DE112015000944A5 - Vorrichtung zur nasschemischen Behandlung von Objekten, insbesondere von flachen, insbesondere scheibenförmigen Gegenständen wie Halbleiterscheiben, Substraten oder dergleichen - Google Patents
Vorrichtung zur nasschemischen Behandlung von Objekten, insbesondere von flachen, insbesondere scheibenförmigen Gegenständen wie Halbleiterscheiben, Substraten oder dergleichen Download PDFInfo
- Publication number
- DE112015000944A5 DE112015000944A5 DE112015000944.2T DE112015000944T DE112015000944A5 DE 112015000944 A5 DE112015000944 A5 DE 112015000944A5 DE 112015000944 T DE112015000944 T DE 112015000944T DE 112015000944 A5 DE112015000944 A5 DE 112015000944A5
- Authority
- DE
- Germany
- Prior art keywords
- objects
- substrates
- wet
- chemical treatment
- semiconductor wafers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE202014100814.4 | 2014-02-24 | ||
DE202014100814.4U DE202014100814U1 (de) | 2014-02-24 | 2014-02-24 | Vorrichtung zur nasschemischen Behandlung von Objekten, insbesondere von flachen, insbesondere scheibenförmigen Gegenständen wie Halbleiterscheiben, Substraten oder dergleichen |
PCT/DE2015/100063 WO2015124144A1 (de) | 2014-02-24 | 2015-02-16 | Vorrichtung zur nasschemischen behandlung von objekten, insbesondere von flachen, insbesondere scheibenförmigen gegenständen wie halbleiterscheiben, substraten oder dergleichen |
Publications (1)
Publication Number | Publication Date |
---|---|
DE112015000944A5 true DE112015000944A5 (de) | 2016-11-17 |
Family
ID=50556444
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE202014100814.4U Expired - Lifetime DE202014100814U1 (de) | 2014-02-24 | 2014-02-24 | Vorrichtung zur nasschemischen Behandlung von Objekten, insbesondere von flachen, insbesondere scheibenförmigen Gegenständen wie Halbleiterscheiben, Substraten oder dergleichen |
DE112015000944.2T Withdrawn DE112015000944A5 (de) | 2014-02-24 | 2015-02-16 | Vorrichtung zur nasschemischen Behandlung von Objekten, insbesondere von flachen, insbesondere scheibenförmigen Gegenständen wie Halbleiterscheiben, Substraten oder dergleichen |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE202014100814.4U Expired - Lifetime DE202014100814U1 (de) | 2014-02-24 | 2014-02-24 | Vorrichtung zur nasschemischen Behandlung von Objekten, insbesondere von flachen, insbesondere scheibenförmigen Gegenständen wie Halbleiterscheiben, Substraten oder dergleichen |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP3111470A1 (de) |
DE (2) | DE202014100814U1 (de) |
WO (1) | WO2015124144A1 (de) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114937632A (zh) * | 2022-07-25 | 2022-08-23 | 华海清科股份有限公司 | 一种应用于晶圆处理的双向气封结构和晶圆处理装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3300112B2 (ja) * | 1993-07-20 | 2002-07-08 | 富士通株式会社 | 半導体装置の製造方法及び半導体装置の製造装置 |
KR101025323B1 (ko) * | 2004-01-13 | 2011-03-29 | 가부시키가이샤 아루박 | 에칭 장치 및 에칭 방법 |
US20100024847A1 (en) * | 2008-08-01 | 2010-02-04 | Breese Ronald G | Semiconductor wafer cleaning with dilute acids |
-
2014
- 2014-02-24 DE DE202014100814.4U patent/DE202014100814U1/de not_active Expired - Lifetime
-
2015
- 2015-02-16 DE DE112015000944.2T patent/DE112015000944A5/de not_active Withdrawn
- 2015-02-16 WO PCT/DE2015/100063 patent/WO2015124144A1/de active Application Filing
- 2015-02-16 EP EP15715138.2A patent/EP3111470A1/de not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
EP3111470A1 (de) | 2017-01-04 |
WO2015124144A1 (de) | 2015-08-27 |
DE202014100814U1 (de) | 2014-03-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R082 | Change of representative |
Representative=s name: BUCHER, RALF, DIPL.-ING. UNIV., DE |
|
R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee |