DE102016123535A1 - Bauteil mit einem strahlungsemittierenden optoelektronischen Bauelement - Google Patents

Bauteil mit einem strahlungsemittierenden optoelektronischen Bauelement Download PDF

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Publication number
DE102016123535A1
DE102016123535A1 DE102016123535.0A DE102016123535A DE102016123535A1 DE 102016123535 A1 DE102016123535 A1 DE 102016123535A1 DE 102016123535 A DE102016123535 A DE 102016123535A DE 102016123535 A1 DE102016123535 A1 DE 102016123535A1
Authority
DE
Germany
Prior art keywords
carrier
component
radiation
recess
semiconductor layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102016123535.0A
Other languages
German (de)
English (en)
Inventor
Alexander Linkov
Frank Singer
Matthias Bruckschlögl
Siegfried Herrmann
Thomas Schwarz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Priority to DE102016123535.0A priority Critical patent/DE102016123535A1/de
Priority to PCT/EP2017/081182 priority patent/WO2018104170A2/fr
Publication of DE102016123535A1 publication Critical patent/DE102016123535A1/de
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
DE102016123535.0A 2016-12-06 2016-12-06 Bauteil mit einem strahlungsemittierenden optoelektronischen Bauelement Withdrawn DE102016123535A1 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE102016123535.0A DE102016123535A1 (de) 2016-12-06 2016-12-06 Bauteil mit einem strahlungsemittierenden optoelektronischen Bauelement
PCT/EP2017/081182 WO2018104170A2 (fr) 2016-12-06 2017-12-01 Élément comprenant un composant optoélectronique émetteur de rayonnement

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102016123535.0A DE102016123535A1 (de) 2016-12-06 2016-12-06 Bauteil mit einem strahlungsemittierenden optoelektronischen Bauelement

Publications (1)

Publication Number Publication Date
DE102016123535A1 true DE102016123535A1 (de) 2018-06-07

Family

ID=60813808

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102016123535.0A Withdrawn DE102016123535A1 (de) 2016-12-06 2016-12-06 Bauteil mit einem strahlungsemittierenden optoelektronischen Bauelement

Country Status (2)

Country Link
DE (1) DE102016123535A1 (fr)
WO (1) WO2018104170A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020064540A1 (fr) * 2018-09-28 2020-04-02 Osram Opto Semiconductors Gmbh Dispositif optoélectronique et élément de connexion

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140334137A1 (en) * 2012-02-02 2014-11-13 The Procter & Gamble Company Bidirectional light sheet
DE202013012509U1 (de) * 2012-05-29 2017-02-20 Epistar Corporation Lichtemittierendes Element, Beleuchtungsvorrichtung und deren Vorrichtungsrahmen

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070187710A1 (en) * 2003-09-08 2007-08-16 Schefenacker Vision Systmes Usa Inc. Led light source
JP2007059781A (ja) * 2005-08-26 2007-03-08 Toyoda Gosei Co Ltd サブマウント付発光素子および発光装置
AT507734A1 (de) * 2008-12-16 2010-07-15 Swarovski & Co Transparenter körper
JP5515992B2 (ja) * 2010-04-07 2014-06-11 日亜化学工業株式会社 発光装置
JP2013033956A (ja) * 2011-07-04 2013-02-14 Fujifilm Corp 絶縁反射基板およびその製造方法
EP2858132B1 (fr) * 2012-05-31 2017-09-13 Panasonic Intellectual Property Management Co., Ltd. Module à del
JP2015008274A (ja) * 2013-05-31 2015-01-15 株式会社ディスコ 発光チップ
KR20160040384A (ko) * 2014-10-02 2016-04-14 삼성전자주식회사 발광장치

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140334137A1 (en) * 2012-02-02 2014-11-13 The Procter & Gamble Company Bidirectional light sheet
DE202013012509U1 (de) * 2012-05-29 2017-02-20 Epistar Corporation Lichtemittierendes Element, Beleuchtungsvorrichtung und deren Vorrichtungsrahmen

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020064540A1 (fr) * 2018-09-28 2020-04-02 Osram Opto Semiconductors Gmbh Dispositif optoélectronique et élément de connexion

Also Published As

Publication number Publication date
WO2018104170A2 (fr) 2018-06-14
WO2018104170A3 (fr) 2018-08-23

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Date Code Title Description
R163 Identified publications notified
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee