DE1266839B - Verfahren und Anordnung zum automatischen Aufsetzen von Schaltungsteilen mit einer Zufuehrvorrichtung auf eine Schaltung mit flaechenhaften Leitungszuegen - Google Patents

Verfahren und Anordnung zum automatischen Aufsetzen von Schaltungsteilen mit einer Zufuehrvorrichtung auf eine Schaltung mit flaechenhaften Leitungszuegen

Info

Publication number
DE1266839B
DE1266839B DEJ30856A DEJ0030856A DE1266839B DE 1266839 B DE1266839 B DE 1266839B DE J30856 A DEJ30856 A DE J30856A DE J0030856 A DEJ0030856 A DE J0030856A DE 1266839 B DE1266839 B DE 1266839B
Authority
DE
Germany
Prior art keywords
semiconductor wafer
contacts
aligner
arrangement
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DEJ30856A
Other languages
German (de)
English (en)
Inventor
George Clayton Beck
Kendall Clark
Eugene Joseph Creighton
Joseph George Drop
Jean Joseph Louis Godat
George Richard Santillo Jun
Arne Hienrich Larsen
Thomas John Rajac
Walter Joseph Schuelke
Frank Louis De Turris
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE1266839B publication Critical patent/DE1266839B/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
    • Y10T29/53043—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor including means to divert defective work part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Treatment Of Fiber Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DEJ30856A 1965-05-27 1966-05-17 Verfahren und Anordnung zum automatischen Aufsetzen von Schaltungsteilen mit einer Zufuehrvorrichtung auf eine Schaltung mit flaechenhaften Leitungszuegen Withdrawn DE1266839B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US45917965A 1965-05-27 1965-05-27

Publications (1)

Publication Number Publication Date
DE1266839B true DE1266839B (de) 1968-04-25

Family

ID=23823726

Family Applications (1)

Application Number Title Priority Date Filing Date
DEJ30856A Withdrawn DE1266839B (de) 1965-05-27 1966-05-17 Verfahren und Anordnung zum automatischen Aufsetzen von Schaltungsteilen mit einer Zufuehrvorrichtung auf eine Schaltung mit flaechenhaften Leitungszuegen

Country Status (6)

Country Link
US (1) US3499203A (enExample)
CH (1) CH475691A (enExample)
DE (1) DE1266839B (enExample)
FR (1) FR1480578A (enExample)
NL (1) NL6607264A (enExample)
SE (1) SE335759B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2858098C2 (de) * 1977-12-08 1986-07-17 Universal Instruments Corp., Binghamton, N.Y. Vorrichtung zum Aufbringen von rechteckigen oder länglichen Chips auf eine Leiterplatte

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3709378A (en) * 1971-03-04 1973-01-09 Ibm Aligning and orienting apparatus
US4372802A (en) * 1980-06-02 1983-02-08 Tokyo Denki Kagaku Kogyo Kabushiki Kaisha Apparatus for mounting chip type circuit elements on printed circuit boards
US4458412A (en) * 1981-05-06 1984-07-10 Universal Instruments Corporation Leadless chip placement machine for printed circuit boards
US4501064A (en) * 1981-09-08 1985-02-26 Usm Corporation Micro component assembly machine
US4593462A (en) * 1984-09-24 1986-06-10 Tdk Corporation Apparatus for automatically mounting chip-type circuit elements on substrate
US5788143A (en) * 1992-04-08 1998-08-04 International Business Machines Corporation Solder particle deposition
US6016949A (en) * 1997-07-01 2000-01-25 International Business Machines Corporation Integrated placement and soldering pickup head and method of using
US7686521B2 (en) * 2003-11-10 2010-03-30 Finisar Corporation Zero force socket for laser / photodiode alignment
JP4734857B2 (ja) * 2004-06-25 2011-07-27 シンフォニアテクノロジー株式会社 Ｉｃチップ実装体の製造装置
US7555832B2 (en) * 2007-03-19 2009-07-07 Infineon Technologies Ag Semiconductor chip attachment
TW201432319A (zh) * 2013-02-05 2014-08-16 Hon Hai Prec Ind Co Ltd 光纖連接器組裝裝置
CN104330549B (zh) * 2013-04-03 2017-01-25 艾博生物医药(杭州)有限公司 一种识别检测板的正反两面的装置及方法
JP6146266B2 (ja) * 2013-11-07 2017-06-14 富士通株式会社 電力供給機構及びラック型装置
SE538792C2 (en) * 2015-02-06 2016-11-29 Stora Enso Oyj Apparatus and method for component assembly
CN118833902A (zh) * 2024-08-09 2024-10-25 江苏新纪元环保有限公司 一种可自动排污的循环净水设备及其使用方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE557117A (enExample) * 1956-05-01
FR1173478A (fr) * 1956-04-05 1959-02-25 Gen Electric Co Ltd Machine automatique notamment pour monter des éléments électriques sur des bases imprimées
DE1092971B (de) * 1958-06-19 1960-11-17 Gen Electric Co Ltd Automatische Maschine zum Anbringen von elektrischen Bauelementen an Traegerplatten
DE1146931B (de) * 1960-09-27 1963-04-11 Philips Nv Verfahren und Maschine zum mechanischen Einsetzen von einseitig mit parallelen Anschlussdraehten oder Stiften versehenen elektrischen Einzelteilen in eine Montageplatte

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2494474A (en) * 1949-01-12 1950-01-10 Western Electric Co Apparatus for soldering lead wires to electrical units
US2970370A (en) * 1957-11-19 1961-02-07 Philco Corp Fabrication of electrical devices
US2915201A (en) * 1958-02-12 1959-12-01 Sylvania Electric Prod Suction transfer mechanism
US3056317A (en) * 1959-09-02 1962-10-02 Western Electric Co Article manipulating and processing apparatus
US3165818A (en) * 1960-10-18 1965-01-19 Kulicke & Soffa Mfg Co Method for mounting and bonding semiconductor wafers
US3083291A (en) * 1960-10-18 1963-03-26 Kulicke & Soffa Mfg Co Device for mounting and bonding semiconductor wafers
US3134167A (en) * 1962-06-08 1964-05-26 Warwick Mfg Corp Component inserting equipment
GB1114393A (en) * 1964-12-23 1968-05-22 Ibm Improvements in or relating to apparatus for sensing the orientation of an object
US3314296A (en) * 1965-05-27 1967-04-18 Ibm Indexing drive mechanism
US3344900A (en) * 1965-05-27 1967-10-03 Ibm Chip orienting control circuit for a chip positioning machine
US3337941A (en) * 1965-05-27 1967-08-29 Ibm Recycle control circuit for a chip positioning machine

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1173478A (fr) * 1956-04-05 1959-02-25 Gen Electric Co Ltd Machine automatique notamment pour monter des éléments électriques sur des bases imprimées
BE557117A (enExample) * 1956-05-01
DE1092971B (de) * 1958-06-19 1960-11-17 Gen Electric Co Ltd Automatische Maschine zum Anbringen von elektrischen Bauelementen an Traegerplatten
DE1146931B (de) * 1960-09-27 1963-04-11 Philips Nv Verfahren und Maschine zum mechanischen Einsetzen von einseitig mit parallelen Anschlussdraehten oder Stiften versehenen elektrischen Einzelteilen in eine Montageplatte

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2858098C2 (de) * 1977-12-08 1986-07-17 Universal Instruments Corp., Binghamton, N.Y. Vorrichtung zum Aufbringen von rechteckigen oder länglichen Chips auf eine Leiterplatte

Also Published As

Publication number Publication date
CH475691A (de) 1969-07-15
FR1480578A (fr) 1967-05-12
SE335759B (enExample) 1971-06-07
US3499203A (en) 1970-03-10
NL6607264A (enExample) 1966-11-28

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Legal Events

Date Code Title Description
E77 Valid patent as to the heymanns-index 1977
EHJ Ceased/non-payment of the annual fee