DE1539645A1 - Halbleiteranordnung - Google Patents

Halbleiteranordnung

Info

Publication number
DE1539645A1
DE1539645A1 DE19661539645 DE1539645A DE1539645A1 DE 1539645 A1 DE1539645 A1 DE 1539645A1 DE 19661539645 DE19661539645 DE 19661539645 DE 1539645 A DE1539645 A DE 1539645A DE 1539645 A1 DE1539645 A1 DE 1539645A1
Authority
DE
Germany
Prior art keywords
semiconducting
base plate
semiconductor
systems
current collector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19661539645
Other languages
German (de)
English (en)
Inventor
Andersson Nils Eric
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ABB Norden Holding AB
Original Assignee
ASEA AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASEA AB filed Critical ASEA AB
Publication of DE1539645A1 publication Critical patent/DE1539645A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE19661539645 1965-05-28 1966-05-14 Halbleiteranordnung Pending DE1539645A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE701765 1965-05-28

Publications (1)

Publication Number Publication Date
DE1539645A1 true DE1539645A1 (de) 1969-06-26

Family

ID=20270189

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19661539645 Pending DE1539645A1 (de) 1965-05-28 1966-05-14 Halbleiteranordnung

Country Status (4)

Country Link
US (1) US3447042A (enExample)
DE (1) DE1539645A1 (enExample)
GB (1) GB1139345A (enExample)
NL (1) NL6606871A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3532942A (en) * 1967-05-23 1970-10-06 Int Rectifier Corp Pressure-assembled semiconductor device housing having three terminals
FR1562139A (enExample) * 1968-02-09 1969-04-04 Siemens Ag
US3569798A (en) * 1969-05-13 1971-03-09 Rca Corp Double heat sink semiconductor device
JPS6060172U (ja) * 1983-09-13 1985-04-26 本田技研工業株式会社 整流器付トランス装置
US4943844A (en) * 1985-11-22 1990-07-24 Texas Instruments Incorporated High-density package
WO1987005746A1 (en) * 1986-03-19 1987-09-24 Analog Devices, Incorporated Aluminum-backed wafer and chip
US4878106A (en) * 1986-12-02 1989-10-31 Anton Piller Gmbh & Co. Kg Semiconductor circuit packages for use in high power applications and method of making the same

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2665399A (en) * 1954-01-05 Rectifier assembly
US1905525A (en) * 1931-09-10 1933-04-25 Union Switch & Signal Co Electrical rectifier
DE883479C (de) * 1951-06-10 1953-07-16 Siemens Ag Trockengleichrichter
US2780758A (en) * 1953-08-12 1957-02-05 Dry disk rectifier assemblies
US2839710A (en) * 1955-05-12 1958-06-17 Westinghouse Freins & Signaux Rectifier assemblies
US3356914A (en) * 1963-05-03 1967-12-05 Westinghouse Electric Corp Integrated semiconductor rectifier assembly
NL302170A (enExample) * 1963-06-15
US3313987A (en) * 1964-04-22 1967-04-11 Int Rectifier Corp Compression bonded semiconductor device

Also Published As

Publication number Publication date
NL6606871A (enExample) 1966-11-29
US3447042A (en) 1969-05-27
GB1139345A (en) 1969-01-08

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