DE112006003494T5 - Verfahren und Vorrichtung zur Verarbeitung von mehrphotonen-aushärtbaren photoreaktiven Zusammensetzungen - Google Patents
Verfahren und Vorrichtung zur Verarbeitung von mehrphotonen-aushärtbaren photoreaktiven Zusammensetzungen Download PDFInfo
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- DE112006003494T5 DE112006003494T5 DE112006003494T DE112006003494T DE112006003494T5 DE 112006003494 T5 DE112006003494 T5 DE 112006003494T5 DE 112006003494 T DE112006003494 T DE 112006003494T DE 112006003494 T DE112006003494 T DE 112006003494T DE 112006003494 T5 DE112006003494 T5 DE 112006003494T5
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- BEPGHZIEOVULBU-UHFFFAOYSA-N n,n'-diethylpropane-1,3-diamine Chemical compound CCNCCCNCC BEPGHZIEOVULBU-UHFFFAOYSA-N 0.000 description 1
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- AJFDBNQQDYLMJN-UHFFFAOYSA-N n,n-diethylacetamide Chemical compound CCN(CC)C(C)=O AJFDBNQQDYLMJN-UHFFFAOYSA-N 0.000 description 1
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- AHKKZIUZTWZKDR-UHFFFAOYSA-N n-[bis(dimethylamino)-methylsilyl]-n-methylmethanamine Chemical compound CN(C)[Si](C)(N(C)C)N(C)C AHKKZIUZTWZKDR-UHFFFAOYSA-N 0.000 description 1
- VJDVRUZAQRISHN-UHFFFAOYSA-N n-[bis(dimethylamino)-phenylsilyl]-n-methylmethanamine Chemical compound CN(C)[Si](N(C)C)(N(C)C)C1=CC=CC=C1 VJDVRUZAQRISHN-UHFFFAOYSA-N 0.000 description 1
- FTURFVPIEOKJBC-UHFFFAOYSA-N n-[dimethylamino(diphenyl)silyl]-n-methylmethanamine Chemical compound C=1C=CC=CC=1[Si](N(C)C)(N(C)C)C1=CC=CC=C1 FTURFVPIEOKJBC-UHFFFAOYSA-N 0.000 description 1
- WAQPJHNWYPETBC-UHFFFAOYSA-N n-bis(dipropylamino)phosphoryl-n-propylpropan-1-amine Chemical compound CCCN(CCC)P(=O)(N(CCC)CCC)N(CCC)CCC WAQPJHNWYPETBC-UHFFFAOYSA-N 0.000 description 1
- KNLUHXUFCCNNIB-UHFFFAOYSA-N n-dimethylsilyl-n-methylmethanamine Chemical compound CN(C)[SiH](C)C KNLUHXUFCCNNIB-UHFFFAOYSA-N 0.000 description 1
- LMTGCJANOQOGPI-UHFFFAOYSA-N n-methyl-n-phenylacetamide Chemical compound CC(=O)N(C)C1=CC=CC=C1 LMTGCJANOQOGPI-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 230000000269 nucleophilic effect Effects 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 235000019198 oils Nutrition 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- YPNZYYWORCABPU-UHFFFAOYSA-N oxiran-2-ylmethyl 2-methylprop-2-enoate;styrene Chemical compound C=CC1=CC=CC=C1.CC(=C)C(=O)OCC1CO1 YPNZYYWORCABPU-UHFFFAOYSA-N 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- 125000000466 oxiranyl group Chemical group 0.000 description 1
- BFYJDHRWCNNYJQ-UHFFFAOYSA-N oxo-(3-oxo-3-phenylpropoxy)-(2,4,6-trimethylphenyl)phosphanium Chemical compound CC1=CC(C)=CC(C)=C1[P+](=O)OCCC(=O)C1=CC=CC=C1 BFYJDHRWCNNYJQ-UHFFFAOYSA-N 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- FZUGPQWGEGAKET-UHFFFAOYSA-N parbenate Chemical compound CCOC(=O)C1=CC=C(N(C)C)C=C1 FZUGPQWGEGAKET-UHFFFAOYSA-N 0.000 description 1
- DPBLXKKOBLCELK-UHFFFAOYSA-N pentan-1-amine Chemical compound CCCCCN DPBLXKKOBLCELK-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 125000002467 phosphate group Chemical group [H]OP(=O)(O[H])O[*] 0.000 description 1
- 150000008039 phosphoramides Chemical class 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920002285 poly(styrene-co-acrylonitrile) Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000151 polyglycol Polymers 0.000 description 1
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- QTECDUFMBMSHKR-UHFFFAOYSA-N prop-2-enyl prop-2-enoate Chemical compound C=CCOC(=O)C=C QTECDUFMBMSHKR-UHFFFAOYSA-N 0.000 description 1
- BOQSSGDQNWEFSX-UHFFFAOYSA-N propan-2-yl 2-methylprop-2-enoate Chemical compound CC(C)OC(=O)C(C)=C BOQSSGDQNWEFSX-UHFFFAOYSA-N 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
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- 230000003014 reinforcing effect Effects 0.000 description 1
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- 229920006395 saturated elastomer Polymers 0.000 description 1
- 125000005373 siloxane group Chemical group [SiH2](O*)* 0.000 description 1
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- 239000003549 soybean oil Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- PJANXHGTPQOBST-UHFFFAOYSA-N stilbene Chemical class C=1C=CC=CC=1C=CC1=CC=CC=C1 PJANXHGTPQOBST-UHFFFAOYSA-N 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
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- 125000000547 substituted alkyl group Chemical group 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 150000003455 sulfinic acids Chemical class 0.000 description 1
- 125000001273 sulfonato group Chemical group [O-]S(*)(=O)=O 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 238000004441 surface measurement Methods 0.000 description 1
- GJWMYLFHBXEWNZ-UHFFFAOYSA-N tert-butyl (4-ethenylphenyl) carbonate Chemical compound CC(C)(C)OC(=O)OC1=CC=C(C=C)C=C1 GJWMYLFHBXEWNZ-UHFFFAOYSA-N 0.000 description 1
- SJMYWORNLPSJQO-UHFFFAOYSA-N tert-butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(C)(C)C SJMYWORNLPSJQO-UHFFFAOYSA-N 0.000 description 1
- XTXNWQHMMMPKKO-UHFFFAOYSA-N tert-butyl 2-phenylethenyl carbonate Chemical compound CC(C)(C)OC(=O)OC=CC1=CC=CC=C1 XTXNWQHMMMPKKO-UHFFFAOYSA-N 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 150000005621 tetraalkylammonium salts Chemical class 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 125000001544 thienyl group Chemical group 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 150000003585 thioureas Chemical class 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- WLADIVUISABQHN-UHFFFAOYSA-N trimethyl(piperidin-1-yl)silane Chemical compound C[Si](C)(C)N1CCCCC1 WLADIVUISABQHN-UHFFFAOYSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- ODHXBMXNKOYIBV-UHFFFAOYSA-N triphenylamine Chemical compound C1=CC=CC=C1N(C=1C=CC=CC=1)C1=CC=CC=C1 ODHXBMXNKOYIBV-UHFFFAOYSA-N 0.000 description 1
- BPLUKJNHPBNVQL-UHFFFAOYSA-N triphenylarsine Chemical class C1=CC=CC=C1[As](C=1C=CC=CC=1)C1=CC=CC=C1 BPLUKJNHPBNVQL-UHFFFAOYSA-N 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 235000015112 vegetable and seed oil Nutrition 0.000 description 1
- 239000008158 vegetable oil Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229920003176 water-insoluble polymer Polymers 0.000 description 1
- 239000012991 xanthate Substances 0.000 description 1
- RQNAPXJOFAMGPJ-UHFFFAOYSA-N xanthene Chemical compound C1=CC=C2[CH]C3=CC=CC=C3OC2=C1 RQNAPXJOFAMGPJ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
- G03F7/2053—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70375—Multiphoton lithography or multiphoton photopolymerization; Imaging systems comprising means for converting one type of radiation into another type of radiation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70608—Monitoring the unpatterned workpiece, e.g. measuring thickness, reflectivity or effects of immersion liquid on resist
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Optics & Photonics (AREA)
- Laser Beam Processing (AREA)
- Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Manufacturing Optical Record Carriers (AREA)
- Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US75252905P | 2005-12-21 | 2005-12-21 | |
| US60/752,529 | 2005-12-21 | ||
| PCT/US2006/048498 WO2007073482A2 (en) | 2005-12-21 | 2006-12-20 | Method and apparatus for processing multiphoton curable photoreactive compositions |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE112006003494T5 true DE112006003494T5 (de) | 2008-10-30 |
Family
ID=38189117
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE112006003494T Withdrawn DE112006003494T5 (de) | 2005-12-21 | 2006-12-20 | Verfahren und Vorrichtung zur Verarbeitung von mehrphotonen-aushärtbaren photoreaktiven Zusammensetzungen |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7893410B2 (https=) |
| JP (1) | JP4880701B2 (https=) |
| CN (1) | CN101341578B (https=) |
| DE (1) | DE112006003494T5 (https=) |
| WO (1) | WO2007073482A2 (https=) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7583444B1 (en) | 2005-12-21 | 2009-09-01 | 3M Innovative Properties Company | Process for making microlens arrays and masterforms |
| JP2009537870A (ja) | 2006-05-18 | 2009-10-29 | スリーエム イノベイティブ プロパティズ カンパニー | 抽出構造体を備えた導光体の製造方法及びその方法で製造された導光体 |
| US8322874B2 (en) * | 2007-09-06 | 2012-12-04 | 3M Innovative Properties Company | Lightguides having light extraction structures providing regional control of light output |
| CN101795838B (zh) | 2007-09-06 | 2014-02-12 | 3M创新有限公司 | 形成模具的方法以及使用所述模具形成制品的方法 |
| CN101795961B (zh) * | 2007-09-06 | 2013-05-01 | 3M创新有限公司 | 用于制备微结构化制品的工具 |
| US8451457B2 (en) * | 2007-10-11 | 2013-05-28 | 3M Innovative Properties Company | Chromatic confocal sensor |
| EP2232531B1 (en) | 2007-12-12 | 2018-09-19 | 3M Innovative Properties Company | Method for making structures with improved edge definition |
| EP2257854B1 (en) * | 2008-02-26 | 2018-10-31 | 3M Innovative Properties Company | Multi-photon exposure system |
| GB2489722B (en) | 2011-04-06 | 2017-01-18 | Precitec Optronik Gmbh | Apparatus and method for determining a depth of a region having a high aspect ratio that protrudes into a surface of a semiconductor wafer |
| DE102011051146B3 (de) | 2011-06-17 | 2012-10-04 | Precitec Optronik Gmbh | Prüfverfahren zum Prüfen einer Verbindungsschicht zwischen waferförmigen Proben |
| JP2015512061A (ja) * | 2012-02-28 | 2015-04-23 | スリーエム イノベイティブ プロパティズ カンパニー | 陰性造影組成物を用いた多光子硬化方法 |
| US9040921B2 (en) * | 2012-07-28 | 2015-05-26 | Harvard Apparatus Regenerative Technology, Inc. | Analytical methods |
| DE102012111008B4 (de) | 2012-11-15 | 2014-05-22 | Precitec Optronik Gmbh | Optisches Messverfahren und optische Messvorrichtung zum Erfassen einer Oberflächentopographie |
| US8916336B2 (en) | 2013-03-19 | 2014-12-23 | Eastman Kodak Company | Patterning method using thiosulfate polymer and metal nanoparticles |
| US9499650B2 (en) | 2013-03-19 | 2016-11-22 | Eastman Kodak Company | Thiosulfate polymers |
| US9005878B2 (en) | 2013-03-19 | 2015-04-14 | Eastman Kodak Company | Forming patterns using thiosulfate polymer compositions |
| US8986924B2 (en) | 2013-03-19 | 2015-03-24 | Eastman Kodak Company | Method of sequestering metals using thiosulfate polymers |
| US9772552B2 (en) * | 2013-03-19 | 2017-09-26 | Eastman Kodak Company | Thiosulfate polymer compositions and articles |
| DE102014008584B4 (de) | 2013-06-17 | 2021-05-27 | Precitec Optronik Gmbh | Optische Messvorrichtung zum Erfassen von Abstandsdifferenzen und optisches Messverfahren |
| JP6566952B2 (ja) | 2013-12-06 | 2019-08-28 | スリーエム イノベイティブ プロパティズ カンパニー | 光反応性液体組成物及び構造体の作製方法 |
| TWI583916B (zh) * | 2015-10-08 | 2017-05-21 | 財團法人工業技術研究院 | 雷射共焦量測方法及應用此方法之雷射共焦量測裝置 |
| US10234265B2 (en) | 2016-12-12 | 2019-03-19 | Precitec Optronik Gmbh | Distance measuring device and method for measuring distances |
| DE102017126310A1 (de) | 2017-11-09 | 2019-05-09 | Precitec Optronik Gmbh | Abstandsmessvorrichtung |
| US11150484B2 (en) | 2018-05-18 | 2021-10-19 | Lawrence Livermore National Security, Llc | System and method for curved light sheet projection during two-photon polymerization |
| DE102018130901A1 (de) | 2018-12-04 | 2020-06-04 | Precitec Optronik Gmbh | Optische Messeinrichtung |
| US12467733B2 (en) | 2020-06-19 | 2025-11-11 | Precitec Optronik Gmbh | Chromatic confocal measuring device |
| DE102021113189A1 (de) * | 2021-05-20 | 2022-11-24 | Nanoscribe Holding Gmbh | Verfahren zum Erzeugen einer dreidimensionalen Zielstruktur in einem Lithographiematerial mittels einer Laserlithographie-Vorrichtung |
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| EP1295181A2 (en) * | 2000-06-15 | 2003-03-26 | 3M Innovative Properties Company | Method for making or adding structures to an article |
| DE60139620D1 (de) | 2000-06-15 | 2009-10-01 | 3M Innovative Properties Co | Methode und gerät zur erzielung wiederholter multiphotonabsorption |
| JP2001287273A (ja) * | 2001-03-12 | 2001-10-16 | Three D Syst Inc | 立体造形方法及び装置 |
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| CN100530549C (zh) * | 2004-08-23 | 2009-08-19 | 株式会社半导体能源研究所 | 激光照射设备、照射方法和制备半导体器件的方法 |
| DE102005009188A1 (de) * | 2005-03-01 | 2006-09-07 | Carl Zeiss Jena Gmbh | Punktscannendes Laser-Scanning-Mikroskop sowie Verfahren zur Einstellung eines Mikroskopes |
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- 2006-12-20 DE DE112006003494T patent/DE112006003494T5/de not_active Withdrawn
- 2006-12-20 CN CN2006800482953A patent/CN101341578B/zh not_active Expired - Fee Related
- 2006-12-20 WO PCT/US2006/048498 patent/WO2007073482A2/en not_active Ceased
- 2006-12-20 US US12/158,143 patent/US7893410B2/en not_active Expired - Fee Related
- 2006-12-20 JP JP2008547458A patent/JP4880701B2/ja not_active Expired - Fee Related
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Also Published As
| Publication number | Publication date |
|---|---|
| CN101341578B (zh) | 2010-12-08 |
| WO2007073482A3 (en) | 2007-09-27 |
| US20090250635A1 (en) | 2009-10-08 |
| CN101341578A (zh) | 2009-01-07 |
| WO2007073482A2 (en) | 2007-06-28 |
| JP4880701B2 (ja) | 2012-02-22 |
| US7893410B2 (en) | 2011-02-22 |
| JP2009521315A (ja) | 2009-06-04 |
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