DE10338732A1 - Process for permanently joining two card layers of a multiple layer data carrier or data carrier semi-finished product comprises passing a laser beam through the first layer of a card layer arrangement to form an interlocking connection - Google Patents

Abstract

Process for permanently joining two card layers (3, 4) of a multiple layer data carrier or data carrier semi-finished product comprises providing two card layers in an arrangement in which they lie over each other, and passing a laser beam through the first layer (4) so that the material is sufficiently heated to produce an interlocking connection between the first layer and a second layer (3). Independent claims are also included for the following: (1) Data carrier or data carrier semi-finished product; and (2) Joining tool for carrying out the process.

Description

The The invention relates to a method for permanently connecting at least two card layers of a multi-layered card-shaped data carrier or Disk semifinished product, a suitable for use in the method joining tool and a corresponding multi-layered card-shaped disk or a semi-finished medium.

ID cards or identity cards, also called ID cards, are predominantly multi-layered of at least two, usually three or more layers built up. This setup has been especially implanted with cards Proven functional elements, such as with simple smart cards or complex multifunction smart cards. So it is usual a so-called Karteninlett, which tracks and, where appropriate has further electronic components, one-sided or two-sided to be provided with one or more outer layers. Electronic Components can implanted in prepared or yet to be generated cavities and, as far as the card has a card inlay, with the card inlay electric get connected.

The individual card layers are either printed in the hot lamination process under pressure and heat thermoplastic joined together, for example, using floor presses or double-belt continuous presses. Or there are adhesive systems for sandwich bonding of plastic films or semi-finished injection molding used, wherein the adhesive systems are hot or cold curing can. For example, the following adhesive systems are common: crosslinking polyurethane hot-melt systems, photoactivatable cationic adhesive systems, UV-activated Epoxy resin adhesive, two-component polymerization adhesive.

ever Depending on the type of card, one or the other joining method is preferable. So can thermal joining process in the production of complex maps negative effects on implanted have electronic components and the uneven distortion of individual card layers to lead. In such cases are therefore cold-curing Adhesive systems preferred. Also a combination of thermal Add the Map layers and subsequent Implanting electronic components by means of "cold" bonding techniques is possible. The more complex the maps are, the more complicated and complicated will the reliable, distortion-free and component-sparing assembly of the layers and implantation electronic components.

task The present invention is therefore to propose measures by means of which at least two card layers in uncomplicated and flexible usable way reliable, warp-free and durable if possible low load for Any functional elements implanted in the card layers are joined together can.

These Task is by a method and a joining tool as well as by produced multilayer card-shaped data carriers and Disk semi-finished products solved with the features of the independent claims. In dependent claims are indicated advantageous developments and refinements of the invention.

Accordingly become the card layers or at least two card layers one more than two layers having layer composite by means of a Laser transmission method permanently connected. Thereby Is it possible, for joining needed local thermal energy to exactly limit the area, in which the connection should be made. Because the heat is in this process, in the interior of the layer structure in a boundary layer between created two card layers.

requirement for the Application of this technology is merely that the materials the individual layers are coordinated so that the Laser beam first by one or more for the laser radiation transparent layers pass through unhindered until it reaches a material that absorbs the laser radiation in which the laser beam energy absorbs and in heat energy is implemented. this leads to to a local warming not only of the laser beam absorbing material but indirectly also the laser beam-permeable layer immediately adjacent thereto of the layer composite. All other layers of the layer composite remain at a suitable setting of the laser beam substantially without thermal stress.

In order to is a gentle, deformation - free and precise joining of multilayer data carriers and Disk semifinished possible. The composite can be over the entire surface be generated or partially limited. In the layer composite integrated functional elements can therefore targeted during the joining process be spared. It is sufficient if the layers arranged one above the other only in the areas of laser-beam-permeable or laser-beam absorbing Possess properties in which the connection is made should.

A particular advantage of the invention exists also in that the process steps of connecting the card layers and the fixing of functional elements in the layer composite, in particular of electronic components such as chip, display, keyboard, fingerprint sensor, etc., can be combined with each other. Namely, if the relevant Funktionsele element in turn has a connection surface which is suitable for the laser transmission technology, because it is either laser beam absorbing or laserstrahltransparent, so can be thermally connected in one operation, both the individual card layers together and the functional elements with the card layers. Under certain circumstances, the laser radiation in the joining areas concerned merely has to be adapted to the individual process parameters required there. However, the materials are preferably matched to one another in such a way that the laser radiation for connecting the card layers on the one hand and for connecting the functional elements to one or more of the card layers on the other hand does not have to be adapted.

Furthermore can by means of the laser - if necessary also in the same operation - by adapting the laser radiation Structures in selected Regions of individual layers are generated. It can be to the decorative structuring of surfaces of external layers or to pattern internal layers, e.g. for personalization by laser inscription, act.

through The laser transmission technology can not be just adjacent to each other thermoplastic materials by melting their boundary layer cohesively connect. Is there one or both of them to be connected Card layers of thermoset, i. not meltable, Material, it gets thinner Applying a thermally activated adhesive between the two Map layers provided. This adhesive is laser-beamed thermally activated by the adhesive either itself for the laser radiation is absorbent or by being absorbed by a laser radiation absorbing material Map layer adjacent, which by means of the laser beam transmission method the laser-transparent adhesive is heated through. The glue stops then a substance-liquid connection between the two adjacent card layers. Of course you can such an adhesive also between thermoplastic card layers be used.

Instead of a single thin one Glue application can also be applied to each of the two card layers to be joined an adhesive may be applied, one of which is for laser radiation transparent and the other is absorbent. The card layers are then joined together with their adhesive sides and the laser beam absorbing adhesive thermally activated by the laser-transparent adhesive, which indirectly also heats the laser-transparent adhesive and is activated.

When Materials for the card layers to be joined come the usual card plastics like PVC, ABS and PET whose spectral properties are due to suitable additives and fillers like that can be adjusted that they are for a certain laser radiation is permeable or just not permeable. Only the card-specific recipe specifications are especially regarding optical transparency and color neutrality or opacity and whiteness, to be observed.

It can be both semi-finished and semi-finished injection molded semi-finished products connect with each other by laser transmission. The semi-finished products can processed as continuous format, multi-use sheet or single-card use become. The semi-finished products can be prefabricated in various ways before using the laser beam method together become. So can a folding arch with contiguous front and back and inserted Funktionsinlett be welded. The semi-finished products can with cavities, components, graphic Imprints, electrical conductive structures and other applications be prefabricated.

A to carry out the method suitable laser bonding station can be put into a process line based on appropriate workpiece carrier systems and Handling systems to a particularly rational, automated Manufacturing be integrated. The joining tool of such a laser assembly station preferably has for pressure positioning of the card layers Pressure plates from one for the laser radiation used transparent material. To an unhindered, whole-area Laser beam guidance over the entire product area, i.e. at least about the whole Map format is to allow the pressure plate preferably laser-transparent throughout the entire surface. Instead of a full-surface laser welding The connection can also be done by appropriate laser beam guidance Contour-shaped, seam-shaped, dot-matrix or be executed in any other way.

Preferably, the laser process is performed symmetrically on both sides of the card layering. Accordingly, the Laserfügung station on each side of the card layer has a laser with laser control and a laser-transparent pressure plate. The symmetrical connection of the card layers from both sides of the card layer has the advantage that the heat energy of the welding process does not cause a one-sided voltage z NEN constructed in the material and associated material bulges are generated. This ensures an optimal flatness of the composite material after the connection process.

following the invention will be described by way of example with reference to the accompanying drawings described. Show:

1 a laser fusion station according to the present invention in a continuous process plant;

2 the two-sided joining process of three card layers in the laser transmission method;

3a and 3b the joining process of a thermoplastic with a thermosetting card layer by means of intermediate adhesive;

4a and 4b the joining process of two duroplastic card layers by means of intermediate adhesive;

5 the joining process of two duroplastic card layers by means of two different intermediate adhesives;

6 a multi-benefit semi-finished in plan view;

7 a map with all-over connected card layers in plan view;

8th a map with contour-shaped connection of the card layers in plan view;

9 a multilayer card in cross section with fixed in the laser transmission method functional element; and

10 a multilayer card in cross-section with integrated by laser beam transmission functional element.

1 shows a laser placement station 1 , in the two card covers 2 . 3 with a card core foil 4 be permanently connected with each other. The card core foil 4 can be prefabricated in many ways and in particular electrical conductive structures, electronic components, recesses for later implantation of functional elements, etc. have. The card cover foils 2 . 3 can be optically transparent or opaque depending on requirements. There may also be more than three or possibly only two films in the laser placement station 1 be connected to each other.

The slides 2 . 3 . 4 be through the laser placement station 1 clocked passed and in the laser assembly station 1 by means of two laser controls 100 guided lasers 6 . 7 assembled, which are arranged on opposite sides of the foil layering. Meanwhile, the three slides 2 . 3 . 4 by means of two pressure plates 8th . 9 pressed together. The pressure plates 8th . 9 are for the radiation 10 the laser 6 . 7 transparent. They cover the film stratification over the entire transport width and still a bit far beyond, to allow a full-surface, flat Anpresspositionierung the film stratification with unhindered full-surface laser beam guidance over the entire product area away, under product surface at least the surface of the to be produced or later to be separated out of the film stratification card format is to be understood. The films of the film stratification connected in the laser transmittance method finally become laminated on a roll 11 wound.

The lasers 6 . 7 are parallel to the pressure plates 8th . 9 and in particular transversely to the transport direction displaced to allow a connection of the individual layers over the entire transport width. Unless the laser controls 100 and the laser power are sufficiently powerful, the slides can 2 . 3 . 4 instead of clocked also continuously through the laser assembly station 1 transported and connected to each other during transport by laser transmission.

The laser placement station 1 can also be used in a similar manner to produce multi-benefit sheet or single card benefits. In this case, the multi-benefit sheets or single card benefits are successively by means of suitable workpiece carrier systems and handling systems between the pressure plates 8th . 9 brought and stationary connected by laser transmission.

The joining of plastic layers in the laser transmission method will be described in more detail below with reference to 2 explained. Laser transmission welding technology has long been known in other contexts. The underlying principle is based on the fact that laser radiation as long penetrates through a transparent material for this laser radiation until it encounters a material absorbing the laser radiation. Due to the absorption there, the laser beam energy is converted into heat energy, which leads to the softening of the material and, where appropriate, to the melting of the same. Due to the heat of fusion also heats the adjacent material through which the laser beam had previously penetrated, whereby this softens and possibly also melts. In the boundary layer between the laser absorb The laser-transparent material softens or melts both materials, so that they can cohesively connect to each other and produce a permanent connection after their cooling.

Accordingly, in 2 the card foils 3 . 4 . 5 pressed together between the two pressure plates 8th . 9 as shown on both sides by means of laser radiation 10 both in the boundary layer 12 between the cards 3 and 4 as well as in the boundary layer 13 between the cards 4 and 5 loka1 be heated. The card cover foils 2 and 4 are transparent to the laser radiation, whereas the centrally located card core foil 3 the laser radiation 10 absorbed. It heats up thus first the card core foil 3 each in the boundary layers 12 and 13 , which also causes the adjacent cover sheets 2 and 4 heated and melted until they are with the card core film 3 in the boundary layers 12 and 13 connect with each other. The softening or welding zone in the area of the boundary layers 12 . 13 is in 2 indicated.

That in terms of 2 described laser transmission method leads directly to the welding of the adjacent films 2 . 3 and 3 . 4 if these are fusible materials, in particular thermoplastics. When to the boundary layers 12 or 13 but one-sided or two-sided non-fusible materials, in particular thermoset materials, adjacent, an immediate fusion in the laser transmission method is not possible. In this case, a thermally activatable adhesive is provided in the boundary layer, which is suitable to form a material connection with both adjacent card layers. This may be, for example, a conventional hot-melt adhesive or a thermally activatable two-component adhesive.

3a shows by way of example two card layers to be interconnected 23 . 24 , of which the upper card layer 24 made of a thermoplastic, for the laser radiation 10 transparent plastic and the lower card layer 23 consists of a duroplastic. On the thermoset card layer 23 is an adhesive 13 applied when joining the card layers 23 . 24 in the boundary layer 13 comes to rest and the one through the top card layer 24 passing laser radiation 10 absorbed. The adhesive heats up 25 such that a material connection between the two layers 23 . 24 by interposing the adhesive 25 arises.

Because it is at the top layer 24 is a thermoplastic, the heated adhesive heats it in the boundary layer 13 also optionally to softening or melt as in 3a is indicated. If the lower card layer 23 Also made of a thermoplastic, it would depend on the thickness of the adhesive 25 and the intensity of its warming will depend, whether or not the lower layer 23 heated during the joining process to softening or melt. On the other hand, the upper card layer would exist 24 not of a thermoplastic but of a thermosetting plastic, it would be in the area of the boundary layer 13 do not soften. This case is in 4a shown where both the lower card layer 23 as well as the upper, laser-radiation-permeable card layer 26 consist of a thermosetting material.

3b shows a similar case as 3a , but with one for the laser radiation 10 transparent glue 35 , Provided in this case is an upper card layer 34 made of duroplastic and for the laser radiation 10 transparent material, on the underside of which the laser-beam-transparent adhesive 35 is applied. In the laser transmission process, the laser radiation occurs 10 thus unhindered by the upper card layer 34 and the glue 35 on an underlying, the laser radiation 10 absorbing card layer 33 , in the embodiment according to 3b made of thermoplastic material. Accordingly, both the thermoplastic card layer, if appropriate, heat up to the melt and the thermally activatable adhesive adjacent thereto.

It depends in turn on the thickness of the adhesive application, to what extent a heating of the adhesive 35 adjacent surface of the upper card layer 34 entry. In particular, the upper card layer 34 also consist of a thermoplastic material, which is adjacent to the boundary layer 13 optionally softened and / or the lower card layer 33 may consist of a thermosetting, non-fusible plastic. The latter case is in 4b shown. In this case, although the thermoset lower card layer heats up 36 , causing the glue 35 thermally activated. It does not soften, however.

5 shows a further embodiment for connecting two thermoset card layers in the laser transmission method. In this case, every card layer is 43 and 44 in the boundary layer area 13 provided with an adhesive application. The glue 35 the upper card layer 44 is for the laser radiation 10 transparent, whereas the adhesive 25 the lower card layer 43 absorbs the laser radiation. It therefore finds essentially a compound of the two adhesives 25 and 35 instead of.

6 shows an example of the welding of a multi-benefit semi-finished product 50 loka1 limits to the card formats to be removed later 51 , This is, for example, an ID-1 format. The welding takes place in the area of the card formats 51 Full surface through appropriate laser guidance.

7 shows a substantially full-surface welding of a single card benefit, which, for example, from the multi-benefit semi-finished product 50 according to 6 can be cut out. Single cavities 52 have been worked out in a subsequent process from the semifinished product, for example by milling. However, the cavities can also be provided in the relevant card layers even before the laser transmission connection process. In this case, the laser beam must be guided in such a way that the cavities remain recessed during the laser transmission process.

8th shows an alternative single card benefit, which differs from the single card benefit 7 it differs in that the welding only at the edge of the card 53 and along the contours 54 the cavities 52 was carried out. As a result, the production costs can be reduced.

9 shows one of many conceivable variants, such as a functional element 60 can be integrated in the composite layer by laser transmission. The thermoplastic card films 2 . 3 . 4 be in the laser beam transmission method according to with respect to 2 connected manner described. In the map slides 3 and 4 is a cavity 62 formed such that a support shoulder 63 is formed, on which the functional element 60 with a collar 61 rests. The collar 61 is for laser radiation 10 transparent and also consists of a thermoplastic material which is in the manner described above in the laser beam process with the support shoulder 63 the laser beam absorbing thermoplastic material of the card core film 3 connect. Under certain circumstances, for the Ver connection of the functional element 60 with the card core foil 3 the laser radiation 10 to set differently than for the connection of the upper card cover film 4 with the card core foil 3 ,

10 shows two further alternatives for implantation of a functional element 60 in a multi-layered card body. The left part of the 10 shows the case of a laser-transparent transparent card cover film 4 on a laser-absorbing card core foil 3 , which are each connected to each other thermoplastic and laser transmission method. The cavity 62 in the card core foil 3 again forms a support shoulder 63 on which the functional element 60 with its laser-transparent collar 61 rests. The connection produced in the laser transmission method then arises analogously to the exemplary embodiment according to FIG 9 between the collar 61 and the shoulder 63 ,

In the right part of the 10 on the other hand there is the collar 61 from a laser-beam-absorbing thermoplastic material, so that the connection produced by the laser transmission method between the card cover film 4 and the collar 61 of the functional element 60 arises.

Analogous to those in terms of 3 to 5 described embodiments is a compound of the functional element 60 with one or two card layers also possible with the interposition of a thermally activated adhesive.

Claims (29)

Method for permanently connecting at least two card layers ( 4 . 3 ; 24 . 23 ; 34 . 33 ; 44 . 43 ) of a multilayer card-shaped data carrier or semi-finished medium, wherein a first layer ( 4 ; 24 ; 34 ; 44 ) of the at least two card layers at least in regions for a specific laser radiation ( 10 ), characterized by the following steps: - providing the at least two card layers in a superimposed arrangement, and - irradiating the laser-beam-permeable first layer by means of the laser radiation in such a way that a material located behind it and absorbing the laser radiation ( 3 ; 25 ; 33 ; 35 ) is heated sufficiently, thereby forming a material connection between the first layer and a second layer ( 3 ; 23 ; 33 ; 43 ) of the at least two superimposed card layers. Method according to Claim 1, characterized in that the laser-beam-absorbing material is conveyed through the second layer ( 3 ; 33 ), which is at least partially absorbent for the laser radiation, wherein the first layer ( 4 ; 34 ) and the second layer ( 3 ; 33 ) are arranged in such a way to each other during the step of providing that laser-beam-permeable regions of the first layer and laser-beam-absorbing regions of the second layer lie above one another. Method according to claim 2, characterized in that furthermore a thermoactivatable adhesive ( 13 ) provided in the step of providing the at least two layers ( 34 . 33 ) between the first layer ( 34 ) and the second layer ( 33 ) and that for the laser radiation ( 10 ) is transparent, wherein the step of the transmittance is performed such that the laser beam absorbing material of the second layer ( 33 ) is heated sufficiently to remove the adhesive ( 35 ) to activate and thereby the cohesive connection between the first layer ( 34 ) and the second layer ( 33 ) with the interposition of the adhesive ( 35 ) to create. A method according to claim 1, characterized in that the laser beam absorbing material by a thermally activated adhesive ( 25 ) formed in the step of providing the at least two layers ( 24 . 23 ; 44 . 43 ) between the first layer ( 24 ; 44 ) and the second layer ( 23 ; 43 ), wherein the step of irradiating is performed such that the adhesive ( 25 ) is heated sufficiently to activate the adhesive and thereby the cohesive bond between the first layer ( 24 ; 44 ) and the second layer ( 23 ; 43 ) with the interposition of the adhesive ( 25 ) to create. A method according to claim 4, characterized in that between the laser beam absorbing thermally activated adhesive ( 25 ) and the first layer ( 44 ) a non-absorbing laser radiation thermoaktivierbarer adhesive ( 35 ) is provided. Method according to one of claims 3 to 5, characterized in that at least the first layer ( 24 ; 34 ; 44 ) or at least the second layer ( 23 ; 33 ; 43 ) consists of a thermosetting material. Method according to one of claims 1 to 6, characterized that the cohesive connection entire area is generated between the first layer and the second layer. Method according to one of claims 1 to 6, characterized that the cohesive connection partially generated between the first layer and the second layer becomes. Method according to claim 8, characterized in that that the partial cohesive Compound contour-shaped, seam shape or dot-matrix is produced. Method according to one of claims 1 to 9, characterized by the further steps: - providing one for the laser radiation ( 10 ) permeable layer ( 2 ) as the third layer of the at least two layers ( 2 . 3 . 4 ), wherein in the step of assembling the second layer ( 3 ) between the first layer ( 4 ) and the third layer ( 2 ), and - creating a material connection between the third layer ( 2 ) and the second layer ( 3 ) analogous to the method according to one of claims 1 to 9. A method according to claim 10, characterized in that the steps for generating the material connection between the first layer ( 4 ) and the second layer ( 3 ) and between the third layer ( 2 ) and the second layer ( 3 ) at the same time. A method according to claim 10 or 11, characterized in that the steps for producing the material connection between the first layer ( 4 ) and the second layer ( 3 ) and between the third layer ( 2 ) and the second layer ( 3 ) are performed so that the cohesive compounds produced congruent superimposed. Method according to one of claims 1 to 12, characterized by the further steps: - providing at least one functional element ( 60 ), - contacting a connection surface ( 61 ) of the functional element with a layer ( 3 ; 4 ) of the at least two card layers ( 2 . 3 . 4 ), and - connecting the functional element ( 60 ) with this layer ( 3 ; 4 ) in the area of the connecting surface ( 61 ) in the laser transmission method. Method according to claim 13, characterized in that that the laser transmission method by means of the specific laser radiation he follows. Method according to claim 14, characterized in that that the cohesive Connection of the at least two card layers and the connection the functional element with the one layer of at least two Map layers done in a single operation. Method according to one of claims 1 to 15, characterized by the further step of creating structures on or in at least one selected the at least two card layers by means of laser radiation. Method according to one of claims 1 to 16, characterized that the at least two card layers in the step of providing already pre-assembled. Multilayer card-shaped data carrier or multi-layer card-shaped data carrier semifinished product comprising at least two materially liquid ( 2 . 3 ; 4 . 3 ; 24 . 23 ; 34 . 33 ; 44 . 43 ) interconnected card layers, wherein the cohesive connection is a compound produced by laser transmission method. A data carrier or semi-finished medium according to claim 18, characterized in that the at least two card layers ( 2 . 3 ; 4 . 3 ) in each case consist of thermoplastic material and are directly welded together by laser transmission method. A data carrier or semi-finished medium according to claim 18, characterized in that the at least two card layers ( 24 . 23 ; 34 . 33 ; 44 . 43 ) via a thermally activated by the laser transmission method adhesive ( 25 ; 35 ) are cohesively connected to each other. A data carrier or semi-finished medium according to claim 20, characterized in that at least one layer ( 23 ; 33 ; 43 ) of the at least two card layers consists of a thermosetting plastic. disk or semi-finished media according to one of the claims 18 to 21, characterized in that the cohesive connection over the entire surface between the at least two card layers extends. disk or semi-finished media according to one of the claims 18 to 22, characterized in that the cohesive connection partially extends between the at least two card layers. disk or semi-finished media according to claim 23, characterized in that the partial cohesive connection contour shape, seam shape or dot-matrix is. A data carrier or semi-finished medium according to any one of claims 18 to 24, characterized in that the at least two card layers have two outer layers transparent to a specific laser radiation ( 2 . 4 ) and at least one internal, this laser radiation absorbing layer ( 3 ), wherein between the outer, laser radiation-transparent layers ( 2 . 4 ) and the cohesive, internal, laser-radiation-absorbing layer ( 3 ) in each case a cohesive connection in the laser transmission method is generated. A data carrier or semi-finished medium according to claim 25, characterized in that the connections generated in the laser transmission method between the outer layers ( 2 . 4 ) and the inner layer ( 3 ) overlap congruently. A data carrier or semi-finished medium according to any one of claims 18 to 26, characterized by a fixed in the laser transmission method in the data carrier or semi-finished medium functional element ( 60 ). disk according to one of the claims 18 to 27, characterized by a laser beam generated Structure in or on one of the at least two layers. Joining tool for carrying out the method according to one of claims 1 to 17, characterized by - at least one laser ( 6 . 7 ) for generating a specific laser radiation ( 10 ), - at least one for the particular laser radiation ( 10 ) permeable pressure plate ( 8th . 9 ) for holding down at least two superimposed card layers ( 2 . 3 . 4 ), and - a laser control ( 100 ) for guiding the laser ( 8th . 9 ) over the held down card layers ( 2 . 3 . 4 ) by the pressure plate ( 8th . 9 ) directed laser radiation ( 10 ), wherein the areal extent of the pressure plate ( 8th . 9 ) is such that the card layers at least over the area of a card format to be generated ( 51 ) and in this respect the entire surface by means of the laser ( 6 . 7 ) are editable.