FR1480578A - Machine permettant la mise en place de blocs semi-conducteurs - Google Patents

Machine permettant la mise en place de blocs semi-conducteurs

Info

Publication number
FR1480578A
FR1480578A FR7819A FR06007819A FR1480578A FR 1480578 A FR1480578 A FR 1480578A FR 7819 A FR7819 A FR 7819A FR 06007819 A FR06007819 A FR 06007819A FR 1480578 A FR1480578 A FR 1480578A
Authority
FR
France
Prior art keywords
placement
semiconductor blocks
machine allowing
allowing
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7819A
Other languages
English (en)
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of FR1480578A publication Critical patent/FR1480578A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0478—Apparatus for manufacture or treatment the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
    • Y10T29/53043—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor including means to divert defective work part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Treatment Of Fiber Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
FR7819A 1965-05-27 1966-05-10 Machine permettant la mise en place de blocs semi-conducteurs Expired FR1480578A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US45917965A 1965-05-27 1965-05-27

Publications (1)

Publication Number Publication Date
FR1480578A true FR1480578A (fr) 1967-05-12

Family

ID=23823726

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7819A Expired FR1480578A (fr) 1965-05-27 1966-05-10 Machine permettant la mise en place de blocs semi-conducteurs

Country Status (6)

Country Link
US (1) US3499203A (enExample)
CH (1) CH475691A (enExample)
DE (1) DE1266839B (enExample)
FR (1) FR1480578A (enExample)
NL (1) NL6607264A (enExample)
SE (1) SE335759B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2128293A1 (enExample) * 1971-03-04 1972-10-20 Ibm

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4151945A (en) * 1977-12-08 1979-05-01 Universal Instruments Corporation Automated hybrid circuit board assembly apparatus
US4372802A (en) * 1980-06-02 1983-02-08 Tokyo Denki Kagaku Kogyo Kabushiki Kaisha Apparatus for mounting chip type circuit elements on printed circuit boards
US4458412A (en) * 1981-05-06 1984-07-10 Universal Instruments Corporation Leadless chip placement machine for printed circuit boards
US4501064A (en) * 1981-09-08 1985-02-26 Usm Corporation Micro component assembly machine
US4593462A (en) * 1984-09-24 1986-06-10 Tdk Corporation Apparatus for automatically mounting chip-type circuit elements on substrate
US5788143A (en) * 1992-04-08 1998-08-04 International Business Machines Corporation Solder particle deposition
US6016949A (en) * 1997-07-01 2000-01-25 International Business Machines Corporation Integrated placement and soldering pickup head and method of using
US7686521B2 (en) * 2003-11-10 2010-03-30 Finisar Corporation Zero force socket for laser / photodiode alignment
JP4734857B2 (ja) * 2004-06-25 2011-07-27 シンフォニアテクノロジー株式会社 Ｉｃチップ実装体の製造装置
US7555832B2 (en) * 2007-03-19 2009-07-07 Infineon Technologies Ag Semiconductor chip attachment
TW201432319A (zh) * 2013-02-05 2014-08-16 Hon Hai Prec Ind Co Ltd 光纖連接器組裝裝置
CN104330549B (zh) * 2013-04-03 2017-01-25 艾博生物医药(杭州)有限公司 一种识别检测板的正反两面的装置及方法
JP6146266B2 (ja) * 2013-11-07 2017-06-14 富士通株式会社 電力供給機構及びラック型装置
SE538792C2 (en) 2015-02-06 2016-11-29 Stora Enso Oyj Apparatus and method for component assembly
CN118833902A (zh) * 2024-08-09 2024-10-25 江苏新纪元环保有限公司 一种可自动排污的循环净水设备及其使用方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2494474A (en) * 1949-01-12 1950-01-10 Western Electric Co Apparatus for soldering lead wires to electrical units
FR1173478A (fr) * 1956-04-05 1959-02-25 Gen Electric Co Ltd Machine automatique notamment pour monter des éléments électriques sur des bases imprimées
BE557117A (enExample) * 1956-05-01
US2970370A (en) * 1957-11-19 1961-02-07 Philco Corp Fabrication of electrical devices
US2915201A (en) * 1958-02-12 1959-12-01 Sylvania Electric Prod Suction transfer mechanism
GB865924A (en) * 1958-06-19 1961-04-26 Gen Electric Co Ltd Improvements in or relating to automatic machines for mounting electrical componentson base members
US3056317A (en) * 1959-09-02 1962-10-02 Western Electric Co Article manipulating and processing apparatus
US3190523A (en) * 1960-09-27 1965-06-22 Philips Corp Component inserting machine
US3083291A (en) * 1960-10-18 1963-03-26 Kulicke & Soffa Mfg Co Device for mounting and bonding semiconductor wafers
US3165818A (en) * 1960-10-18 1965-01-19 Kulicke & Soffa Mfg Co Method for mounting and bonding semiconductor wafers
US3134167A (en) * 1962-06-08 1964-05-26 Warwick Mfg Corp Component inserting equipment
GB1114393A (en) * 1964-12-23 1968-05-22 Ibm Improvements in or relating to apparatus for sensing the orientation of an object
US3337941A (en) * 1965-05-27 1967-08-29 Ibm Recycle control circuit for a chip positioning machine
US3344900A (en) * 1965-05-27 1967-10-03 Ibm Chip orienting control circuit for a chip positioning machine
US3314296A (en) * 1965-05-27 1967-04-18 Ibm Indexing drive mechanism

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2128293A1 (enExample) * 1971-03-04 1972-10-20 Ibm

Also Published As

Publication number Publication date
CH475691A (de) 1969-07-15
DE1266839B (de) 1968-04-25
US3499203A (en) 1970-03-10
NL6607264A (enExample) 1966-11-28
SE335759B (enExample) 1971-06-07

Similar Documents

Publication Publication Date Title
CH444208A (de) Schienenschleifmaschine
CH444636A (fr) Tamis pour plansichter
AT257076B (de) Druckgießmaschine
FR1480578A (fr) Machine permettant la mise en place de blocs semi-conducteurs
CH462594A (de) Werkzeugmaschine
AT276486B (de) Zusammengesetzte Halbleitervorrichtung
FR1506742A (fr) Monture pour machine-outil
CH464647A (de) Werkzeugmaschine
FR1509408A (fr) Procédé pour obtenir des circuits intégrés isolés
IT1049252B (it) Procedimento per la produzione di composti acilamminici
AT272162B (de) Vorrichtung zum kontinuierlichen Spinnkammer-Spinnen
CH451647A (it) Attrezzo per la formazione di fori sagomati
FR1506109A (fr) Procédé pour fabriquer des circuits intégrés
FR1507018A (fr) Rectifieuse pour profils
FR1440770A (fr) Machine pour la fabrication des cannelloni
FR1485919A (fr) Machine pour la confection des pneumatiques
FR1505172A (fr) Machine pour la confection des pneumatiques
CH444318A (de) Halbleiterbauelement
CH468079A (de) Halbleiterbauelement
CH471501A (de) Halbleiterbauelement zur Schwingungserzeugung
FR1481737A (fr) Semi-conducteur
CH448787A (fr) Machine pour la lapidairerie
CH446539A (de) Halbleiterbauelement
CH430305A (de) Jaucheverteiler
FR1504138A (fr) Machine frigorifique