CN107735846B - 铝合金带材制成的插接器 - Google Patents
铝合金带材制成的插接器 Download PDFInfo
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- CN107735846B CN107735846B CN201680033150.XA CN201680033150A CN107735846B CN 107735846 B CN107735846 B CN 107735846B CN 201680033150 A CN201680033150 A CN 201680033150A CN 107735846 B CN107735846 B CN 107735846B
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- 229910000838 Al alloy Inorganic materials 0.000 title claims abstract description 18
- 239000002318 adhesion promoter Substances 0.000 claims abstract description 22
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical class [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910045601 alloy Inorganic materials 0.000 claims description 21
- 239000000956 alloy Substances 0.000 claims description 21
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 21
- 238000009713 electroplating Methods 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 229910018082 Cu3Sn Inorganic materials 0.000 claims description 5
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 4
- 239000004411 aluminium Substances 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 229910052725 zinc Inorganic materials 0.000 claims description 4
- 239000011701 zinc Substances 0.000 claims description 4
- 239000012535 impurity Substances 0.000 claims description 3
- 229910018457 Cu6Sn Inorganic materials 0.000 claims description 2
- 229910018471 Cu6Sn5 Inorganic materials 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- QCEUXSAXTBNJGO-UHFFFAOYSA-N [Ag].[Sn] Chemical compound [Ag].[Sn] QCEUXSAXTBNJGO-UHFFFAOYSA-N 0.000 claims description 2
- LGFYIAWZICUNLK-UHFFFAOYSA-N antimony silver Chemical compound [Ag].[Sb] LGFYIAWZICUNLK-UHFFFAOYSA-N 0.000 claims description 2
- SFOSJWNBROHOFJ-UHFFFAOYSA-N cobalt gold Chemical compound [Co].[Au] SFOSJWNBROHOFJ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052738 indium Inorganic materials 0.000 claims description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 2
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 claims description 2
- MOWMLACGTDMJRV-UHFFFAOYSA-N nickel tungsten Chemical compound [Ni].[W] MOWMLACGTDMJRV-UHFFFAOYSA-N 0.000 claims description 2
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 41
- 239000011248 coating agent Substances 0.000 description 17
- 238000000576 coating method Methods 0.000 description 17
- 238000000034 method Methods 0.000 description 10
- 238000007747 plating Methods 0.000 description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 125000005474 octanoate group Chemical group 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 239000011265 semifinished product Substances 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- SNAAJJQQZSMGQD-UHFFFAOYSA-N aluminum magnesium Chemical compound [Mg].[Al] SNAAJJQQZSMGQD-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
- C22C21/06—Alloys based on aluminium with magnesium as the next major constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/013—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium
- B32B15/015—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium the said other metal being copper or nickel or an alloy thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/017—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of aluminium or an aluminium alloy, another layer being formed of an alloy based on a non ferrous metal other than aluminium
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/04—Alloys based on copper with zinc as the next major constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B3/00—Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
- B21B2003/005—Copper or its alloys
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Non-Insulated Conductors (AREA)
Abstract
本发明涉及由铝合金(1)的带材制成的插接器，其包括至少一个增附剂层(2)，其中所述增附剂层(2)为电镀施加的铜锡合金。
Description
本发明涉及由铝合金带材制成的插接器。
由Dettner/Elze，Handbuch der Galvanotechnik，第I/2卷，第1033-1047页，CarlHanser Verlag，München已知这样的铝合金。其中描述了借助辛酸盐酸洗法施加由锌组成的增附剂层。
在使用已知的增附剂层时，可能由于锌与铝之间反应不利地发生晶界腐蚀。此外，辛酸盐酸洗法并不适合于带式电镀法。因此涂层昂贵并且例如对于插接器或电接触元件而言相对于铜基插接器不具有竞争力。
本发明的目的在于克服现有技术的缺点。尤其是应当提供有铝合金带材制成的插接器。
该目的通过权利要求1的特征得以解决。本发明的有利的实施方案由权利要求2至6的特征得出。
根据本发明提出，增附剂层为电镀施加的铜锡合金并且直接施加至铝合金上。根据本发明，增附剂层具有最大50nm的厚度。在所述增附剂层上是另一金属层或合金层。
将铜锡合金借助含铜的电镀浴施加至带材上。在由一系列电镀带材施加金属期间或之后形成合金。根据本发明，将“带材”理解为一种工件，其为金属薄片带材，为连续并且之后分开的冲压件形式构造的带材或半成品。根据本发明的带材尤其适合于通过带式电镀法涂覆。
电镀涂覆可以为其中将工件，尤其是带材部分地或完全地浸入电镀浴的“常规电镀涂覆”或为带式电镀法。
将“带式电镀法”理解为这样的方法，其中将带材从卷展开，引导其通过电镀浴以涂覆并且随后重新卷绕在另一卷上或以另外的方式再加工。在本文上下文中，也称为所谓“卷对卷方法”。
典型地，通过电镀施加增附剂层至少部分地，尤其是完全地腐蚀掉铝合金的原生的表面氧化物。
有利地，所述铜锡合金包含Cu3Sn或Cu6Sn5。优选地，所述铜锡合金由Cu3Sn或由Cu6Sn5以及不可避免的杂质组成。
增附剂层的晶粒的粒度优选处于10至100nm，尤其是10至30nm的范围。
有利地，铝合金包含至少80重量％的铝，优选至少90重量％的铝，尤其是至少95重量％的铝。
优选地，另外的金属层或合金层由下组的至少一种金属或合金制得：银、银-锡、银-锑、金、金-钴、铜、镍、镍-磷、镍-钨、铟、铅、钯-镍、锡、锡-铅或锌。可以提供一个或多个另外的金属层或合金层。另外的金属层或合金层的每一个尤其可以具有介于50nm和15μm之间，优选0.5μm至9μm，尤其是1μm至4μm的层厚度。有利地，还借助带式电镀法施加至少一个另外的金属层或合金层。
用由铜锡合金制成的增附剂层涂覆的有利之处在于，借助带式电镀法涂覆是可能的。因此可以将总涂覆时间减少至常规涂覆时间的一小部分。可以成本有利地制造具有根据本发明的涂层的带材。使用根据本发明涂覆的带材，例如用于制造插接器、电接触元件，尤其是作为电动汽车等中的电池连接器是可能的。
在下文借助于附图更详细地解释本发明。其中：
图1显示了具有增附剂层和另外的金属层或合金层的经涂覆的铝合金的示意图，
图2显示了根据图1的具有另外的金属层或合金层的示意图。
附图仅描绘了层的顺序。不应由附图中发现关于单个层厚度的内容。
图1显示了铝合金1的带材。直接在铝合金1上的是增附剂层2。增附剂层2例如由Cu3Sn组成。另一金属层或合金层3形成最上层。所述另外的金属层或合金层3例如是可焊接的锡层。
增附剂层2的合金的形成可以以一系列电镀浴产生。
图2显示了根据图1的实施方案，其中在增附剂层2上方存在三个另外的金属层或合金层3、3a、3b。作为对此的实例，可以提及下述：在具有40mm宽度和0.5mm厚度的由具有3重量％的镁的铝镁合金制成的带材上施加具有30nm厚度的由铜锡合金制成的增附剂层2，在其上施加具有100nm厚度的由铜制成的第一另外的金属层或合金层3，在其上施加具有0.5μm或更大厚度的由镍制成的第二另外的金属层或合金层3a，在其上施加具有2μm厚度的锡的第三另外的金属层或合金层3b作为表面层。如此涂覆的带材是用于再加工的半成品。可以例如由此制造插接器。所述第三另外的金属层或合金层3b适合用于制造焊接连接。
为了制造涂层，例如使用所谓的浸入深度法，其中仅将带材的待涂覆的区域浸入涂覆浴。带材的其它区域保持没有涂覆。使带材通过用于用铜锡合金涂覆的多个涂覆浴，然后通过用于用铜涂覆的浴，接着通过用于用镍涂覆的另一个浴，和之后通过用于用锡涂覆的最后的浴。在各个浴中如此调整停留时间和/或电流强度和电流密度，使得达到预定的层厚度。在单个浴之前或者之间和之后连接必要的清洁步骤。
附图标记列表
1 铝合金
2 增附剂层
3,3a,3b 另外的金属层或合金层
Claims (8)
1.由铝合金(1)的带材制成的插接器，其包括至少一个增附剂层(2)，
其中所述增附剂层(2)为电镀施加的铜锡合金并且直接施加在铝合金(1)上，
其中所述增附剂层(2)具有最大50nm的厚度，
其中在所述增附剂层(2)上施加另外的金属层或合金层(3、3a、3b)，和
将铜锡合金借助含铜的电镀浴施加至带材上。
2.根据权利要求1所述的插接器，其中所述铜锡合金包含Cu3Sn或Cu6Sn5。
3.根据权利要求2所述的插接器，其中所述铜锡合金由Cu3Sn以及不可避免的杂质组成，或由Cu6Sn5以及不可避免的杂质组成。
4.根据权利要求1-3中任一项所述的插接器，其中所述增附剂层(2)的晶粒的粒度处于10nm至30nm的范围内。
5.根据权利要求1-3中任一项所述的插接器，其中所述铝合金(1)包含至少80重量％的铝。
6.根据权利要求5所述的插接器，其中所述铝合金(1)包含至少90重量％的铝。
7.根据权利要求5所述的插接器，其中所述铝合金(1)包含至少95重量％的铝。
8.根据权利要求1-3中任一项所述的插接器，其中所述另外的金属层或合金层(3、3a、3b)包含来自下组的至少一种金属或合金：银、银-锡、银-锑、金、金-钴、铜、镍、镍-磷、镍-钨、铟、铅、钯-镍、锡、锡-铅、锌。
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102015008302 | 2015-06-29 | ||
| DE102015008302.3 | 2015-06-29 | ||
| DE102015009944.2 | 2015-07-30 | ||
| DE102015009944.2A DE102015009944B4 (de) | 2015-06-29 | 2015-07-30 | Steckverbinder hergestellt aus einem Band aus einer Aluminium-Legierung |
| PCT/EP2016/000949 WO2017001042A1 (de) | 2015-06-29 | 2016-06-09 | Steckverbinder aus einem band aus einer aluminium-legierung |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107735846A CN107735846A (zh) | 2018-02-23 |
| CN107735846B true CN107735846B (zh) | 2019-12-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201680033150.XA Active CN107735846B (zh) | 2015-06-29 | 2016-06-09 | 铝合金带材制成的插接器 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US10851441B2 (zh) |
| EP (1) | EP3314625B1 (zh) |
| CN (1) | CN107735846B (zh) |
| DE (1) | DE102015009944B4 (zh) |
| ES (1) | ES2964896T3 (zh) |
| HU (1) | HUE064587T2 (zh) |
| MX (1) | MX2017016392A (zh) |
| PL (1) | PL3314625T3 (zh) |
| WO (1) | WO2017001042A1 (zh) |
Citations (7)
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|---|---|---|---|---|
| DE2551947A1 (de) * | 1974-11-19 | 1976-05-20 | Sumitomo Chemical Co | Verfahren zum kontinuierlichen elektrolytischen faerben von anodisch oxidierten baendern oder draehten aus aluminium oder dessen legierungen |
| EP1284301A1 (en) * | 2001-08-14 | 2003-02-19 | Marjan, Inc. | Tin-silver coatings |
| EP1788585A1 (en) * | 2004-09-10 | 2007-05-23 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) | Conductive material for connecting part and method for manufacturing the conductive material |
| EP2182093A1 (en) * | 2007-06-29 | 2010-05-05 | The Furukawa Electric Co., Ltd. | Metal material, method for producing the same, and electrical electronic component using the same |
| CN101752022A (zh) * | 2008-12-01 | 2010-06-23 | 日立电线株式会社 | 覆锡的铝材料 |
| EP2799595A1 (de) * | 2013-05-03 | 2014-11-05 | Delphi Technologies, Inc. | Elektrisches Kontaktelement |
| CN104604036A (zh) * | 2012-08-31 | 2015-05-06 | 株式会社自动网络技术研究所 | 连接器用镀敷端子以及端子对 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3489657A (en) * | 1968-09-30 | 1970-01-13 | Sylvania Electric Prod | Process for producing solderable aluminum materials |
| US4059494A (en) | 1974-11-19 | 1977-11-22 | Sumitomo Aluminum Smelting Co., Ltd. | Process for continuous electrolytic coloring of aluminum or aluminum base alloy strip and wire |
| TWM337574U (en) * | 2007-10-19 | 2008-08-01 | Microsolar Corp | Aluminum substrate able to be subject to welding |
| CN102379050B (zh) | 2009-02-04 | 2014-06-11 | 应用材料公司 | 用于电池和超电容器的多孔三维铜、锡、铜锡、铜锡钴、及铜锡钴钛电极 |
-
2015
- 2015-07-30 DE DE102015009944.2A patent/DE102015009944B4/de active Active
-
2016
- 2016-06-09 WO PCT/EP2016/000949 patent/WO2017001042A1/de active Application Filing
- 2016-06-09 HU HUE16727958A patent/HUE064587T2/hu unknown
- 2016-06-09 MX MX2017016392A patent/MX2017016392A/es unknown
- 2016-06-09 ES ES16727958T patent/ES2964896T3/es active Active
- 2016-06-09 PL PL16727958.7T patent/PL3314625T3/pl unknown
- 2016-06-09 EP EP16727958.7A patent/EP3314625B1/de active Active
- 2016-06-09 CN CN201680033150.XA patent/CN107735846B/zh active Active
-
2017
- 2017-12-29 US US15/857,741 patent/US10851441B2/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2551947A1 (de) * | 1974-11-19 | 1976-05-20 | Sumitomo Chemical Co | Verfahren zum kontinuierlichen elektrolytischen faerben von anodisch oxidierten baendern oder draehten aus aluminium oder dessen legierungen |
| EP1284301A1 (en) * | 2001-08-14 | 2003-02-19 | Marjan, Inc. | Tin-silver coatings |
| EP1788585A1 (en) * | 2004-09-10 | 2007-05-23 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) | Conductive material for connecting part and method for manufacturing the conductive material |
| EP2182093A1 (en) * | 2007-06-29 | 2010-05-05 | The Furukawa Electric Co., Ltd. | Metal material, method for producing the same, and electrical electronic component using the same |
| CN101752022A (zh) * | 2008-12-01 | 2010-06-23 | 日立电线株式会社 | 覆锡的铝材料 |
| CN104604036A (zh) * | 2012-08-31 | 2015-05-06 | 株式会社自动网络技术研究所 | 连接器用镀敷端子以及端子对 |
| EP2799595A1 (de) * | 2013-05-03 | 2014-11-05 | Delphi Technologies, Inc. | Elektrisches Kontaktelement |
Also Published As
| Publication number | Publication date |
|---|---|
| ES2964896T3 (es) | 2024-04-10 |
| HUE064587T2 (hu) | 2024-03-28 |
| EP3314625B1 (de) | 2023-10-11 |
| PL3314625T3 (pl) | 2024-03-11 |
| US20180119253A1 (en) | 2018-05-03 |
| DE102015009944A1 (de) | 2016-12-29 |
| CN107735846A (zh) | 2018-02-23 |
| MX2017016392A (es) | 2018-03-02 |
| WO2017001042A1 (de) | 2017-01-05 |
| EP3314625A1 (de) | 2018-05-02 |
| US10851441B2 (en) | 2020-12-01 |
| EP3314625C0 (de) | 2023-10-11 |
| DE102015009944B4 (de) | 2019-03-14 |
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