DE112017002011A5 - Lichtemittierendes bauteil - Google Patents

Lichtemittierendes bauteil Download PDF

Info

Publication number
DE112017002011A5
DE112017002011A5 DE112017002011.5T DE112017002011T DE112017002011A5 DE 112017002011 A5 DE112017002011 A5 DE 112017002011A5 DE 112017002011 T DE112017002011 T DE 112017002011T DE 112017002011 A5 DE112017002011 A5 DE 112017002011A5
Authority
DE
Germany
Prior art keywords
light
emitting component
emitting
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112017002011.5T
Other languages
English (en)
Inventor
Hubert Halbritter
Roland Enzmann
Andreas Wojcik
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of DE112017002011A5 publication Critical patent/DE112017002011A5/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02255—Out-coupling of light using beam deflecting elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02218—Material of the housings; Filling of the housings
    • H01S5/02234—Resin-filled housings; the housings being made of resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/0232—Lead-frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H01S5/02216—Butterfly-type, i.e. with electrode pins extending horizontally from the housings

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
DE112017002011.5T 2016-04-14 2017-04-12 Lichtemittierendes bauteil Pending DE112017002011A5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102016106896.9 2016-04-14
DE102016106896.9A DE102016106896A1 (de) 2016-04-14 2016-04-14 Lichtemittierendes Bauteil
PCT/EP2017/058774 WO2017178525A1 (de) 2016-04-14 2017-04-12 Lichtemittierendes bauteil

Publications (1)

Publication Number Publication Date
DE112017002011A5 true DE112017002011A5 (de) 2019-01-24

Family

ID=58537008

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102016106896.9A Withdrawn DE102016106896A1 (de) 2016-04-14 2016-04-14 Lichtemittierendes Bauteil
DE112017002011.5T Pending DE112017002011A5 (de) 2016-04-14 2017-04-12 Lichtemittierendes bauteil

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102016106896.9A Withdrawn DE102016106896A1 (de) 2016-04-14 2016-04-14 Lichtemittierendes Bauteil

Country Status (3)

Country Link
US (1) US11355897B2 (de)
DE (2) DE102016106896A1 (de)
WO (1) WO2017178525A1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2022239653A1 (de) * 2021-05-14 2022-11-17

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AU659270B2 (en) * 1992-02-20 1995-05-11 Sony Corporation Laser light beam generating apparatus
JPH07142803A (ja) * 1993-11-12 1995-06-02 Fuji Photo Film Co Ltd レーザーダイオードポンピング固体レーザー
DE19944042A1 (de) * 1999-09-14 2001-04-12 Siemens Ag Beleuchtungseinheit für eine Vorrichtung für Anwendungen im Bereich der Medizin
DE19952712A1 (de) 1999-11-02 2001-05-10 Osram Opto Semiconductors Gmbh Laserdiodenvorrichtung
JP4451951B2 (ja) 1999-12-20 2010-04-14 新日本製鐵株式会社 高強度ばね用鋼材
WO2002091534A1 (fr) * 2001-05-08 2002-11-14 Mitsubishi Denki Kabushiki Kaisha Dispositif de controle de longueur d'onde
US7295592B2 (en) * 2002-03-08 2007-11-13 Sharp Kabushiki Kaisha Light source device and optical communication module employing the device
DE10214119A1 (de) * 2002-03-28 2003-10-23 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
JP2003298115A (ja) 2002-04-05 2003-10-17 Citizen Electronics Co Ltd 発光ダイオード
CN101740560B (zh) * 2003-04-01 2012-11-21 夏普株式会社 发光装置、背侧光照射装置、显示装置
JP2006032885A (ja) 2003-11-18 2006-02-02 Sharp Corp 光源装置およびそれを用いた光通信装置
JP2005252219A (ja) * 2004-02-06 2005-09-15 Toyoda Gosei Co Ltd 発光装置及び封止部材
US8033706B1 (en) * 2004-09-09 2011-10-11 Fusion Optix, Inc. Lightguide comprising a low refractive index region
KR100665219B1 (ko) * 2005-07-14 2007-01-09 삼성전기주식회사 파장변환형 발광다이오드 패키지
US20080035942A1 (en) * 2006-08-08 2008-02-14 Lg Electronics Inc. Light emitting device package and method for manufacturing the same
JP4783718B2 (ja) * 2006-11-27 2011-09-28 新光電気工業株式会社 照明装置
US8052308B2 (en) * 2007-04-18 2011-11-08 Seiko Epson Corporation Light source having wavelength converter and wavelength separating member for reflecting converted light
JPWO2009066430A1 (ja) * 2007-11-19 2011-03-31 パナソニック株式会社 半導体発光装置および半導体発光装置の製造方法
US8337029B2 (en) * 2008-01-17 2012-12-25 Intematix Corporation Light emitting device with phosphor wavelength conversion
DE102010034913B4 (de) * 2010-08-20 2023-03-30 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Strahlung emittierendes Bauelement und Verfahren zur Herstellung des Strahlung emittierenden Bauelements
EP2472578B1 (de) 2010-12-28 2020-06-03 Nichia Corporation Lichtemittierende Vorrichtung
US8888331B2 (en) * 2011-05-09 2014-11-18 Microsoft Corporation Low inductance light source module
JP5980577B2 (ja) * 2012-05-31 2016-08-31 シチズン電子株式会社 側面照射型ｌｅｄ発光装置及び側面照射型ｌｅｄ発光装置の製造方法
US8831054B2 (en) * 2013-01-07 2014-09-09 Emcore Corporation Wavelength locking of a laser device
DE102013210103A1 (de) * 2013-05-29 2014-12-18 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
DE102014213406A1 (de) 2014-07-10 2016-01-14 Osram Opto Semiconductors Gmbh Halbleiterlaserbauteil und Kamera
JP6354626B2 (ja) * 2015-03-09 2018-07-11 豊田合成株式会社 発光装置の製造方法
US11431146B2 (en) * 2015-03-27 2022-08-30 Jabil Inc. Chip on submount module
CN106159071A (zh) * 2015-04-23 2016-11-23 鸿富锦精密工业（深圳）有限公司 Led封装体
DE102015108117A1 (de) * 2015-05-22 2016-11-24 Osram Opto Semiconductors Gmbh Bauelement

Also Published As

Publication number Publication date
DE102016106896A1 (de) 2017-10-19
US11355897B2 (en) 2022-06-07
WO2017178525A1 (de) 2017-10-19
US20200119517A1 (en) 2020-04-16

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R083 Amendment of/additions to inventor(s)
R016 Response to examination communication