WO2011030277A3 - Interfaces de puce de radiofréquence (rfic) et structures d'onde millimétrique - Google Patents
Interfaces de puce de radiofréquence (rfic) et structures d'onde millimétrique Download PDFInfo
- Publication number
- WO2011030277A3 WO2011030277A3 PCT/IB2010/054004 IB2010054004W WO2011030277A3 WO 2011030277 A3 WO2011030277 A3 WO 2011030277A3 IB 2010054004 W IB2010054004 W IB 2010054004W WO 2011030277 A3 WO2011030277 A3 WO 2011030277A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- millimeter
- interfaces
- wave
- pcb
- printed
- Prior art date
Links
- 241000761557 Lamina Species 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 2
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 238000007747 plating Methods 0.000 abstract 1
- 239000000523 sample Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
- H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced lines or devices with unbalanced lines or devices
- H01P5/107—Hollow-waveguide/strip-line transitions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
- H01P5/022—Transitions between lines of the same kind and shape, but with different dimensions
- H01P5/028—Transitions between lines of the same kind and shape, but with different dimensions between strip lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/0485—Dielectric resonator antennas
- H01Q9/0492—Dielectric resonator antennas circularly polarised
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Waveguides (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
L'invention porte sur des systèmes et sur des procédés pour des guides d'onde qui comprennent une structure stratifiée, des éléments de syntonisation de guide d'onde comprenant une couche conductrice imprimée, un ensemble puce d'onde millimétrique et des interfaces, des interfaces d'onde millimétrique à faible perte comprenant une puce nue, et des procédés pour la construction de structures stratifiées d'onde millimétrique et d'interface de puce. Un mode de réalisation exemplaire pour l'injection et le guidage d'ondes millimétriques à travers une carte de circuit imprimé (PCB) comprenant au moins deux lames appartenant à une carte de circuit imprimé, un placage électroconducteur appliqué sur les parois isolantes d'une cavité formée perpendiculairement à travers les lames, et facultativement une sonde disposée au-dessus de la cavité imprimée sur une lame appartenant à la carte de circuit imprimé.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE112010003585T DE112010003585T5 (de) | 2009-09-08 | 2010-09-07 | Rfic-schnittstellen und millimeterwellenstrukturen |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/554,987 | 2009-09-08 | ||
US12/554,987 US8912858B2 (en) | 2009-09-08 | 2009-09-08 | Interfacing between an integrated circuit and a waveguide through a cavity located in a soft laminate |
US12/791,936 | 2010-06-02 | ||
US12/791,936 US8536954B2 (en) | 2010-06-02 | 2010-06-02 | Millimeter wave multi-layer packaging including an RFIC cavity and a radiating cavity therein |
US38021710P | 2010-09-04 | 2010-09-04 | |
US61/380,217 | 2010-09-04 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2011030277A2 WO2011030277A2 (fr) | 2011-03-17 |
WO2011030277A3 true WO2011030277A3 (fr) | 2011-06-09 |
Family
ID=43732882
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/IB2010/054004 WO2011030277A2 (fr) | 2009-09-08 | 2010-09-07 | Interfaces de puce de radiofréquence (rfic) et structures d'onde millimétrique |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE112010003585T5 (fr) |
WO (1) | WO2011030277A2 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103597658A (zh) * | 2011-07-04 | 2014-02-19 | 华为技术有限公司 | 模组及耦合布置 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8536954B2 (en) | 2010-06-02 | 2013-09-17 | Siklu Communication ltd. | Millimeter wave multi-layer packaging including an RFIC cavity and a radiating cavity therein |
US8912858B2 (en) | 2009-09-08 | 2014-12-16 | Siklu Communication ltd. | Interfacing between an integrated circuit and a waveguide through a cavity located in a soft laminate |
CN103650235B (zh) | 2011-07-04 | 2015-03-25 | 华为技术有限公司 | 耦合布置 |
DE102012203293B4 (de) * | 2012-03-02 | 2021-12-02 | Robert Bosch Gmbh | Halbleitermodul mit integriertem Wellenleiter für Radarsignale |
US9356352B2 (en) | 2012-10-22 | 2016-05-31 | Texas Instruments Incorporated | Waveguide coupler |
DE102015202872A1 (de) | 2015-02-18 | 2016-08-18 | Robert Bosch Gmbh | Vorrichtung und Verfahren zum Übertragen eines Hochfrequenzsignals |
FR3062525B1 (fr) | 2017-02-01 | 2020-11-20 | Inst Vedecom | Antenne a fentes integree dans une carte de circuit imprime et procede de fabrication de celle-ci |
HUE049220T2 (hu) | 2017-12-04 | 2020-09-28 | Grieshaber Vega Kg | Nyomtatott áramköri lap radaros feltöltési szintmérõ készülékhez üreges vezetõ becsatolással |
CN112701092A (zh) * | 2020-12-24 | 2021-04-23 | 北京国联万众半导体科技有限公司 | 毫米波单片集成电路封装结构及其封装方法 |
Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3255408A (en) * | 1963-02-25 | 1966-06-07 | Beloit Corp | Instrument for measuring moisture content and the like |
US5384557A (en) * | 1992-11-10 | 1995-01-24 | Sony Corporation | Polarization separator and waveguide-microstrip line mode transformer for microwave apparatus |
US5475394A (en) * | 1991-01-30 | 1995-12-12 | Comsat Corporation | Waveguide transition for flat plate antenna |
US6320543B1 (en) * | 1999-03-24 | 2001-11-20 | Nec Corporation | Microwave and millimeter wave circuit apparatus |
US6359590B2 (en) * | 2000-05-26 | 2002-03-19 | Kyocera Corporation | Antenna feeder line, and antenna module provided with the antenna feeder line |
US20030012006A1 (en) * | 2001-07-11 | 2003-01-16 | Silverman Lawrence H. | Pocket mounted chip having microstrip line |
US6573808B1 (en) * | 1999-03-12 | 2003-06-03 | Harris Broadband Wireless Access, Inc. | Millimeter wave front end |
US6572955B2 (en) * | 2000-04-27 | 2003-06-03 | Kyocera Corporation | Ceramics having excellent high-frequency characteristics and method of producing the same |
US6608535B2 (en) * | 2000-04-13 | 2003-08-19 | Raytheon Company | Suspended transmission line with embedded signal channeling device |
US20040041657A1 (en) * | 2000-12-04 | 2004-03-04 | Peter Paakkonen | Directional coupler, antenna interface unit and radio base station having an antenna interface unit |
US20040145426A1 (en) * | 2002-07-13 | 2004-07-29 | Ke-Li Wu | Waveguide to laminated waveguide transition and methodology |
US6822528B2 (en) * | 2001-10-11 | 2004-11-23 | Fujitsu Limited | Transmission line to waveguide transition including antenna patch and ground ring |
US20050024166A1 (en) * | 2002-03-05 | 2005-02-03 | Xytrans, Inc. | Millimeter wave (MMW) radio frequency transceiver module and method of forming same |
US20060256016A1 (en) * | 2005-03-17 | 2006-11-16 | Ke-Li Wu | Integrated LTCC mm-wave planar array antenna with low loss feeding network |
US20070085626A1 (en) * | 2005-10-19 | 2007-04-19 | Hong Yeol Lee | Millimeter-wave band broadband microstrip-waveguide transition apparatus |
US20070109070A1 (en) * | 2005-11-14 | 2007-05-17 | Honeywell International Inc. | Monolithic microwave integrated circuit providing power dividing and power monitoring functionality |
US20090207090A1 (en) * | 2007-06-22 | 2009-08-20 | Vubiq Incorporated | Integrated antenna and chip package and method of manufacturing thereof |
US20090206473A1 (en) * | 2008-02-14 | 2009-08-20 | Viasat, Inc. | System and Method for Integrated Waveguide Packaging |
-
2010
- 2010-09-07 DE DE112010003585T patent/DE112010003585T5/de not_active Withdrawn
- 2010-09-07 WO PCT/IB2010/054004 patent/WO2011030277A2/fr active Application Filing
Patent Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3255408A (en) * | 1963-02-25 | 1966-06-07 | Beloit Corp | Instrument for measuring moisture content and the like |
US5475394A (en) * | 1991-01-30 | 1995-12-12 | Comsat Corporation | Waveguide transition for flat plate antenna |
US5384557A (en) * | 1992-11-10 | 1995-01-24 | Sony Corporation | Polarization separator and waveguide-microstrip line mode transformer for microwave apparatus |
US6573808B1 (en) * | 1999-03-12 | 2003-06-03 | Harris Broadband Wireless Access, Inc. | Millimeter wave front end |
US6320543B1 (en) * | 1999-03-24 | 2001-11-20 | Nec Corporation | Microwave and millimeter wave circuit apparatus |
US6608535B2 (en) * | 2000-04-13 | 2003-08-19 | Raytheon Company | Suspended transmission line with embedded signal channeling device |
US6572955B2 (en) * | 2000-04-27 | 2003-06-03 | Kyocera Corporation | Ceramics having excellent high-frequency characteristics and method of producing the same |
US6359590B2 (en) * | 2000-05-26 | 2002-03-19 | Kyocera Corporation | Antenna feeder line, and antenna module provided with the antenna feeder line |
US20040041657A1 (en) * | 2000-12-04 | 2004-03-04 | Peter Paakkonen | Directional coupler, antenna interface unit and radio base station having an antenna interface unit |
US20030012006A1 (en) * | 2001-07-11 | 2003-01-16 | Silverman Lawrence H. | Pocket mounted chip having microstrip line |
US6822528B2 (en) * | 2001-10-11 | 2004-11-23 | Fujitsu Limited | Transmission line to waveguide transition including antenna patch and ground ring |
US20050024166A1 (en) * | 2002-03-05 | 2005-02-03 | Xytrans, Inc. | Millimeter wave (MMW) radio frequency transceiver module and method of forming same |
US20040145426A1 (en) * | 2002-07-13 | 2004-07-29 | Ke-Li Wu | Waveguide to laminated waveguide transition and methodology |
US20060256016A1 (en) * | 2005-03-17 | 2006-11-16 | Ke-Li Wu | Integrated LTCC mm-wave planar array antenna with low loss feeding network |
US20070085626A1 (en) * | 2005-10-19 | 2007-04-19 | Hong Yeol Lee | Millimeter-wave band broadband microstrip-waveguide transition apparatus |
US20070109070A1 (en) * | 2005-11-14 | 2007-05-17 | Honeywell International Inc. | Monolithic microwave integrated circuit providing power dividing and power monitoring functionality |
US20090207090A1 (en) * | 2007-06-22 | 2009-08-20 | Vubiq Incorporated | Integrated antenna and chip package and method of manufacturing thereof |
US20090206473A1 (en) * | 2008-02-14 | 2009-08-20 | Viasat, Inc. | System and Method for Integrated Waveguide Packaging |
Non-Patent Citations (1)
Title |
---|
CLENET: "Array of Laminated Waveguides for Implementation in LTCC Technology", MEMORANDUM, November 2006 (2006-11-01), pages 1 - 4, Retrieved from the Internet <URL:http://www.dtic.mil/cgi-bin/GetTRDoc?Location=U2&doc=GetTRDoc.pdf&AD=ADA462936> [retrieved on 20101228] * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103597658A (zh) * | 2011-07-04 | 2014-02-19 | 华为技术有限公司 | 模组及耦合布置 |
Also Published As
Publication number | Publication date |
---|---|
WO2011030277A2 (fr) | 2011-03-17 |
DE112010003585T5 (de) | 2012-11-22 |
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