DE112021000855T5 - Halbleiter-Laservorrichtung - Google Patents

Halbleiter-Laservorrichtung Download PDF

Info

Publication number
DE112021000855T5
DE112021000855T5 DE112021000855.2T DE112021000855T DE112021000855T5 DE 112021000855 T5 DE112021000855 T5 DE 112021000855T5 DE 112021000855 T DE112021000855 T DE 112021000855T DE 112021000855 T5 DE112021000855 T5 DE 112021000855T5
Authority
DE
Germany
Prior art keywords
semiconductor laser
holder
lens
light
laser element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112021000855.2T
Other languages
German (de)
English (en)
Inventor
Hideo Yamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Panasonic Holdings Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Holdings Corp filed Critical Panasonic Holdings Corp
Publication of DE112021000855T5 publication Critical patent/DE112021000855T5/de
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02253—Out-coupling of light using lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4031—Edge-emitting structures
    • H01S5/4062—Edge-emitting structures with an external cavity or using internal filters, e.g. Talbot filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4087—Array arrangements, e.g. constituted by discrete laser diodes or laser bar emitting more than one wavelength
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02251—Out-coupling of light using optical fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02355—Fixing laser chips on mounts
    • H01S5/02365—Fixing laser chips on mounts by clamping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/14—External cavity lasers
    • H01S5/141—External cavity lasers using a wavelength selective device, e.g. a grating or etalon
    • H01S5/143—Littman-Metcalf configuration, e.g. laser - grating - mirror
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4031—Edge-emitting structures
    • H01S5/4068—Edge-emitting structures with lateral coupling by axially offset or by merging waveguides, e.g. Y-couplers

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
DE112021000855.2T 2020-02-03 2021-01-22 Halbleiter-Laservorrichtung Pending DE112021000855T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020016225 2020-02-03
JP2020-016225 2020-02-03
PCT/JP2021/002329 WO2021157396A1 (ja) 2020-02-03 2021-01-22 半導体レーザ装置

Publications (1)

Publication Number Publication Date
DE112021000855T5 true DE112021000855T5 (de) 2022-12-08

Family

ID=77200470

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112021000855.2T Pending DE112021000855T5 (de) 2020-02-03 2021-01-22 Halbleiter-Laservorrichtung

Country Status (5)

Country Link
US (1) US20230110167A1 (zh)
JP (1) JPWO2021157396A1 (zh)
CN (1) CN115053417A (zh)
DE (1) DE112021000855T5 (zh)
WO (1) WO2021157396A1 (zh)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000137139A (ja) 1998-10-30 2000-05-16 Vitalij Lissotschenko 光学的光束変換装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5420722A (en) * 1993-10-25 1995-05-30 Creo Products Inc. Self-registering microlens for laser diodes
JP2828025B2 (ja) * 1996-03-29 1998-11-25 日本電気株式会社 半導体レーザモジュール
DE10258745A1 (de) * 2002-12-13 2004-07-08 Hentze-Lissotschenko Patentverwaltungs Gmbh & Co.Kg Halbleiterlaservorrichtung, Halbleiterlaserbaustein für eine derartige Halbleiterlaservorrichtung sowie ein Verfahren zur Herstellung einer derartigen Halbleiterlaservorrichtung
US9229169B2 (en) * 2011-08-16 2016-01-05 International Business Machines Corporation Lens array optical coupling to photonic chip
JP7174899B2 (ja) * 2017-07-07 2022-11-18 パナソニックＩｐマネジメント株式会社 半導体レーザ装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000137139A (ja) 1998-10-30 2000-05-16 Vitalij Lissotschenko 光学的光束変換装置

Also Published As

Publication number Publication date
JPWO2021157396A1 (zh) 2021-08-12
CN115053417A (zh) 2022-09-13
WO2021157396A1 (ja) 2021-08-12
US20230110167A1 (en) 2023-04-13

Similar Documents

Publication Publication Date Title
DE60210010T2 (de) Kollimationssystem für Laserdiode
DE102010031199B4 (de) Vorrichtung und Verfahren zur Strahlformung
DE112012004608T5 (de) Optischer Aufbau zur Linienerzeugung unter Verwendung eines Mikrolinsenarrays
DE112016001820B4 (de) Laservorrichtung und licht-erzeugungsvorrichtung für extrem ultraviolette strahlung
DE102009054869B4 (de) Spiegel zur Führung eines Strahlungsbündels, Vorrichtungen mit einem derartigen Spiegel sowie Verfahren zur Herstellung mikro- oder nanostrukturierter Bauelemente
WO2016166313A1 (de) Optoelektronische leuchtvorrichtung
DE112016002700T5 (de) Fahrzeuglichtquelleneinheit
DE19813127A1 (de) Laservorrichtung
DE112017000722T5 (de) Strahlformungs-einrichtung und laser-oszillator
DE112015004631B4 (de) Laserbauelement und Verfahren zu seiner Herstellung
DE102010047805A1 (de) Laserbearbeitungsvorrichtung
DE102014000510A1 (de) Halbleiterlaser mit anisotroper Wärmeableitung
DE112015004794T5 (de) Laserlichtquellenvorrichtung
DE112018001247T5 (de) Wellenlängen kombinierende laservorrichtung
DE112017000841T5 (de) Halbleiterlaser-lichtquelleneinrichtung
DE112016002251T5 (de) Spannungsgesteuerte diodenlaserbaugruppen mit niedrigem wärmewiderstand
DE112019006816B4 (de) Lasergerät und Laserbearbeitungsmaschine
DE112021000855T5 (de) Halbleiter-Laservorrichtung
DE102013105467B4 (de) Diodenlaser, Laserbearbeitungsvorrichtung und Laserbehandlungsvorrichtung
DE102013006316B4 (de) Optikbaugruppe und Lasermodul mit Optikbaugruppe
DE112022003241T5 (de) Laserkomponente und Laserbauteil
WO2004038481A1 (de) Vorrichtung zur aufnahme eines strahlteilerelements
DE102018121857A1 (de) Vorrichtung zum Betreiben eines lichtemittierenden Halbleiterbauelements
DE102014222952A1 (de) Verfahren zum Herstellen eines Verbundstruktur, Verbundstruktur, insbesondere Facettenspiegel, und optische Anordnung damit
DE102010038571A1 (de) Vorrichtung und Verfahren zur Strahlformung