DE102017211619A1 - Method for electrical contacting and power module - Google Patents

Method for electrical contacting and power module Download PDF

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Publication number
DE102017211619A1
DE102017211619A1 DE102017211619.6A DE102017211619A DE102017211619A1 DE 102017211619 A1 DE102017211619 A1 DE 102017211619A1 DE 102017211619 A DE102017211619 A DE 102017211619A DE 102017211619 A1 DE102017211619 A1 DE 102017211619A1
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Germany
Prior art keywords
contact layer
contact
power module
component
open
Prior art date
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DE102017211619.6A
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German (de)
Inventor
Hubert Baueregger
Albrecht Donat
Michael Kaspar
Kai Kriegel
Gerhard Mitic
Markus Schwarz
Herbert Schwarzbauer
Stefan Stegmeier
Karl Weidner
Jörg Zapf
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Siemens AG
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Siemens AG
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Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to PCT/EP2018/052292 priority Critical patent/WO2018145955A2/en
Publication of DE102017211619A1 publication Critical patent/DE102017211619A1/en
Withdrawn legal-status Critical Current

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    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/32227—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the layer connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/32235—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the layer connector connecting to a via metallisation of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/83909—Post-treatment of the layer connector or bonding area
    • H01L2224/8392—Applying permanent coating, e.g. protective coating

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Cell Electrode Carriers And Collectors (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

Bei dem Verfahren zur elektrischen Kontaktierung eines Bauteils mit mindestens einem elektrischen Kontakt wird an den zumindest einen Kontakt eine offenporige Kontaktschicht additiv gebildet.In the method for making electrical contact with a component having at least one electrical contact, an open-pored contact layer is formed additively to the at least one contact.

Description

Die Erfindung betrifft ein Verfahren zur elektrischen Kontaktierung und ein Leistungsmodul.The invention relates to a method for electrical contacting and a power module.

In der Leistungselektronik, etwa bei Leistungsmodulen, werden passive Bauteile wie etwa Widerstände sowie Halbleiterbauteile wie beispielsweise IGBTs, Dioden, MOSFETS, LEDs und Substrate wie etwa FR4, DCB (engl.: „Direct copper bonded“), AMB (engl.: „Active metal braze“) und Leadframes elektrisch mittels einer Aufbau- und Verbindungstechnik miteinander verbunden.In power electronics, such as power modules, passive components such as resistors as well as semiconductor devices such as IGBTs, diodes, MOSFETs, LEDs and substrates such as FR4, DCB (Direct Copper Bonded), AMB (English: Active metal braze ") and leadframes electrically interconnected by means of a construction and connection technology.

Hierzu ist grundsätzlich eine Vielzahl von Verbindungstechniken zur Herstellung von Leistungsmodulen bekannt. Eine insbesondere substratferne elektrische Kontaktierung erfordert allerdings häufig zusätzliche und aufwändige Prozessschritte.For this purpose, a variety of connection techniques for the production of power modules is basically known. However, a particular substrate remote electrical contacting often requires additional and complex process steps.

Es ist daher Aufgabe der Erfindung, ein verbessertes Verfahren zur Kontaktierung bereitzustellen, bei welchem die elektrische Kontaktierung von Bauteilen verbessert ist und vorzugsweise auch die Kontaktierung substratferner elektrischer Bauteile insbesondere eines Leistungsmoduls vereinfacht ist. Ferner ist es Aufgabe der Erfindung, ein verbessertes Leistungsmodul bereitzustellen.It is therefore an object of the invention to provide an improved method for contacting in which the electrical contacting of components is improved and preferably also the contacting substrate-remote electrical components, in particular a power module is simplified. It is another object of the invention to provide an improved power module.

Diese Aufgabe der Erfindung wird mit einem Verfahren zur elektrischen Kontaktierung mit den in Anspruch 1 angegebenen Merkmalen sowie mit einem Leistungsmodul mit den in Anspruch 10 angegebenen Merkmalen gelöst. Bevorzugte Weiterbildungen der Erfindung ergeben sich aus den zugehörigen Unteransprüchen, der nachfolgenden Beschreibung und der Zeichnung.This object of the invention is achieved by a method for electrical contacting with the features specified in claim 1 and with a power module having the features specified in claim 10. Preferred embodiments of the invention will become apparent from the accompanying dependent claims, the following description and the drawings.

Bei dem erfindungsgemäßen Verfahren zur elektrischen Kontaktierung eines Bauteils mit mindestens einem elektrischen Kontakt wird an den zumindest einen Kontakt eine offenporige Kontaktschicht additiv gebildet, also gefertigt. D.h. erfindungsgemäß wird die Kontaktschicht derart additiv gebildet, dass die gebildete Kontaktschicht an dem Kontakt anliegt. Zweckmäßig liegt die Kontaktschicht während des Verfahrens, d.h. während des Bildungsprozesses an dem Kontakt an. Geeigneterweise liegt die Kontaktschicht auf dem Kontakt auf. Soweit im Rahmen dieser Anmeldung von „additiv gebildet“ oder „additiv gefertigt“ die Rede ist, ist gemeint, dass im Sinne der sogenannten „additiven Fertigung“ oder der „generativen Fertigung“ gefertigt wird. Mittels der additiven Fertigung der Kontaktschicht kann eine auch eine kontaktflächenferne, im Falle einer Kontaktfläche eines Substrats insbesondere eine substratferne, Kontaktierung des Bauteils an weitere Komponenten passgenau und unaufwändig erfolgen. Insbesondere muss keine Fertigung eines Kontaktstücks im Vorhinein vorgesehen sein, sondern die Fertigung der Kontaktschicht kann bei dem erfindungsgemäßen Verfahren in den sonstigen Prozessablauf integriert, insbesondere im Falle eines Leistungsmoduls mit der übrigen Bestückung, erfolgen. Zweckmäßig ist der elektrische Kontakt des Bauteils eine Kontaktfläche. Gerade Kontaktflächen können mit offenporigen Kontaktschichten leicht flächig elektrisch kontaktiert werden.In the method according to the invention for making electrical contact with a component having at least one electrical contact, an open-pored contact layer is formed additively to the at least one contact, ie manufactured. That According to the invention, the contact layer is formed so additive that the contact layer formed is applied to the contact. Suitably, the contact layer is during the process, i. during the educational process at the contact. Suitably, the contact layer is on the contact. As far as in the context of this application of "additive formed" or "additive manufactured" is mentioned, it is meant that in the sense of the so-called "additive manufacturing" or "generative manufacturing" is made. By means of the additive production of the contact layer can also be a contact surface remote, in the case of a contact surface of a substrate in particular a substrate remote, contacting the component to other components accurately and inexpensively. In particular, no production of a contact piece must be provided in advance, but the production of the contact layer can be integrated in the process according to the invention in the other process flow, in particular in the case of a power module with the other equipment done. Suitably, the electrical contact of the component is a contact surface. Even contact surfaces can be contacted with open-pored contact layers slightly flat electrically.

Zweckmäßig wird bei dem erfindungsgemäßen Verfahren die offenporige Kontaktschicht mit elektrisch leitfähigem Material, insbesondere mit einem Metall, vorzugsweise mit Kupfer und/oder Gold und/oder Molybdän und/oder Nickel und/oder Silber und/oder Zinn und/oder Aluminium, gebildet.The open-pore contact layer with electrically conductive material, in particular with a metal, preferably with copper and / or gold and / or molybdenum and / or nickel and / or silver and / or tin and / or aluminum, is expediently formed in the method according to the invention.

Bevorzugt wird bei dem erfindungsgemäßen Verfahren die Kontaktschicht mit einer geordneten Struktur oder als eine geordnete Struktur, insbesondere mit einem geordneten Array von Einzelkomponenten der Kontaktschicht und/oder mit einem Gewebe und/oder Gitter, gebildet. Alternativ und ebenfalls bevorzugt wird bei dem erfindungsgemäßen Verfahren die Kontaktschicht mit einer ungeordneten Struktur oder als eine ungeordnete Struktur, insbesondere mit einem Knäuel und/oder einem Vlies und/oder einer schaum- und/oder schwammartigen Struktur, insbesondere mit einem Metallschaum, gebildet.In the method according to the invention, the contact layer is preferably formed with an ordered structure or as an ordered structure, in particular with an ordered array of individual components of the contact layer and / or with a fabric and / or grid. Alternatively and also preferably, in the method according to the invention the contact layer is formed with a disordered structure or as a disordered structure, in particular with a ball and / or a fleece and / or a foam and / or sponge-like structure, in particular with a metal foam.

Vorzugsweise wird bei dem erfindungsgemäßen Verfahren die Kontaktschicht, insbesondere mittels einer Düse, mit einem Knäuel oder als Knäuel gebildet. In dieser Weiterbildung ist die Ausbildung der Kontaktschicht auf besonders einfache und direkte Weise möglich. Insbesondere können die Offenporigkeit des Knäuels sowie die geometrischen Abmessungen der Kontaktschicht einfach mittels entsprechenden Verfahrens der Düse zuverlässig eingestellt und gesteuert werden.Preferably, in the method according to the invention, the contact layer, in particular by means of a nozzle, is formed with a ball or as a ball of yarn. In this development, the formation of the contact layer is possible in a particularly simple and direct manner. In particular, the open porosity of the ball as well as the geometrical dimensions of the contact layer can be adjusted and controlled easily by means of a corresponding method of the nozzle.

In einer weiteren Weiterbildung der Erfindung und ebenfalls bevorzugt wird bei dem erfindungsgemäßen Verfahren die Kontaktschicht, insbesondere mittels einer Düse, mit einem gefalteten Gewebe oder als ein gefaltetes Gewebe gebildet.In a further development of the invention and also preferably, in the method according to the invention, the contact layer is formed, in particular by means of a nozzle, with a folded fabric or as a folded fabric.

In einer weiteren Weiterbildung der Erfindung und ebenfalls bevorzugt wird bei dem erfindungsgemäßen Verfahren die Kontaktschicht, insbesondere mittels einer Düse, mit Schaumbröseln oder als Schaumbrösel gebildet. Geeigneterweise werden die Schaumbrösel durch Zerkleinerung eines Metallschaums, insbesondere eines Kupferschwamms, erhalten. Vorzugsweise werden bei dem erfindungsgemäßen Verfahren die Schaumbrösel mit einer Trägerflüssigkeit vermengt aus der Düse ausgegeben, also gewissermaßen ähnlich dem Ink-Jet-Drucken und/oder Jetting-Drucken und/oder Sieb/Schablonen-Drucken auf den Kontakt gedruckt.In a further development of the invention and also preferred, in the method according to the invention, the contact layer, in particular by means of a nozzle, is formed with foam crumbs or as a foam crumb. Suitably, the foam crumbs are obtained by comminuting a metal foam, in particular a copper sponge. Preferably, in the method according to the invention, the foam crumbs mixed with a carrier liquid are dispensed from the nozzle, so to speak somewhat similar to the ink-jet printing and / or jetting and / or screen / stencil printing printed on the contact.

Bevorzugt wird bei dem erfindungsgemäßen Verfahren die Kontaktschicht mittels 3D-Druckens und/oder mittels Ink-Jettens gebildet. In the method according to the invention, the contact layer is preferably formed by means of 3D printing and / or by means of ink jetting.

Geeigneterweise wird bei dem Verfahren an die Kontaktschicht eine weitere elektrische Komponente elektrisch kontaktiert, sodass die Kontaktschicht das Bauteil und die elektrische Komponente miteinander elektrisch kontaktiert. Zweckmäßig wird das Verfahren gemäß der Erfindung zur elektrischen Kontaktierung eines Bauteils eines Leistungsmoduls durchgeführt.Suitably, in the method, a further electrical component is electrically contacted to the contact layer so that the contact layer makes electrical contact with the component and the electrical component. Suitably, the method according to the invention for the electrical contacting of a component of a power module is performed.

Zweckmäßig wird bei dem erfindungsgemäßen Verfahren die Kontaktschicht, nachdem sie additiv an den Kontakt gefertigt worden ist, zusätzlich mittels Galvanisierens, insbesondere elektrochemisch oder außenstromfrei, leitend und stoffschlüssig an den Kontakt angebunden.Appropriately, in the method according to the invention, the contact layer, after it has been manufactured additive to the contact, additionally connected by means of electroplating, in particular electrochemically or without external current, conductive and cohesively to the contact.

Das erfindungsgemäße Leistungsmodul wird mithilfe eines Verfahrens nach einem der vorhergehenden Ansprüche hergestellt.The power module according to the invention is produced by means of a method according to one of the preceding claims.

Zweckmäßig weist das erfindungsgemäße Leistungsmodul ein Bauteil mit mindestens einem elektrischen Kontakt auf, bei welchem mittels des erfindungsgemäßen Verfahrens an den zumindest einen Kontakt eine offenporige Kontaktschicht additiv gefertigt worden ist.Expediently, the power module according to the invention has a component with at least one electrical contact, in which an open-pored contact layer has been produced additively by means of the method according to the invention to the at least one contact.

Bevorzugt weist das erfindungsgemäße Leistungsmodul einen Kühlkanal auf, wobei das Bauteil geeigneterweise im Kühlkanal angeordnet ist und der Kühlkanal insbesondere zur Durchströmung der Kontaktschicht ausgebildet ist. Auf diese Weise ist bei dem erfindungsgemäßen Leistungsmodul das Bauteil, insbesondere ein Leistungsbauteil, besonders effizient entwärmbar. In dieser Weiterbildung der Erfindung kann Kühlfluid, insbesondere Kühlflüssigkeit oder Kühlgas, die Kontaktschicht aufgrund deren Offenporigkeit oder Offenzelligkeit durchsetzen und eine Entwärmung bewirken.Preferably, the power module according to the invention has a cooling channel, wherein the component is suitably arranged in the cooling channel and the cooling channel is formed in particular for the flow through the contact layer. In this way, in the power module according to the invention, the component, in particular a power component, can be heated particularly efficiently. In this development of the invention, cooling fluid, in particular cooling fluid or cooling gas, can pass through the contact layer on account of its open-poredness or open-celledness and cause heat dissipation.

Nachfolgend wird die Erfindung anhand eines in der Zeichnung dargestellten Ausführungsbeispiels näher erläutert. Es zeigen:

  • 1 ein erstes Ausführungsbeispiel des erfindungsgemäßen Verfahrens zur elektrischen Kontaktierung zwecks Fertigung eines ersten Ausführungsbeispiels eines erfindungsgemäßen Leistungsmoduls mittels Abscheidung eines Metallknäuels schematisch im Längsschnitt,
  • 2 ein zweites Ausführungsbeispiel des erfindungsgemäßen Verfahrens mittels Abscheidung eines Metallgitters (hier der Faltung eines Drahtes oder Gitters) schematisch im Längsschnitt,
  • 3 ein drittes Ausführungsbeispiel des erfindungsgemäßen Verfahrens mittels Drucks von metallenen Schaumbröseln schematisch im Längsschnitt sowie
  • 4 ein weiteres Ausführungsbeispiel eines erfindungsgemäßen Leistungsmoduls mit dem gem. dem erfindungsgemäßen Verfahren gem. 3 gedruckten Metallschaum schematisch im Längsschnitt.
The invention will be explained in more detail with reference to an embodiment shown in the drawing. Show it:
  • 1 a first embodiment of the method according to the invention for electrical contacting for the purpose of manufacturing a first embodiment of a power module according to the invention by means of deposition of a metal coil schematically in longitudinal section,
  • 2 a second embodiment of the method according to the invention by means of deposition of a metal grid (here the folding of a wire or grid) schematically in longitudinal section,
  • 3 a third embodiment of the method according to the invention by means of pressure of metal foam crumbs schematically in longitudinal section and
  • 4 a further embodiment of a power module according to the invention with the gem. the method according to the invention. 3 printed metal foam schematic in longitudinal section.

Bei dem in 1 dargestellten Ausführungsbeispiel des erfindungsgemäßen Verfahrens wird ein Substrat 10 in Gestalt eines Flachteils mit einer Flachseite 20 herangezogen, welche eine Kontaktfläche 30 aufweist. Die Kontaktfläche 30 ist mittels eines Durchkontakts 40 an weitere Bauteile angebunden. Das Substrat 10 mit der Kontaktfläche 30 bildet einen Teil eines erfindungsgemäßen Leistungsmoduls 50.At the in 1 illustrated embodiment of the method according to the invention is a substrate 10 in the form of a flat part with a flat side 20 used, which is a contact surface 30 having. The contact surface 30 is by means of a through contact 40 connected to other components. The substrate 10 with the contact surface 30 forms part of a power module according to the invention 50 ,

Diese Kontaktfläche 30 an der Flachseite 20 des Substrats 10 des Leistungsmoduls 50 wird in einem ersten Ausführungsbeispiel des erfindungsgemäßen Verfahrens mittels eines Metallknäuels 160 an weitere Bestandteile des Leistungsmoduls 50, etwa an Leistungsbauteile des Leistungsmoduls 50, elektrisch kontaktiert. Dazu wird Metall, im dargestellten Ausführungsbeispiel Molybdän, mittels einer Düse 55 auf die Kontaktfläche 30 an der Flachseite 20 des Substrats 10 als Knäuel 160 abgeschieden, wonach das Knäuel 160 auf der Kontaktfläche 30 weiter erkaltet. Das Knäuel 160 stellt ein offenporiges, offenzelliges Material dar, welches eine elektrische Kontaktschicht bildet. Das Material Molybdän kommt im dargestellten Ausführungsbeispiel aufgrund des geringen thermischen Ausdehnungskoeffizenten zum Einsatz.This contact surface 30 on the flat side 20 of the substrate 10 of the power module 50 is in a first embodiment of the method according to the invention by means of a metal ball 160 to other components of the power module 50 , for example on power components of the power module 50 , electrically contacted. For this purpose, metal, molybdenum in the illustrated embodiment, by means of a nozzle 55 on the contact surface 30 on the flat side 20 of the substrate 10 as a ball of yarn 160 separated, after which the ball 160 on the contact surface 30 further cooled. The ball 160 represents an open-pore, open-cell material which forms an electrical contact layer. The material molybdenum is used in the illustrated embodiment due to the low thermal expansion coefficient.

Bei dem erfindungsgemäßen Verfahren wird die Düse 55 zweidimensional in einer zur Kontaktfläche 30 parallelen Ebene über der Kontaktfläche 30 verfahren. Mittels der Verfahrgeschwindigkeit und der Abscheiderate kann die Offenzelligkeit, d.h. die Größe der durch dieses Knäuel 160 hindurch führenden Kanäle, über einen weiten Parameterbereich eingestellt werden und auf den jeweils konkreten Anwendungsfall hinsichtlich Stromtragfähigkeit, Elastizität, Masse, Größe und Kosten der so gebildeten Kontaktschicht geeignet eingestellt werden. In weiteren, nicht eigens dargestellten Ausführungsbeispielen kann der Draht anstelle oder zusätzlich zu Molybdän mit Kupfer und/oder Gold und/oder Aluminium und/oder Nickel gebildet sein. Zweckmäßig wird dabei die Düse 55 derart verfahren, dass das Knäuel 160 ein ebenes Plateau aufweist, welches an eine Kontaktfläche eines weiteren Bestandteils des erfindungsgemäßen Leistungsmoduls flächig kontaktierbar ist. Es ist alternativ oder zusätzlich denkbar, eines oder mehrere Bauelemente auf das Knäuel 160 zu setzen und mittels Galvanisierens das oder die Bauelemente mit dem Knäuel 160 elektrisch zu verbinden. Entsprechend kann auch bei dem offenporigen Material (d.h. Knäuel, Gewebe, Metallschaum aus Schaumbröseln) Dies gilt ebenso für das offenporige Material und alle folgenden dargestellten Ausführungsbeispiele.In the method according to the invention, the nozzle becomes 55 two-dimensional in one to the contact surface 30 parallel plane above the contact surface 30 method. By means of the traversing speed and the deposition rate, the open-celledness, ie the size of the ball through this ball 160 leading channels, be adjusted over a wide range of parameters and adjusted to the specific application in terms of current carrying capacity, elasticity, mass, size and cost of the contact layer thus formed suitable. In further, not specifically illustrated embodiments, the wire may be formed instead of or in addition to molybdenum with copper and / or gold and / or aluminum and / or nickel. Appropriately, the nozzle 55 is moved so that the ball 160 has a flat plateau, which is contactable surface to a contact surface of another component of the power module according to the invention. It is alternatively or additionally conceivable, one or more components on the ball 160 to set and by galvanizing the one or more components with the ball 160 electrically connect. Accordingly, also in the case of the open-pore material (ie, ball, fabric, metal foam made of foam crumbs), this also applies to the open-pored material and to all embodiments shown below.

Im in 2 dargestellten Ausführungsbeispiel wird vergleichbar dem anhand von 1 erläuterten Verfahren vorgegangen. Im Unterscheid zum Verfahren gem. 1 wird allerdings nicht ein Knäuel mittels der Düse 55 erzeugt, sondern mittels der Düse 55 wird ein mit Kupfer gebildetes Gewebe oder Draht 260, im gezeigten Ausführungsbeispiel ein Kupfernetz, auf der Kontaktfläche abgeschieden. Dabei wird die Düse 55 derart hin- und her bewegt, dass das Kupfernetz gefaltet wird, sodass nach jeder Faltung eine neue Lage des Kupfernetzes auf die bisherigen Lagen abgeschieden wird. Auch auf diese Weise wird mittels des gefalteten Gewebes oder Drahts 260 eine Kontaktschicht offenporigen und offenzelligen Materials gebildet. Wie in dem zuvor beschriebenen Ausführungsbeispiel ist das Gewebe oder der Draht 260 mit Kupfer gebildet, in weiteren nicht eigens dargestellten Ausführungsbeispielen kann das Gewebe oder der Draht 260 mit oder aus Gold und/oder Molybdän und/oder weiteren Materialien, insbesondere Metallen, gebildet sein.Im in 2 illustrated embodiment is comparable to the basis of 1 proceeded explained procedure. In the difference to the procedure gem. 1 but not a ball by means of the nozzle 55 generated, but by means of the nozzle 55 becomes a fabric or wire formed with copper 260 , In the embodiment shown, a copper network, deposited on the contact surface. In this case, the nozzle 55 is moved back and forth so that the copper network is folded so that after each folding a new position of the copper network is deposited on the previous layers. Also in this way is by means of the folded fabric or wire 260 a contact layer open-pore and open-cell material formed. As in the previously described embodiment, the fabric or wire is 260 formed with copper, in other non-specifically illustrated embodiments, the fabric or wire 260 be formed with or from gold and / or molybdenum and / or other materials, in particular metals.

Im in 3 dargestellten Ausführungsbeispiel wird ein Metallschaum auf die Kontaktfläche 30 aufgedruckt. Dazu wird mittels der Düse 55 ein heterogenes Gemisch aus einer Trägerflüssigkeit 355 mit darin befindlichen Schaumbröseln 360 auf die Kontaktfläche 30 aufgebracht. Diese Schaumbrösel 360 entstammen dabei aus zuvor bereitgestelltem Metallschaum, im dargestellten Ausführungsbeispiel ein Kupferschwamm, welcher zu einem Granulat geeigneter Körnigkeit, d.h. den Schaumbröseln 360, geraspelt ist. Die Schaumbrösel 360 werden dann mit Trägerflüssigkeit 355 vermengt und zur Düse 55 geführt, welche die Trägerflüssigkeit 355 und die Schaumbrösel 360 gemeinsam auf die Kontaktfläche 30 ausbringt.Im in 3 illustrated embodiment, a metal foam on the contact surface 30 printed. This is done by means of the nozzle 55 a heterogeneous mixture of a carrier liquid 355 with foam crumbs inside 360 on the contact surface 30 applied. These foam crumbs 360 come from previously provided metal foam, in the illustrated embodiment, a copper sponge, which granules to a suitable granularity, ie the foam crumbs 360 , is rasped. The foam crumbs 360 then be with carrier liquid 355 mixed and to the nozzle 55 guided, which the carrier liquid 355 and the foam crumbs 360 together on the contact surface 30 comprises applying.

Nachdem das heterogene Gemisch auf die Kontaktfläche 30 aufgebracht ist, evaporiert die Trägerflüssigkeit 355. Im gezeigten Ausführungsbeispiel unterstützt eine Zufuhr von Wärme 420 mittels einer Heizung (nicht gezeigt) das Evaporieren der Trägerflüssigkeit 355. Somit verbleiben nach einer Zeitspanne lediglich die Schaumbrösel 360 abgeschieden auf der Kontaktfläche 30, sodass die Schaumbrösel 360 wieder zu einem Metallschaum zusammengebracht sind. Auf diese Weise ist mittels der Schaumbrösel 360 eine Schicht offenporigen und offenzelligen Materials gebildet, welche eine Kontaktschicht zur elektrischen Kontaktierung der Kontaktfläche 30 bildet.After the heterogeneous mixture on the contact surface 30 is applied, the carrier liquid evaporates 355 , In the illustrated embodiment, supply of heat 420 by means of a heater (not shown) assists in evaporating the carrier liquid 355 , Thus remain after a period of time only the foam crumbs 360 deposited on the contact surface 30 so that the foam crumbs 360 are brought together again to a metal foam. In this way is by means of the foam crumb 360 a layer of open-pored and open-cell material is formed, which has a contact layer for making electrical contact with the contact surface 30 forms.

In sämtlichen gezeigten Ausführungsbeispielen kann bei dem erfindungsgemäßen Verfahren anschließend das offenporige Material an die Kontaktfläche 30 zusätzlich elektrisch leitend und stoffschlüssig angebunden werden, insbesondere mittels elektrochemischen oder außenstromfreien Galvanisierens.In all the exemplary embodiments shown, the open-pored material can then be applied to the contact surface in the method according to the invention 30 additionally be connected electrically conductive and cohesive, in particular by means of electrochemical or electroless plating.

Alternativ zu den oben anhand der Zeichnung erläuterten Ausführungsbeispielen kann die Kontaktschicht offenporigen Materials auch mit einer hohen räumlich-strukturellen Ordnung gebildet werden. Im einfachsten Falle lässt sich eine solche Schicht mit Kupfer-Nagel-Köpfen zusammensetzen, welche geordnet auf der Kontaktfläche 30 auf- oder eingebracht werden.As an alternative to the exemplary embodiments explained above with reference to the drawing, the contact layer of open-pored material can also be formed with a high spatial-structural order. In the simplest case, such a layer can be assembled with copper nail heads, which are arranged on the contact surface 30 be introduced or introduced.

Weiterhin alternativ lässt sich eine Schaum- oder Gitterartige Struktur mittels 3D-Drucks auf der Kontaktfläche 30 anordnen. Ebenso ist die subtraktive Erzeugung von offenporigen Strukturen denkbar. Hierbei wird z.B. bei einem 2-StoffMaterial eine Komponente über Temperatur, Lösungsmittel, etc. herausgelöst. Desweiteren kann eine über Temperatureintrag eine offenporige Struktur erzeugt werden (Laserablation).Furthermore, alternatively, a foam or lattice-like structure by means of 3D printing on the contact surface 30 Arrange. Similarly, the subtractive generation of open-pored structures is conceivable. Here, for example, in the case of a 2-substance material, a component is dissolved out via temperature, solvent, etc. Furthermore, it is possible to generate an open-pore structure via the introduction of temperature (laser ablation).

Weiterhin kann eine geordnete/gerichtete Anordnung von abgeflammten Kupfer-Drahtbonds zur Kontaktierung vorgesehen werden.Furthermore, an ordered / directed arrangement of flamed copper wire bonds can be provided for contacting.

Nicht eigens in der Zeichnung dargestellt weist das erfindungsgemäße Leistungsmodul 50 in weiteren Ausführungseispielen, welche im Übrigen den dargestellten Ausführungsbeispielen jeweils entsprechen, jeweils einen Kühlkanal auf, welches mit dem Substrat 10 und weiteren, nicht eigens dargestellten Teilen des Leistungsmoduls 50 gebildet ist. Dabei ist ein Leistungsbauteil mit der Kontaktschicht 160 (oder 260 oder 360) kontaktiert und gemeinsamt mit dieser Kontaktschicht 160 oder 260 oder 360 im Kühlkanal angeordnet. Der Kühlkanal ist mit Kühlflüssigkeit durchströmbar ausgebildet. Insbesondere ist der Kühlkanal abgedichtet und/oder zur Durchströmung der Kontaktschicht 160 (oder 260 oder 360) ausgebildet.Not specifically shown in the drawing, the power module according to the invention 50 in other examples of execution, which otherwise correspond to the illustrated embodiments, each having a cooling channel, which with the substrate 10 and other, not specifically shown parts of the power module 50 is formed. Here is a power device with the contact layer 160 (or 260 or 360) contacted and shared with this contact layer 160 or 260 or 360 arranged in the cooling channel. The cooling channel is designed to flow through with cooling liquid. In particular, the cooling channel is sealed and / or flow through the contact layer 160 (or 260 or 360) formed.

Claims (11)

Verfahren zur elektrischen Kontaktierung eines Bauteils (10) mit mindestens einem elektrischen Kontakt (30), bei welchem an den zumindest einen Kontakt (30) eine offenporige Kontaktschicht (160, 260, 360) additiv gebildet wird.Method for electrically contacting a component (10) with at least one electrical contact (30), in which an open-pore contact layer (160, 260, 360) is additively formed on the at least one contact (30). Verfahren nach einem der vorhergehenden Ansprüche, bei welchem die offenporige Kontaktschicht (160, 260, 360) mit leitfähigem Material, insbesondere mit einem Metall, vorzugsweise mit Kupfer und/oder Gold und/oder Molybdän und/oder Titan gebildet wird.Method according to one of the preceding claims, in which the open-pore contact layer (160, 260, 360) is formed with conductive material, in particular with a metal, preferably with copper and / or gold and / or molybdenum and / or titanium. Verfahren nach einem der vorhergehenden Ansprüche, bei welchem die Kontaktschicht (160, 260, 360) mit einer geordneten Struktur oder als geordnete Struktur gebildet wird.Method according to one of the preceding claims, in which the contact layer (160, 260, 360) is formed with an ordered structure or as an ordered structure. Verfahren nach einem der vorhergehenden Ansprüche, bei welchem die Kontaktschicht (160, 260, 360) mit einer ungeordneten Struktur oder als ungeordnete Struktur gebildet wird.Method according to one of the preceding claims, in which the contact layer (160, 260, 360) is formed with a disordered structure or as a disordered structure. Verfahren nach einem der vorhergehenden Ansprüche, bei welchem die Kontaktschicht (160), insbesondere mittels einer Düse (55), mit einem Knäuel oder als ein Knäuel gebildet wird.Method according to one of the preceding claims, wherein the contact layer (160), in particular by means of a nozzle (55), with a ball or as a ball is formed. Verfahren nach einem der vorhergehenden Ansprüche, bei welchem die Kontaktschicht, insbesondere mittels einer Düse (55), mit einem gefalteten Gewebe (260) oder als ein gefaltetes Gewebe gebildet wird.Method according to one of the preceding claims, wherein the contact layer, in particular by means of a nozzle (55), with a folded fabric (260) or as a folded fabric is formed. Verfahren nach einem der vorhergehenden Ansprüche, bei welchem die Kontaktschicht (360), insbesondere mittels einer Düse (55), mit Schaumbröseln oder als Schaumbrösel gebildet wird.Method according to one of the preceding claims, in which the contact layer (360), in particular by means of a nozzle (55), is formed with foam crumbs or as a foam crumb. Verfahren nach einem der vorhergehenden Ansprüche, bei welchem die Kontaktschicht (160, 260, 360) mittels 3D-Druckens und/oder mittels Ink-Jettens gebildet wird.Method according to one of the preceding claims, in which the contact layer (160, 260, 360) is formed by means of 3D printing and / or by means of ink jetting. Verfahren nach einem der vorhergehenden Ansprüche, bei welchem die Kontaktschicht (160, 260, 360), nachdem sie an den Kontakt anliegend gebildet oder gefertigt worden ist, mittels Galvanisierens, insbesondere elektrochemisch oder außenstromfrei, an den Kontakt elektrisch kontaktiert wird.Method according to one of the preceding claims, in which the contact layer (160, 260, 360), after being formed or fabricated adjacent to the contact, is electrically contacted to the contact by means of electroplating, in particular electrochemically or without external current. Leistungsmodul, welches mithilfe eines Verfahrens nach einem der vorhergehenden Ansprüche hergestellt wird.Power module which is produced by means of a method according to one of the preceding claims. Leistungsmodul nach dem vorhergehenden Anspruch mit einem Bauteil (10) und einer Kontaktschicht (160, 260, 360) und vorzugsweise einem daran elektrisch kontaktierten weiteren Bauelement, bei welchem die Kontaktschicht (160, 260, 360), und vorzugsweise das Bauteil und/oder das weitere Bauelement, im Kühlkanal angeordnet ist/sind und der Kühlkanal zur Durchströmung der Kontaktschicht (160, 260, 360) ausgebildet ist.Power module according to the preceding claim, comprising a component (10) and a contact layer (160, 260, 360) and preferably a further component electrically contacted thereto, in which the contact layer (160, 260, 360), and preferably the component and / or the further component, is arranged in the cooling channel / and the cooling channel for the flow through the contact layer (160, 260, 360) is formed.
DE102017211619.6A 2017-02-08 2017-07-07 Method for electrical contacting and power module Withdrawn DE102017211619A1 (en)

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