according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19661539773
Other languages
German (de)
English (en)
Inventor
Vlastimil Bezouska
Pivrnec Judr Jan
Evzen Krasa
Cestmir Rehak
Zdenek Zavazal
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CKD Praha DIZ AS
Original Assignee
CKD Praha DIZ AS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CKD Praha DIZ AS filed Critical CKD Praha DIZ AS
Publication of DE1539773A1 publication Critical patent/DE1539773A1/de
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
DE19661539773 1965-05-15 1966-05-13 Leistungs-Halbleiterbauelement Pending DE1539773A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CS318065 1965-05-15

Publications (1)

Publication Number Publication Date
DE1539773A1 true DE1539773A1 (de) 1969-07-24

Family

ID=5371132

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19661539773 Pending DE1539773A1 (de) 1965-05-15 1966-05-13 Leistungs-Halbleiterbauelement

Country Status (4)

Country Link
AT (1) AT259073B (enrdf_load_html_response)
DE (1) DE1539773A1 (enrdf_load_html_response)
GB (1) GB1146623A (enrdf_load_html_response)
SE (1) SE319837B (enrdf_load_html_response)

Also Published As

Publication number Publication date
GB1146623A (en) 1969-03-26
SE319837B (enrdf_load_html_response) 1970-01-26
AT259073B (de) 1967-12-27

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