FR3062525B1 - Antenne a fentes integree dans une carte de circuit imprime et procede de fabrication de celle-ci - Google Patents

Antenne a fentes integree dans une carte de circuit imprime et procede de fabrication de celle-ci Download PDF

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Publication number
FR3062525B1
FR3062525B1 FR1750851A FR1750851A FR3062525B1 FR 3062525 B1 FR3062525 B1 FR 3062525B1 FR 1750851 A FR1750851 A FR 1750851A FR 1750851 A FR1750851 A FR 1750851A FR 3062525 B1 FR3062525 B1 FR 3062525B1
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FR
France
Prior art keywords
circuit board
printed circuit
manufacturing
same
antenna integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1750851A
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English (en)
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FR3062525A1 (fr
Inventor
Friedbald Kiel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Institut Vedecom
Original Assignee
Institut Vedecom
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to FR1750851A priority Critical patent/FR3062525B1/fr
Application filed by Institut Vedecom filed Critical Institut Vedecom
Priority to PCT/FR2018/050195 priority patent/WO2018142051A1/fr
Priority to KR1020197025263A priority patent/KR20190139836A/ko
Priority to US16/480,304 priority patent/US11177139B2/en
Priority to JP2019541295A priority patent/JP2020506618A/ja
Priority to CN201880009828.XA priority patent/CN110268582A/zh
Priority to EP18705686.6A priority patent/EP3577722A1/fr
Publication of FR3062525A1 publication Critical patent/FR3062525A1/fr
Application granted granted Critical
Publication of FR3062525B1 publication Critical patent/FR3062525B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/10—Resonant slot antennas
    • H01Q13/18—Resonant slot antennas the slot being backed by, or formed in boundary wall of, a resonant cavity ; Open cavity antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4857—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/061—Two dimensional planar arrays
    • H01Q21/064—Two dimensional planar arrays using horn or slot aerials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer

Abstract

L'antenne à fentes (AT) est intégrée dans une carte de circuit imprimé et comprend une couche conductrice métallique (17) ayant une pluralité de fentes (S17). Les fentes forment des ouvertures dans la couche conductrice métallique. Conformément à l'invention, l'antenne à fentes comprend une cavité (15) qui est formée dans l'épaisseur de la carte de circuit imprimé et est située sous la pluralité de fentes de la couche conductrice métallique.
FR1750851A 2017-02-01 2017-02-01 Antenne a fentes integree dans une carte de circuit imprime et procede de fabrication de celle-ci Active FR3062525B1 (fr)

Priority Applications (7)

Application Number Priority Date Filing Date Title
FR1750851A FR3062525B1 (fr) 2017-02-01 2017-02-01 Antenne a fentes integree dans une carte de circuit imprime et procede de fabrication de celle-ci
KR1020197025263A KR20190139836A (ko) 2017-02-01 2018-01-29 통합된 슬롯들을 가진 안테나를 포함하는 인쇄 회로를 구비한 전자 카드 및 그 제조 방법
US16/480,304 US11177139B2 (en) 2017-02-01 2018-01-29 Electronic card with printed circuit comprising an antenna with integrated slots and method for the production thereof
JP2019541295A JP2020506618A (ja) 2017-02-01 2018-01-29 一体化されたスロット付きアンテナを含む印刷回路基板を伴う電子カード、及びその製造方法
PCT/FR2018/050195 WO2018142051A1 (fr) 2017-02-01 2018-01-29 Carte électronique à circuit imprimé comprenant une antenne à fentes intégrée et procédé de fabrication de celle-ci
CN201880009828.XA CN110268582A (zh) 2017-02-01 2018-01-29 包括集成缝隙天线的电子印刷电路板及其制造方法
EP18705686.6A EP3577722A1 (fr) 2017-02-01 2018-01-29 Carte électronique à circuit imprimé comprenant une antenne à fentes intégrée et procédé de fabrication de celle-ci

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1750851 2017-02-01
FR1750851A FR3062525B1 (fr) 2017-02-01 2017-02-01 Antenne a fentes integree dans une carte de circuit imprime et procede de fabrication de celle-ci

Publications (2)

Publication Number Publication Date
FR3062525A1 FR3062525A1 (fr) 2018-08-03
FR3062525B1 true FR3062525B1 (fr) 2020-11-20

Family

ID=59152992

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1750851A Active FR3062525B1 (fr) 2017-02-01 2017-02-01 Antenne a fentes integree dans une carte de circuit imprime et procede de fabrication de celle-ci

Country Status (7)

Country Link
US (1) US11177139B2 (fr)
EP (1) EP3577722A1 (fr)
JP (1) JP2020506618A (fr)
KR (1) KR20190139836A (fr)
CN (1) CN110268582A (fr)
FR (1) FR3062525B1 (fr)
WO (1) WO2018142051A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220061572A (ko) * 2020-11-06 2022-05-13 삼성전자주식회사 안테나를 포함하는 전자 장치
US11889666B2 (en) 2021-11-03 2024-01-30 Toyota Motor Engineering & Manufacturing North America, Inc. Power device assemblies having embedded PCBs and methods of fabricating the same
KR102640270B1 (ko) 2023-12-07 2024-02-27 주식회사 월드씨엔에스 개선된 방열 성능을 지닌 led 조명 장치

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6049311A (en) * 1999-03-05 2000-04-11 The Whitaker Corporation Planar flat plate scanning antenna
JP4022052B2 (ja) * 2001-07-18 2007-12-12 日本放送協会 アクティブフェーズドアレーアンテナ及びそれを用いた送信装置
US6778144B2 (en) * 2002-07-02 2004-08-17 Raytheon Company Antenna
FR2901062B1 (fr) * 2006-05-12 2008-07-04 Alcatel Sa Dispositif rayonnant a cavite(s) resonnante(s) a air a fort rendement de surface, pour une antenne reseau
US7518229B2 (en) * 2006-08-03 2009-04-14 International Business Machines Corporation Versatile Si-based packaging with integrated passive components for mmWave applications
EP2034429A1 (fr) * 2007-09-05 2009-03-11 Assa Abloy AB Procédé de fabrication d'une carte et carte obtenue selon ledit procédé
JP5432918B2 (ja) * 2008-10-31 2014-03-05 太陽誘電株式会社 プリント配線版の製造方法
US20100238085A1 (en) * 2009-03-23 2010-09-23 Toyota Motor Engineering & Manufacturing North America, Inc. Plastic waveguide slot array and method of manufacture
DE112010003585T5 (de) * 2009-09-08 2012-11-22 Siklu Communication ltd. Rfic-schnittstellen und millimeterwellenstrukturen
FR2959611B1 (fr) * 2010-04-30 2012-06-08 Thales Sa Element rayonnant compact a cavites resonantes.
US8674885B2 (en) * 2010-08-31 2014-03-18 Siklu Communication ltd. Systems for interfacing waveguide antenna feeds with printed circuit boards
US8895380B2 (en) 2010-11-22 2014-11-25 Bridge Semiconductor Corporation Method of making semiconductor assembly with built-in stiffener and semiconductor assembly manufactured thereby
US8865525B2 (en) 2010-11-22 2014-10-21 Bridge Semiconductor Corporation Method of making cavity substrate with built-in stiffener and cavity substrate manufactured thereby
DE102011005145A1 (de) * 2011-03-04 2012-09-06 Rohde & Schwarz Gmbh & Co. Kg Leiterplattenanordnung für Millimeterwellen-Scanner
US9219041B2 (en) * 2012-03-29 2015-12-22 International Business Machines Corporation Electronic package for millimeter wave semiconductor dies
US20140246227A1 (en) * 2013-03-01 2014-09-04 Bridge Semiconductor Corporation Method of making cavity substrate with built-in stiffener and cavity substrate manufactured thereby
US9831565B2 (en) * 2013-03-24 2017-11-28 Telefonaktiebolaget Lm Ericsson (Publ) SIW antenna arrangement

Also Published As

Publication number Publication date
CN110268582A (zh) 2019-09-20
KR20190139836A (ko) 2019-12-18
US20190371622A1 (en) 2019-12-05
JP2020506618A (ja) 2020-02-27
EP3577722A1 (fr) 2019-12-11
FR3062525A1 (fr) 2018-08-03
WO2018142051A1 (fr) 2018-08-09
US11177139B2 (en) 2021-11-16

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