DE112010003585T5 - Rfic-schnittstellen und millimeterwellenstrukturen - Google Patents

Rfic-schnittstellen und millimeterwellenstrukturen Download PDF

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Publication number
DE112010003585T5
DE112010003585T5 DE112010003585T DE112010003585T DE112010003585T5 DE 112010003585 T5 DE112010003585 T5 DE 112010003585T5 DE 112010003585 T DE112010003585 T DE 112010003585T DE 112010003585 T DE112010003585 T DE 112010003585T DE 112010003585 T5 DE112010003585 T5 DE 112010003585T5
Authority
DE
Germany
Prior art keywords
electrically conductive
cavity
pcb
probe
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE112010003585T
Other languages
German (de)
English (en)
Inventor
Amir Shmuel
Yigal LEIBA
Baruch SCHWARZ
Yonatan Biran
Elad DAYAN
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siklu Communication Ltd
Original Assignee
Siklu Communication Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US12/554,987 external-priority patent/US8912858B2/en
Priority claimed from US12/791,936 external-priority patent/US8536954B2/en
Application filed by Siklu Communication Ltd filed Critical Siklu Communication Ltd
Publication of DE112010003585T5 publication Critical patent/DE112010003585T5/de
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced lines or devices with unbalanced lines or devices
    • H01P5/107—Hollow-waveguide/strip-line transitions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
    • H01P5/022—Transitions between lines of the same kind and shape, but with different dimensions
    • H01P5/028—Transitions between lines of the same kind and shape, but with different dimensions between strip lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0485—Dielectric resonator antennas
    • H01Q9/0492—Dielectric resonator antennas circularly polarised
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Waveguides (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
DE112010003585T 2009-09-08 2010-09-07 Rfic-schnittstellen und millimeterwellenstrukturen Withdrawn DE112010003585T5 (de)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US12/554,987 2009-09-08
US12/554,987 US8912858B2 (en) 2009-09-08 2009-09-08 Interfacing between an integrated circuit and a waveguide through a cavity located in a soft laminate
US12/791,936 2010-06-02
US12/791,936 US8536954B2 (en) 2010-06-02 2010-06-02 Millimeter wave multi-layer packaging including an RFIC cavity and a radiating cavity therein
US38021710P 2010-09-04 2010-09-04
US61/380,217 2010-09-04
PCT/IB2010/054004 WO2011030277A2 (fr) 2009-09-08 2010-09-07 Interfaces de puce de radiofréquence (rfic) et structures d'onde millimétrique

Publications (1)

Publication Number Publication Date
DE112010003585T5 true DE112010003585T5 (de) 2012-11-22

Family

ID=43732882

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112010003585T Withdrawn DE112010003585T5 (de) 2009-09-08 2010-09-07 Rfic-schnittstellen und millimeterwellenstrukturen

Country Status (2)

Country Link
DE (1) DE112010003585T5 (fr)
WO (1) WO2011030277A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3492881A1 (fr) * 2017-12-04 2019-06-05 VEGA Grieshaber KG Carte de circuits imprimés pour un appareil de mesure de niveau de remplissage radar pourvue de couplage du guide d'onde

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8912858B2 (en) 2009-09-08 2014-12-16 Siklu Communication ltd. Interfacing between an integrated circuit and a waveguide through a cavity located in a soft laminate
US8536954B2 (en) 2010-06-02 2013-09-17 Siklu Communication ltd. Millimeter wave multi-layer packaging including an RFIC cavity and a radiating cavity therein
EP2676321B1 (fr) * 2011-07-04 2018-09-05 Huawei Technologies Co., Ltd. Agencement de couplage
WO2012167466A1 (fr) 2011-07-04 2012-12-13 Huawei Technologies Co., Ltd. Module et agencement de couplage
DE102012203293B4 (de) 2012-03-02 2021-12-02 Robert Bosch Gmbh Halbleitermodul mit integriertem Wellenleiter für Radarsignale
US9356352B2 (en) 2012-10-22 2016-05-31 Texas Instruments Incorporated Waveguide coupler
DE102015202872A1 (de) * 2015-02-18 2016-08-18 Robert Bosch Gmbh Vorrichtung und Verfahren zum Übertragen eines Hochfrequenzsignals
FR3062525B1 (fr) * 2017-02-01 2020-11-20 Inst Vedecom Antenne a fentes integree dans une carte de circuit imprime et procede de fabrication de celle-ci
CN112701092A (zh) * 2020-12-24 2021-04-23 北京国联万众半导体科技有限公司 毫米波单片集成电路封装结构及其封装方法

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US3255408A (en) * 1963-02-25 1966-06-07 Beloit Corp Instrument for measuring moisture content and the like
CA2059364A1 (fr) * 1991-01-30 1992-07-31 Eric C. Kohls Transition par guide d'ondes pour antenne plane
JPH06204701A (ja) * 1992-11-10 1994-07-22 Sony Corp 偏分波器及び導波管−マイクロストリップライン変換装置
US6573808B1 (en) * 1999-03-12 2003-06-03 Harris Broadband Wireless Access, Inc. Millimeter wave front end
JP2000278009A (ja) * 1999-03-24 2000-10-06 Nec Corp マイクロ波・ミリ波回路装置
US6542048B1 (en) * 2000-04-13 2003-04-01 Raytheon Company Suspended transmission line with embedded signal channeling device
DE10120641B4 (de) * 2000-04-27 2009-04-09 Kyocera Corp. Keramik mit sehr guten Hochfrequenzeigenschaften und Verfahren zu ihrer Herstellung
JP2001339207A (ja) * 2000-05-26 2001-12-07 Kyocera Corp アンテナ給電線路およびそれを用いたアンテナモジュール
SE518100C2 (sv) * 2000-12-04 2002-08-27 Ericsson Telefon Ab L M Riktkopplare, antenngränssnittenhet samt radiobasstation innefattande antenngränssnittenhet
US6545227B2 (en) * 2001-07-11 2003-04-08 Mce/Kdi Corporation Pocket mounted chip having microstrip line
US6822528B2 (en) * 2001-10-11 2004-11-23 Fujitsu Limited Transmission line to waveguide transition including antenna patch and ground ring
US6788171B2 (en) * 2002-03-05 2004-09-07 Xytrans, Inc. Millimeter wave (MMW) radio frequency transceiver module and method of forming same
US7064633B2 (en) * 2002-07-13 2006-06-20 The Chinese University Of Hong Kong Waveguide to laminated waveguide transition and methodology
US7446710B2 (en) * 2005-03-17 2008-11-04 The Chinese University Of Hong Kong Integrated LTCC mm-wave planar array antenna with low loss feeding network
KR100706024B1 (ko) * 2005-10-19 2007-04-12 한국전자통신연구원 밀리미터파 대역 광대역 마이크로스트립-도파관 변환 장치
US7417516B2 (en) * 2005-11-14 2008-08-26 Honeywell International Inc. Monolithic microwave integrated circuit providing power dividing and power monitoring functionality
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3492881A1 (fr) * 2017-12-04 2019-06-05 VEGA Grieshaber KG Carte de circuits imprimés pour un appareil de mesure de niveau de remplissage radar pourvue de couplage du guide d'onde
CN110006504A (zh) * 2017-12-04 2019-07-12 Vega格里沙贝两合公司 用于具有波导耦合装置的雷达物位测量装置的电路板
US10616996B2 (en) 2017-12-04 2020-04-07 Vega Grieshaber Kg Printed circuit board for a radar level measurement device with waveguide coupling
CN110006504B (zh) * 2017-12-04 2022-06-07 Vega格里沙贝两合公司 用于具有波导耦合装置的雷达物位测量装置的电路板

Also Published As

Publication number Publication date
WO2011030277A2 (fr) 2011-03-17
WO2011030277A3 (fr) 2011-06-09

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