DE102018110211A1 - Verfahren zum Erzeugen feiner Strukturen im Volumen eines Substrates aus sprödharten Material - Google Patents

Verfahren zum Erzeugen feiner Strukturen im Volumen eines Substrates aus sprödharten Material Download PDF

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Publication number
DE102018110211A1
DE102018110211A1 DE102018110211.9A DE102018110211A DE102018110211A1 DE 102018110211 A1 DE102018110211 A1 DE 102018110211A1 DE 102018110211 A DE102018110211 A DE 102018110211A DE 102018110211 A1 DE102018110211 A1 DE 102018110211A1
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Germany
Prior art keywords
substrate
cavity
glass
damage
filamentous
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE102018110211.9A
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German (de)
English (en)
Inventor
Andreas Ortner
Andreas Roters
Hauke Esemann
Markus Heiss-Chouquet
Fabian Wagner
Laura Brückbauer
Stephanie Mangold
Vanessa Hiller
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Schott AG
Original Assignee
Schott AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schott AG filed Critical Schott AG
Priority to DE102018110211.9A priority Critical patent/DE102018110211A1/de
Priority to US16/395,569 priority patent/US11534754B2/en
Priority to CN202310008556.4A priority patent/CN115922114A/zh
Priority to KR1020190049154A priority patent/KR102864923B1/ko
Priority to CN201910344052.3A priority patent/CN110405369B/zh
Priority to JP2019085719A priority patent/JP7562242B2/ja
Priority to TW108114740A priority patent/TWI791824B/zh
Publication of DE102018110211A1 publication Critical patent/DE102018110211A1/de
Priority to US17/893,860 priority patent/US12172157B2/en
Priority to JP2023137349A priority patent/JP2023164878A/ja
Priority to US18/924,649 priority patent/US20250050329A1/en
Priority to KR1020250136441A priority patent/KR20250151213A/ko
Pending legal-status Critical Current

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    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
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    • B23K26/55—Working by transmitting the laser beam through or within the workpiece for creating voids inside the workpiece, e.g. for forming flow passages or flow patterns
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
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    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
    • G03F7/2053—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
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    • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1 ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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    • B23K26/386—Removing material by boring or cutting by boring of blind holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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  • General Health & Medical Sciences (AREA)
  • Hematology (AREA)
  • Clinical Laboratory Science (AREA)
  • Computer Hardware Design (AREA)
  • Toxicology (AREA)
  • Surface Treatment Of Glass (AREA)
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DE102018110211.9A 2018-04-27 2018-04-27 Verfahren zum Erzeugen feiner Strukturen im Volumen eines Substrates aus sprödharten Material Pending DE102018110211A1 (de)

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JP2019085719A JP7562242B2 (ja) 2018-04-27 2019-04-26 脆性材料から成る基板の容積に微細な構造を形成する方法
CN202310008556.4A CN115922114A (zh) 2018-04-27 2019-04-26 用于在由脆硬材料制成的基板的体积中产生微结构的方法
KR1020190049154A KR102864923B1 (ko) 2018-04-27 2019-04-26 경취성 재료를 포함하는 기재의 체적 중에 미세 구조를 생성하는 방법
CN201910344052.3A CN110405369B (zh) 2018-04-27 2019-04-26 用于在由脆硬材料制成的基板的体积中产生微结构的方法
US16/395,569 US11534754B2 (en) 2018-04-27 2019-04-26 Method for producing fine structures in the volume of a substrate composed of hard brittle material
TW108114740A TWI791824B (zh) 2018-04-27 2019-04-26 用於在由脆硬材料製成的基板的體積中產生微結構的方法
US17/893,860 US12172157B2 (en) 2018-04-27 2022-08-23 Method for producing fine structures in the volume of a substrate composed of hard brittle material
JP2023137349A JP2023164878A (ja) 2018-04-27 2023-08-25 脆性材料から成る基板の容積に微細な構造を形成する方法
US18/924,649 US20250050329A1 (en) 2018-04-27 2024-10-23 Method for producing fine structures in the volume of a substrate composed of hard brittle material
KR1020250136441A KR20250151213A (ko) 2018-04-27 2025-09-22 경취성 재료를 포함하는 기재의 체적 중에 미세 구조를 생성하는 방법

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US20220401953A1 (en) 2022-12-22
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