DE112005000748T5 - Halbleiterelementmontagesubstrat, Halbleitermodul und Elektrofahrzeug - Google Patents

Halbleiterelementmontagesubstrat, Halbleitermodul und Elektrofahrzeug Download PDF

Info

Publication number
DE112005000748T5
DE112005000748T5 DE112005000748T DE112005000748T DE112005000748T5 DE 112005000748 T5 DE112005000748 T5 DE 112005000748T5 DE 112005000748 T DE112005000748 T DE 112005000748T DE 112005000748 T DE112005000748 T DE 112005000748T DE 112005000748 T5 DE112005000748 T5 DE 112005000748T5
Authority
DE
Germany
Prior art keywords
electric vehicle
mounting substrate
element mounting
semiconductor
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE112005000748T
Other languages
English (en)
Inventor
Atsushi Amano
Keisuke Urushihara
Kazuo Kimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honda Motor Co Ltd
Resonac Holdings Corp
Original Assignee
Honda Motor Co Ltd
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2004360075A external-priority patent/JP4382651B2/ja
Application filed by Honda Motor Co Ltd, Showa Denko KK filed Critical Honda Motor Co Ltd
Publication of DE112005000748T5 publication Critical patent/DE112005000748T5/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE112005000748T 2004-04-06 2005-04-06 Halbleiterelementmontagesubstrat, Halbleitermodul und Elektrofahrzeug Withdrawn DE112005000748T5 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2004112205 2004-04-06
US56152904P 2004-04-13 2004-04-13
JP2004360075A JP4382651B2 (ja) 2004-04-06 2004-12-13 半導体素子用基板および半導体モジュール、ならびに電気車両
PCT/JP2005/007114 WO2005098943A1 (en) 2004-04-06 2005-04-06 Semiconductor element mounting substrate, semiconductor module, and electric vehicle

Publications (1)

Publication Number Publication Date
DE112005000748T5 true DE112005000748T5 (de) 2007-05-16

Family

ID=35125363

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112005000748T Withdrawn DE112005000748T5 (de) 2004-04-06 2005-04-06 Halbleiterelementmontagesubstrat, Halbleitermodul und Elektrofahrzeug

Country Status (3)

Country Link
US (1) US20080239671A1 (de)
DE (1) DE112005000748T5 (de)
WO (1) WO2005098943A1 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4967988B2 (ja) * 2007-10-25 2012-07-04 株式会社豊田自動織機 半導体冷却装置
CN102460695A (zh) * 2009-06-19 2012-05-16 株式会社安川电机 布线基板以及电力变换装置
CN102549743B (zh) * 2009-08-10 2014-12-24 富士电机株式会社 半导体模块和冷却单元
EP2315242A1 (de) * 2009-10-23 2011-04-27 ABB Technology AG Schaltungsanordnung und Herstellungsverfahren dafür
JP5515947B2 (ja) * 2010-03-29 2014-06-11 株式会社豊田自動織機 冷却装置
CN101916747B (zh) * 2010-08-23 2012-05-23 上海中科深江电动车辆有限公司 电动汽车控制器用igbt散热结构及相关部件
JP5735785B2 (ja) 2010-11-30 2015-06-17 豊田鉄工株式会社 電子部品用冷却装置及びその製造方法
JP6216964B2 (ja) * 2011-08-09 2017-10-25 三菱アルミニウム株式会社 冷却器用クラッド材および発熱素子用冷却器
CN104170081A (zh) * 2012-03-19 2014-11-26 三菱电机株式会社 半导体装置、半导体系统
US20130279119A1 (en) * 2012-04-20 2013-10-24 GM Global Technology Operations LLC Electronic assemblies and methods of fabricating electronic assemblies
US20130306293A1 (en) * 2012-05-21 2013-11-21 Hamilton Sundstrand Space Systems International Extruded matching set radiators
US20130308273A1 (en) * 2012-05-21 2013-11-21 Hamilton Sundstrand Space Systems International Laser sintered matching set radiators
TW201400972A (zh) * 2012-06-29 2014-01-01 Delta Electronics Inc 適用於數位光源投影系統之散熱模組
US9449895B2 (en) * 2013-05-03 2016-09-20 Infineon Technologies Ag Cooling system for molded modules and corresponding manufacturing methods
US9279625B2 (en) * 2013-10-29 2016-03-08 Caterpillar Inc. Heat sink device for power modules of power converter assembly
US9613885B2 (en) 2015-03-03 2017-04-04 Infineon Technologies Ag Plastic cooler for semiconductor modules
WO2018055923A1 (ja) * 2016-09-23 2018-03-29 住友精密工業株式会社 冷却装置
CN110531571B (zh) * 2018-05-24 2021-08-24 中强光电股份有限公司 液冷式散热器
CN110543069A (zh) * 2018-05-28 2019-12-06 中强光电股份有限公司 液冷式散热器
CN113437037B (zh) * 2021-06-29 2024-05-24 中创杜菲(北京)汽车科技有限公司 功率半导体的封装冷却装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2919651B2 (ja) * 1991-07-29 1999-07-12 三洋電機株式会社 混成集積回路
DE19735531A1 (de) * 1997-08-16 1999-02-18 Abb Research Ltd Leistungshalbleitermodul mit in Submodulen integrierten Kühlern
JP2001183042A (ja) * 1999-12-24 2001-07-06 Isuzu Ceramics Res Inst Co Ltd 冷却液の循環による電気部品の冷却装置
JP2002033433A (ja) * 2000-07-13 2002-01-31 Hitachi Ltd 半導体装置およびその製法
JP2002286382A (ja) * 2001-01-16 2002-10-03 Denso Corp 沸騰冷却装置
JP2004006717A (ja) * 2002-04-10 2004-01-08 Mitsubishi Electric Corp パワー半導体装置
DE10317580B4 (de) * 2002-04-18 2010-09-16 Hitachi, Ltd. Elektrische Wechselrichtervorrichtung mit einem Flüssigkeitskanal sowie Elektrofahrzeug mit einer derartigen Wechselrichtervorrichtung
US7147367B2 (en) * 2002-06-11 2006-12-12 Saint-Gobain Performance Plastics Corporation Thermal interface material with low melting alloy
US20050142399A1 (en) * 2003-12-31 2005-06-30 Kulp Galen W. Procedure for starting up a fuel cell using a fuel purge

Also Published As

Publication number Publication date
WO2005098943A1 (en) 2005-10-20
US20080239671A1 (en) 2008-10-02

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Legal Events

Date Code Title Description
R005 Application deemed withdrawn due to failure to request examination

Effective date: 20120411