DE112009001424T5 - Asymmetrischer Komposit-Schallwellensensor - Google Patents

Asymmetrischer Komposit-Schallwellensensor Download PDF

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Publication number
DE112009001424T5
DE112009001424T5 DE112009001424T DE112009001424T DE112009001424T5 DE 112009001424 T5 DE112009001424 T5 DE 112009001424T5 DE 112009001424 T DE112009001424 T DE 112009001424T DE 112009001424 T DE112009001424 T DE 112009001424T DE 112009001424 T5 DE112009001424 T5 DE 112009001424T5
Authority
DE
Germany
Prior art keywords
plate
protective plate
acoustic wave
wave device
piezoelectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE112009001424T
Other languages
German (de)
English (en)
Inventor
Jeffrey C. Andle
Reichl B. Haskell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Microsemi Corp High Performance Timing
Original Assignee
Delaware Capital Formation Inc
Capital Formation Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delaware Capital Formation Inc, Capital Formation Inc filed Critical Delaware Capital Formation Inc
Publication of DE112009001424T5 publication Critical patent/DE112009001424T5/de
Ceased legal-status Critical Current

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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00Piezoelectric transducers; Electrostrictive transducers

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
DE112009001424T 2008-09-02 2009-08-12 Asymmetrischer Komposit-Schallwellensensor Ceased DE112009001424T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/202,431 2008-09-02
US12/202,431 US8022595B2 (en) 2008-09-02 2008-09-02 Asymmetric composite acoustic wave sensor
PCT/US2009/053519 WO2010027615A2 (fr) 2008-09-02 2009-08-12 Capteur d'onde acoustique composite asymétrique

Publications (1)

Publication Number Publication Date
DE112009001424T5 true DE112009001424T5 (de) 2011-04-14

Family

ID=41724262

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112009001424T Ceased DE112009001424T5 (de) 2008-09-02 2009-08-12 Asymmetrischer Komposit-Schallwellensensor

Country Status (3)

Country Link
US (1) US8022595B2 (fr)
DE (1) DE112009001424T5 (fr)
WO (1) WO2010027615A2 (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2938136B1 (fr) * 2008-11-05 2011-03-11 Centre Nat Rech Scient Elements de filtres par couplage transverse sur structures resonantes a ondes de volume a resonances harmoniques multiples.
EP2436049B1 (fr) * 2009-05-28 2019-05-01 Northrop Grumman Systems Corporation Résonateurs acoustiques de volume latéraux à mode contraint
WO2011035147A2 (fr) * 2009-09-18 2011-03-24 Delaware Capital Formation, Inc. Composantes d'ondes de compression de capteurs à mesurandes multiples en mode de cisaillement d'épaisseur
US8283999B2 (en) * 2010-02-23 2012-10-09 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Bulk acoustic resonator structures comprising a single material acoustic coupling layer comprising inhomogeneous acoustic property
CN102879142B (zh) * 2011-07-13 2014-09-10 中国科学院理化技术研究所 电机效率测量装置及方法
CN103868629A (zh) * 2012-12-18 2014-06-18 杭州三花研究院有限公司 一种超声波热量表
DE102014009476A1 (de) * 2014-06-30 2015-07-16 Mann + Hummel Gmbh Schalldruck-Erfassungsvorrichtung und elektrischer Schalldrucksensor
CN105334348A (zh) * 2014-08-15 2016-02-17 中国科学院上海硅酸盐研究所 一种高温加速度传感器
JP6635366B2 (ja) 2015-07-08 2020-01-22 国立研究開発法人物質・材料研究機構 圧電材料、その製造方法、圧電素子および燃焼圧センサ
US11551905B2 (en) * 2018-03-19 2023-01-10 Intel Corporation Resonant process monitor
US11831295B2 (en) 2019-09-20 2023-11-28 The Government Of The United States Of America, As Represented By The Secretary Of The Navy Multifunctional integrated acoustic devices and systems using epitaxial materials

Family Cites Families (16)

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Publication number Priority date Publication date Assignee Title
US4535631A (en) * 1982-09-29 1985-08-20 Schlumberger Technology Corporation Surface acoustic wave sensors
CN85100483B (zh) * 1985-04-01 1988-10-19 上海灯泡厂 超声波换能器用背载材料
DE4312887A1 (de) 1992-04-30 1993-11-04 Fraunhofer Ges Forschung Sensor mit hoher empfindlichkeit
JP3344441B2 (ja) * 1994-03-25 2002-11-11 住友電気工業株式会社 表面弾性波素子
NO300078B1 (no) * 1995-02-10 1997-04-01 Sinvent As Fotoakustisk gassdetektor
JP2842382B2 (ja) * 1996-06-11 1999-01-06 日本電気株式会社 積層型圧電トランスおよびその製造方法
US7383727B2 (en) * 1999-05-20 2008-06-10 Seiko Epson Corporation Liquid cotainer having a liquid consumption detecting device therein
US6567753B2 (en) * 2001-04-04 2003-05-20 General Electric Company Devices and methods for simultaneous measurement of transmission of vapors through a plurality of sheet materials
US6842009B2 (en) * 2001-09-13 2005-01-11 Nth Tech Corporation Biohazard sensing system and methods thereof
CN1249405C (zh) * 2002-01-28 2006-04-05 松下电器产业株式会社 声匹配层、超声波发射接收器及超声波流量计
JP3633926B2 (ja) * 2002-01-28 2005-03-30 松下電器産業株式会社 超音波送受信器および超音波流量計
US6788620B2 (en) * 2002-05-15 2004-09-07 Matsushita Electric Ind Co Ltd Acoustic matching member, ultrasound transducer, ultrasonic flowmeter and method for manufacturing the same
US7098574B2 (en) * 2002-11-08 2006-08-29 Toyo Communication Equipment Co., Ltd. Piezoelectric resonator and method for manufacturing the same
WO2007123537A1 (fr) 2006-04-20 2007-11-01 Dover Electronics, Inc. (Dba Vectron International) Capteur electroacoustique pour des environnements sous haute pression
US7667369B2 (en) * 2006-11-01 2010-02-23 Delaware Capital Formation, Inc. High sensitivity microsensors based on flexure induced frequency effects
JP4301298B2 (ja) * 2007-01-29 2009-07-22 株式会社デンソー 超音波センサ及び超音波センサの製造方法

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
"Measurement of the equivalent circuit parameters of chemical interface layers on bulk acoustic wave resonator" von G J Gouws, R. C. Holt und J Zhen, Proceeding of the 2004 IEEE International Frequency Control Symposium and exposition
"PMMA polymer film characterization using thickness-shear mode (TSM) quartz resonator" von Boima Morray, Suiquong li, Jeanne Hossenlopp, Richard Cernosek und Fabien Josse, 2002 IEEE International Frequency Control Symposium and exposition
"The Characterization of Permanent Acoustic Bonding Agents" Fred S. Hickernell (University of Arizona, Tucson, Arizona, USA, University of Central Florida, Orlando, F1, USA) 2008 IEEE Frequency Control Symposium Proceedings

Also Published As

Publication number Publication date
US20100052470A1 (en) 2010-03-04
WO2010027615A2 (fr) 2010-03-11
US8022595B2 (en) 2011-09-20
WO2010027615A3 (fr) 2010-04-29

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