DE112018002439A5 - Abdeckung für ein optoelektronisches Bauelement und optoelektronisches Bauteil - Google Patents

Abdeckung für ein optoelektronisches Bauelement und optoelektronisches Bauteil Download PDF

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Publication number
DE112018002439A5
DE112018002439A5 DE112018002439.3T DE112018002439T DE112018002439A5 DE 112018002439 A5 DE112018002439 A5 DE 112018002439A5 DE 112018002439 T DE112018002439 T DE 112018002439T DE 112018002439 A5 DE112018002439 A5 DE 112018002439A5
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DE
Germany
Prior art keywords
optoelectronic component
cover
optoelectronic
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE112018002439.3T
Other languages
English (en)
Other versions
DE112018002439B4 (de
Inventor
Wolfgang Neumann
Jörn Kampmeier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of DE112018002439A5 publication Critical patent/DE112018002439A5/de
Application granted granted Critical
Publication of DE112018002439B4 publication Critical patent/DE112018002439B4/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H01S5/02216—Butterfly-type, i.e. with electrode pins extending horizontally from the housings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B23K26/24—Seam welding
    • B23K26/26—Seam welding of rectilinear seams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/32—Bonding taking account of the properties of the material involved
    • B23K26/324—Bonding taking account of the properties of the material involved involving non-metallic parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02257—Out-coupling of light using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Led Device Packages (AREA)
  • Semiconductor Lasers (AREA)
DE112018002439.3T 2017-05-12 2018-05-09 Abdeckung für ein optoelektronisches Bauelement und optoelektronisches Bauteil Active DE112018002439B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102017110317.1 2017-05-12
DE102017110317.1A DE102017110317A1 (de) 2017-05-12 2017-05-12 Abdeckung für ein optoelektronisches Bauelement und optoelektronisches Bauteil
PCT/EP2018/062134 WO2018206717A1 (de) 2017-05-12 2018-05-09 Abdeckung für ein optoelektronisches bauelement und optoelektronisches bauteil

Publications (2)

Publication Number Publication Date
DE112018002439A5 true DE112018002439A5 (de) 2020-01-23
DE112018002439B4 DE112018002439B4 (de) 2023-08-03

Family

ID=62143206

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102017110317.1A Withdrawn DE102017110317A1 (de) 2017-05-12 2017-05-12 Abdeckung für ein optoelektronisches Bauelement und optoelektronisches Bauteil
DE112018002439.3T Active DE112018002439B4 (de) 2017-05-12 2018-05-09 Abdeckung für ein optoelektronisches Bauelement und optoelektronisches Bauteil

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102017110317.1A Withdrawn DE102017110317A1 (de) 2017-05-12 2017-05-12 Abdeckung für ein optoelektronisches Bauelement und optoelektronisches Bauteil

Country Status (4)

Country Link
US (1) US11158991B2 (de)
JP (1) JP6905599B2 (de)
DE (2) DE102017110317A1 (de)
WO (1) WO2018206717A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019107003A1 (de) * 2019-03-19 2020-09-24 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Abdeckung für ein optoelektronisches Bauteil, optoelektronisches Bauteil, Verwendung eines optoelektronischen Bauteils und Verfahren zur Herstellung einer Abdeckung für ein optoelektronisches Bauteil
JP7152670B2 (ja) * 2019-09-20 2022-10-13 日亜化学工業株式会社 光源装置およびその製造方法
EP4033621B1 (de) 2019-09-20 2023-11-01 Nichia Corporation Lichtquellenvorrichtung und verfahren zur herstellung davon
JP2023521798A (ja) * 2020-04-15 2023-05-25 エクセリタス カナダ，インコーポレイテッド 半導体側面放射レーザー用の密閉表面実装パッケージ、及びその形成方法
US20230238770A1 (en) * 2022-01-24 2023-07-27 Materion Corporation Semiconductor package for an edge emitting laser diode
DE102022108870A1 (de) 2022-04-12 2023-10-12 Ams-Osram International Gmbh Verfahren zur herstellung eines optoelektronischen bauteils sowie optoelektronischer bauteilverbund

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07335742A (ja) * 1994-06-15 1995-12-22 Nippondenso Co Ltd 半導体基板およびその製造方法
JP2005122007A (ja) * 2003-10-20 2005-05-12 Nippon Telegr & Teleph Corp <Ntt> 光導波路部品及びその製造方法
JP4869275B2 (ja) 2007-03-26 2012-02-08 三菱電機株式会社 光源モジュール及び発光装置
JP4492733B2 (ja) 2008-05-27 2010-06-30 ソニー株式会社 発光装置及び発光装置の製造方法
US7905639B2 (en) 2008-05-28 2011-03-15 Osram Sylvania Inc. Side-loaded light emitting diode module for automotive rear combination lamps
US7762701B2 (en) 2008-05-28 2010-07-27 Osram Sylvania Inc. Rear-loaded light emitting diode module for automotive rear combination lamps
CN101592303B (zh) * 2008-05-28 2012-12-26 奥斯兰姆施尔凡尼亚公司 用于机动车后组合灯的后载式发光二极管模块
DE102010008605A1 (de) * 2010-02-19 2011-08-25 OSRAM Opto Semiconductors GmbH, 93055 Optoelektronisches Bauteil
DE102010054898A1 (de) 2010-12-17 2012-06-21 Osram Opto Semiconductors Gmbh Träger für einen optoelektronischen Halbleiterchip und Halbleiterchip
GB2498347A (en) * 2012-01-10 2013-07-17 Design Led Products Ltd A lighting panel with side mounted top emitting LEDs
CN103199177A (zh) * 2013-02-26 2013-07-10 日月光半导体制造股份有限公司 光学组件的制造方法
JP2015028997A (ja) * 2013-07-30 2015-02-12 日亜化学工業株式会社 発光装置及びその製造方法
JP6564206B2 (ja) * 2015-03-09 2019-08-21 スタンレー電気株式会社 発光装置

Also Published As

Publication number Publication date
JP2020520115A (ja) 2020-07-02
JP6905599B2 (ja) 2021-07-21
WO2018206717A1 (de) 2018-11-15
US11158991B2 (en) 2021-10-26
DE112018002439B4 (de) 2023-08-03
DE102017110317A1 (de) 2018-11-15
US20200144785A1 (en) 2020-05-07

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