DE1414620B2 - Verfahren zum herstellen einer thermoelektrischen vorrichtung und halbleitende staebe zur durchfuehrung des verfahrens - Google Patents
Verfahren zum herstellen einer thermoelektrischen vorrichtung und halbleitende staebe zur durchfuehrung des verfahrensInfo
- Publication number
- DE1414620B2 DE1414620B2 DE19611414620 DE1414620A DE1414620B2 DE 1414620 B2 DE1414620 B2 DE 1414620B2 DE 19611414620 DE19611414620 DE 19611414620 DE 1414620 A DE1414620 A DE 1414620A DE 1414620 B2 DE1414620 B2 DE 1414620B2
- Authority
- DE
- Germany
- Prior art keywords
- layer
- rods
- semiconducting
- semiconductor
- rod
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 18
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 42
- 239000000463 material Substances 0.000 claims description 19
- 150000001875 compounds Chemical class 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 239000004922 lacquer Substances 0.000 claims description 4
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 229910052714 tellurium Inorganic materials 0.000 claims description 2
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 claims description 2
- 230000002411 adverse Effects 0.000 claims 2
- 230000000694 effects Effects 0.000 claims 1
- 239000011810 insulating material Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 230000008901 benefit Effects 0.000 description 4
- 229910052797 bismuth Inorganic materials 0.000 description 4
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 4
- XSOKHXFFCGXDJZ-UHFFFAOYSA-N telluride(2-) Chemical compound [Te-2] XSOKHXFFCGXDJZ-UHFFFAOYSA-N 0.000 description 3
- 208000005374 Poisoning Diseases 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000012447 hatching Effects 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910001338 liquidmetal Inorganic materials 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 231100000572 poisoning Toxicity 0.000 description 2
- 230000000607 poisoning effect Effects 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- MRPWWVMHWSDJEH-UHFFFAOYSA-N antimony telluride Chemical compound [SbH3+3].[SbH3+3].[TeH2-2].[TeH2-2].[TeH2-2] MRPWWVMHWSDJEH-UHFFFAOYSA-N 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 108090000623 proteins and genes Proteins 0.000 description 1
- OMEPJWROJCQMMU-UHFFFAOYSA-N selanylidenebismuth;selenium Chemical compound [Se].[Bi]=[Se].[Bi]=[Se] OMEPJWROJCQMMU-UHFFFAOYSA-N 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/81—Structural details of the junction
- H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DEP0028366 | 1961-12-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE1414620A1 DE1414620A1 (de) | 1968-10-03 |
| DE1414620B2 true DE1414620B2 (de) | 1971-05-19 |
Family
ID=7371223
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19611414620 Pending DE1414620B2 (de) | 1961-12-06 | 1961-12-06 | Verfahren zum herstellen einer thermoelektrischen vorrichtung und halbleitende staebe zur durchfuehrung des verfahrens |
Country Status (7)
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1275646B (de) * | 1965-05-10 | 1968-08-22 | Siemens Ag | Verfahren zur Herstellung einer thermoelektrischen Anordnung |
| FR2206034A5 (US06265458-20010724-C00056.png) * | 1972-11-09 | 1974-05-31 | Cit Alcatel | |
| FR2261639B1 (US06265458-20010724-C00056.png) * | 1974-02-15 | 1976-11-26 | Cit Alcatel | |
| FR2261638B1 (US06265458-20010724-C00056.png) * | 1974-02-15 | 1976-11-26 | Cit Alcatel |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2994945A (en) * | 1957-01-31 | 1961-08-08 | Sprague Electric Co | Process for wire-wound resistor |
| US2963392A (en) * | 1958-05-07 | 1960-12-06 | Sanders Associates Inc | Method of splicing printed circuits |
| US2968866A (en) * | 1958-05-21 | 1961-01-24 | Sylvania Electric Prod | Method of producing thin wafers of semiconductor materials |
| US2992538A (en) * | 1959-02-13 | 1961-07-18 | Licentia Gmbh | Thermoelectric system |
| US2994203A (en) * | 1960-01-14 | 1961-08-01 | Westinghouse Electric Corp | Thermoelectric cooling device |
-
0
- BE BE625723D patent/BE625723A/xx unknown
-
1961
- 1961-12-06 DE DE19611414620 patent/DE1414620B2/de active Pending
-
1962
- 1962-12-03 AT AT946162A patent/AT245649B/de active
- 1962-12-03 CH CH1418362A patent/CH422084A/de unknown
- 1962-12-03 GB GB45614/62A patent/GB1014546A/en not_active Expired
- 1962-12-04 US US242278A patent/US3279036A/en not_active Expired - Lifetime
- 1962-12-05 SE SE13122/62A patent/SE302793B/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| US3279036A (en) | 1966-10-18 |
| SE302793B (US06265458-20010724-C00056.png) | 1968-08-05 |
| CH422084A (de) | 1966-10-15 |
| GB1014546A (en) | 1965-12-31 |
| BE625723A (US06265458-20010724-C00056.png) | |
| DE1414620A1 (de) | 1968-10-03 |
| AT245649B (de) | 1966-03-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| SH | Request for examination between 03.10.1968 and 22.04.1971 |