DE112015000944A5 - Vorrichtung zur nasschemischen Behandlung von Objekten, insbesondere von flachen, insbesondere scheibenförmigen Gegenständen wie Halbleiterscheiben, Substraten oder dergleichen - Google Patents

Vorrichtung zur nasschemischen Behandlung von Objekten, insbesondere von flachen, insbesondere scheibenförmigen Gegenständen wie Halbleiterscheiben, Substraten oder dergleichen Download PDF

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Publication number
DE112015000944A5
DE112015000944A5 DE112015000944.2T DE112015000944T DE112015000944A5 DE 112015000944 A5 DE112015000944 A5 DE 112015000944A5 DE 112015000944 T DE112015000944 T DE 112015000944T DE 112015000944 A5 DE112015000944 A5 DE 112015000944A5
Authority
DE
Germany
Prior art keywords
objects
substrates
wet
chemical treatment
semiconductor wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE112015000944.2T
Other languages
English (en)
Inventor
Egon Ramgraber
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RAMGRABER GmbH
Original Assignee
RAMGRABER GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RAMGRABER GmbH filed Critical RAMGRABER GmbH
Publication of DE112015000944A5 publication Critical patent/DE112015000944A5/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
DE112015000944.2T 2014-02-24 2015-02-16 Vorrichtung zur nasschemischen Behandlung von Objekten, insbesondere von flachen, insbesondere scheibenförmigen Gegenständen wie Halbleiterscheiben, Substraten oder dergleichen Withdrawn DE112015000944A5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE202014100814.4 2014-02-24
DE202014100814.4U DE202014100814U1 (de) 2014-02-24 2014-02-24 Vorrichtung zur nasschemischen Behandlung von Objekten, insbesondere von flachen, insbesondere scheibenförmigen Gegenständen wie Halbleiterscheiben, Substraten oder dergleichen
PCT/DE2015/100063 WO2015124144A1 (de) 2014-02-24 2015-02-16 Vorrichtung zur nasschemischen behandlung von objekten, insbesondere von flachen, insbesondere scheibenförmigen gegenständen wie halbleiterscheiben, substraten oder dergleichen

Publications (1)

Publication Number Publication Date
DE112015000944A5 true DE112015000944A5 (de) 2016-11-17

Family

ID=50556444

Family Applications (2)

Application Number Title Priority Date Filing Date
DE202014100814.4U Expired - Lifetime DE202014100814U1 (de) 2014-02-24 2014-02-24 Vorrichtung zur nasschemischen Behandlung von Objekten, insbesondere von flachen, insbesondere scheibenförmigen Gegenständen wie Halbleiterscheiben, Substraten oder dergleichen
DE112015000944.2T Withdrawn DE112015000944A5 (de) 2014-02-24 2015-02-16 Vorrichtung zur nasschemischen Behandlung von Objekten, insbesondere von flachen, insbesondere scheibenförmigen Gegenständen wie Halbleiterscheiben, Substraten oder dergleichen

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE202014100814.4U Expired - Lifetime DE202014100814U1 (de) 2014-02-24 2014-02-24 Vorrichtung zur nasschemischen Behandlung von Objekten, insbesondere von flachen, insbesondere scheibenförmigen Gegenständen wie Halbleiterscheiben, Substraten oder dergleichen

Country Status (3)

Country Link
EP (1) EP3111470A1 (de)
DE (2) DE202014100814U1 (de)
WO (1) WO2015124144A1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114937632A (zh) * 2022-07-25 2022-08-23 华海清科股份有限公司 一种应用于晶圆处理的双向气封结构和晶圆处理装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3300112B2 (ja) * 1993-07-20 2002-07-08 富士通株式会社 半導体装置の製造方法及び半導体装置の製造装置
KR101025323B1 (ko) * 2004-01-13 2011-03-29 가부시키가이샤 아루박 에칭 장치 및 에칭 방법
US20100024847A1 (en) * 2008-08-01 2010-02-04 Breese Ronald G Semiconductor wafer cleaning with dilute acids

Also Published As

Publication number Publication date
EP3111470A1 (de) 2017-01-04
WO2015124144A1 (de) 2015-08-27
DE202014100814U1 (de) 2014-03-14

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Legal Events

Date Code Title Description
R082 Change of representative

Representative=s name: BUCHER, RALF, DIPL.-ING. UNIV., DE

R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee