DE130605C - - Google Patents
Info
- Publication number
- DE130605C DE130605C DENDAT130605D DE130605DA DE130605C DE 130605 C DE130605 C DE 130605C DE NDAT130605 D DENDAT130605 D DE NDAT130605D DE 130605D A DE130605D A DE 130605DA DE 130605 C DE130605 C DE 130605C
- Authority
- DE
- Germany
- Prior art keywords
- metal
- contact
- igo2
- regenerating
- november
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910052751 metal Inorganic materials 0.000 claims 5
- 239000002184 metal Substances 0.000 claims 5
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims 1
- 229910001297 Zn alloy Inorganic materials 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 238000004090 dissolution Methods 0.000 claims 1
- 229910052749 magnesium Inorganic materials 0.000 claims 1
- 239000011777 magnesium Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 230000001172 regenerating effect Effects 0.000 claims 1
- 150000003839 salts Chemical class 0.000 claims 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/54—Contact plating, i.e. electroless electrochemical plating
Landscapes
- Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Coating With Molten Metal (AREA)
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE130605C true DE130605C (enrdf_load_stackoverflow) |
Family
ID=398992
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DENDAT130605D Active DE130605C (enrdf_load_stackoverflow) |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE130605C (enrdf_load_stackoverflow) |
-
0
- DE DENDAT130605D patent/DE130605C/de active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| GB2285813A (en) | Electrolytic treatment of copper foil to deposit a dark-coloured,nodular layer of copper-nickel alloy to improve bond strength to dielectric substrate | |
| US2584317A (en) | Method of producing bimetallic printing forms | |
| DE130605C (enrdf_load_stackoverflow) | ||
| TW201139755A (en) | Electronic circuit, method for forming same, and copper clad laminate for electronic circuit formation | |
| US2181111A (en) | Method for the production of metallic printing plates or cylinders | |
| US3236708A (en) | Etching of metals | |
| DE1771241A1 (de) | Plattierte Gegenstaende | |
| US2702785A (en) | Process of producing hard chromium platings on light metals | |
| JP4609779B2 (ja) | マグネシウム合金部材およびその高耐食被膜形成方法 | |
| GB1285417A (en) | Production of protective coatings on metals by anodic oxidation | |
| US3647650A (en) | Method of treating tin plate or galvanized sheet | |
| GB1351741A (en) | Electrodes | |
| GB1315538A (en) | Printing member and method of making the same | |
| Baumgärtner et al. | Palladium-iron alloy electrodeposition. Part II alloy plating systems | |
| JP5246539B2 (ja) | マグネシウム合金部材およびその高耐食被膜形成方法 | |
| GB1222046A (en) | Method of preventing rack plating in continuous plating cycle for non-conductive articles | |
| FR2092478A5 (en) | Electrolytic printed circuit prodn - by electrolytic deposition - of copper | |
| JPS5939515B2 (ja) | 光沢複合電気亜鉛めつき鋼板の製造法 | |
| CN107735846B (zh) | 铝合金带材制成的插接器 | |
| JP3213857B2 (ja) | 貴金属めっきの製造方法 | |
| JP3136188B2 (ja) | 銅箔の表面処理方法 | |
| JP2010174315A (ja) | 被膜を有するマグネシウム合金部材およびその製造方法 | |
| DE205816C (enrdf_load_stackoverflow) | ||
| Weisberg | Gold plating | |
| US1880567A (en) | Chromium coated articles and method of preparing same |