DE102015225510A1 - Spiegelelement, insbesondere für eine mikrolithographische Projektionsbelichtungsanlage - Google Patents
Spiegelelement, insbesondere für eine mikrolithographische Projektionsbelichtungsanlage Download PDFInfo
- Publication number
- DE102015225510A1 DE102015225510A1 DE102015225510.7A DE102015225510A DE102015225510A1 DE 102015225510 A1 DE102015225510 A1 DE 102015225510A1 DE 102015225510 A DE102015225510 A DE 102015225510A DE 102015225510 A1 DE102015225510 A1 DE 102015225510A1
- Authority
- DE
- Germany
- Prior art keywords
- mirror element
- substrate
- mirror
- layer
- layer stack
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 239000000758 substrate Substances 0.000 claims abstract description 92
- 238000005452 bending Methods 0.000 claims abstract description 23
- 239000000463 material Substances 0.000 claims description 17
- 210000001747 pupil Anatomy 0.000 claims description 10
- 238000005286 illumination Methods 0.000 claims description 9
- 230000003287 optical effect Effects 0.000 claims description 8
- 230000001939 inductive effect Effects 0.000 claims description 6
- 230000005540 biological transmission Effects 0.000 claims description 4
- 239000002131 composite material Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 118
- 230000000694 effects Effects 0.000 description 12
- 239000011248 coating agent Substances 0.000 description 9
- 238000000576 coating method Methods 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 230000006978 adaptation Effects 0.000 description 4
- 238000013459 approach Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 229910052732 germanium Inorganic materials 0.000 description 3
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000002346 layers by function Substances 0.000 description 2
- 238000001393 microlithography Methods 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- BUHVIAUBTBOHAG-FOYDDCNASA-N (2r,3r,4s,5r)-2-[6-[[2-(3,5-dimethoxyphenyl)-2-(2-methylphenyl)ethyl]amino]purin-9-yl]-5-(hydroxymethyl)oxolane-3,4-diol Chemical compound COC1=CC(OC)=CC(C(CNC=2C=3N=CN(C=3N=CN=2)[C@H]2[C@@H]([C@H](O)[C@@H](CO)O2)O)C=2C(=CC=CC=2)C)=C1 BUHVIAUBTBOHAG-FOYDDCNASA-N 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910005542 GaSb Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910000676 Si alloy Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 239000006094 Zerodur Substances 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- VTGARNNDLOTBET-UHFFFAOYSA-N gallium antimonide Chemical compound [Sb]#[Ga] VTGARNNDLOTBET-UHFFFAOYSA-N 0.000 description 1
- HZXMRANICFIONG-UHFFFAOYSA-N gallium phosphide Chemical compound [Ga]#P HZXMRANICFIONG-UHFFFAOYSA-N 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- WPYVAWXEWQSOGY-UHFFFAOYSA-N indium antimonide Chemical compound [Sb]#[In] WPYVAWXEWQSOGY-UHFFFAOYSA-N 0.000 description 1
- RPQDHPTXJYYUPQ-UHFFFAOYSA-N indium arsenide Chemical compound [In]#[As] RPQDHPTXJYYUPQ-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/08—Mirrors
- G02B5/0816—Multilayer mirrors, i.e. having two or more reflecting layers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/08—Mirrors
- G02B5/0891—Ultraviolet [UV] mirrors
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/08—Mirrors
- G02B5/09—Multifaceted or polygonal mirrors, e.g. polygonal scanning mirrors; Fresnel mirrors
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/08—Mirrors
- G02B5/10—Mirrors with curved faces
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/18—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors
- G02B7/181—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70075—Homogenization of illumination intensity in the mask plane by using an integrator, e.g. fly's eye lens, facet mirror or glass rod, by using a diffusing optical element or by beam deflection
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70091—Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
- G03F7/70116—Off-axis setting using a programmable means, e.g. liquid crystal display [LCD], digital micromirror device [DMD] or pupil facets
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/7015—Details of optical elements
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70316—Details of optical elements, e.g. of Bragg reflectors, extreme ultraviolet [EUV] multilayer or bilayer mirrors or diffractive optical elements
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
- G03F7/70891—Temperature
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7095—Materials, e.g. materials for housing, stage or other support having particular properties, e.g. weight, strength, conductivity, thermal expansion coefficient
- G03F7/70958—Optical materials or coatings, e.g. with particular transmittance, reflectance or anti-reflection properties
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Environmental & Geological Engineering (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Toxicology (AREA)
- Optical Elements Other Than Lenses (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102015225510.7A DE102015225510A1 (de) | 2015-12-16 | 2015-12-16 | Spiegelelement, insbesondere für eine mikrolithographische Projektionsbelichtungsanlage |
| JP2016242654A JP6875846B2 (ja) | 2015-12-16 | 2016-12-14 | 特にマイクロリソグラフィ投影露光装置用のミラー素子 |
| US15/381,910 US20170176741A1 (en) | 2015-12-16 | 2016-12-16 | Mirror element, in particular for a microlithographic projection exposure apparatus |
| US15/837,932 US10598921B2 (en) | 2015-12-16 | 2017-12-11 | Mirror element, in particular for a microlithographic projection exposure apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102015225510.7A DE102015225510A1 (de) | 2015-12-16 | 2015-12-16 | Spiegelelement, insbesondere für eine mikrolithographische Projektionsbelichtungsanlage |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE102015225510A1 true DE102015225510A1 (de) | 2017-01-12 |
Family
ID=57584057
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE102015225510.7A Ceased DE102015225510A1 (de) | 2015-12-16 | 2015-12-16 | Spiegelelement, insbesondere für eine mikrolithographische Projektionsbelichtungsanlage |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US20170176741A1 (https=) |
| JP (1) | JP6875846B2 (https=) |
| DE (1) | DE102015225510A1 (https=) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102023205340A1 (de) | 2023-06-07 | 2024-12-12 | Carl Zeiss Smt Gmbh | Verfahren zum Herstellen eines optischen Elements, sowie optisches Element und Beschichtungsanlage |
| WO2025087653A1 (de) | 2023-10-24 | 2025-05-01 | Carl Zeiss Smt Gmbh | Optisches element und euv-lithographiesystem |
| DE102024210151A1 (de) | 2024-10-21 | 2026-04-23 | Carl Zeiss Smt Gmbh | Mikrospiegelelement und mikro-elektro-mechanisches System mit Mikrospiegelelement |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20200201027A1 (en) * | 2018-12-21 | 2020-06-25 | Didi Research America, Llc | Micromachined mirror assembly having multiple coating layers |
| DE102021200131A1 (de) * | 2021-01-11 | 2022-07-14 | Carl Zeiss Smt Gmbh | Baugruppe mit einem Entkopplungsgelenk zur mechanischen Lagerung eines Elements |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005026843A2 (en) | 2003-09-12 | 2005-03-24 | Carl Zeiss Smt Ag | Illumination system for a microlithography projection exposure installation |
| DE102006057567A1 (de) | 2006-11-28 | 2008-05-29 | Micronic Laser Systems Ab | Mikrooptisches Element mit einem Substrat, an dem an einer optisch wirksamen Oberfläche mindestens eine Höhenstufe ausgebildet ist, Verfahren zu seiner Herstellung und Verwendungen |
| DE102006057568A1 (de) * | 2006-11-28 | 2008-05-29 | Micronic Laser Systems Ab | Mikrooptisches Element mit einem Substrat und Verfahren zu seiner Herstellung |
| DE102008009600A1 (de) | 2008-02-15 | 2009-08-20 | Carl Zeiss Smt Ag | Facettenspiegel zum Einsatz in einer Projektionsbelichtungsanlage für die Mikro-Lithographie |
| DE102008042212A1 (de) | 2008-09-19 | 2010-04-01 | Carl Zeiss Smt Ag | Reflektives optisches Element und Verfahren zu seiner Herstellung |
| DE102010028488A1 (de) | 2010-05-03 | 2011-11-03 | Carl Zeiss Smt Gmbh | Substrate für Spiegel für die EUV-Lithographie und deren Herstellung |
| DE102010017106A1 (de) * | 2010-05-27 | 2011-12-01 | Carl Zeiss Laser Optics Gmbh | Spiegel mit dielektrischer Beschichtung |
| DE102011003357A1 (de) | 2011-01-31 | 2012-08-02 | Carl Zeiss Smt Gmbh | Spiegel für den EUV-Wellenlängenbereich, Herstellungsverfahren für einen solchen Spiegel, Projektionsobjektiv für die Mikrolithographie mit einem solchen Spiegel und Projektionsbelichtungsanlage für die Mikrolithographie mit einem solchen Projektionsobjektiv |
| WO2015114043A1 (de) | 2014-01-30 | 2015-08-06 | Carl Zeiss Smt Gmbh | Verfahren zum herstellen eines spiegelelements |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10314212B4 (de) | 2002-03-29 | 2010-06-02 | Hoya Corp. | Verfahren zur Herstellung eines Maskenrohlings, Verfahren zur Herstellung einer Transfermaske |
| US6994444B2 (en) | 2002-06-14 | 2006-02-07 | Asml Holding N.V. | Method and apparatus for managing actinic intensity transients in a lithography mirror |
| US6778315B2 (en) * | 2002-09-25 | 2004-08-17 | Rosemount Aerospace Inc. | Micro mirror structure with flat reflective coating |
| JP2007108194A (ja) * | 2005-10-11 | 2007-04-26 | Canon Inc | 多層膜ミラーの製造方法、光学系の製造方法、露光装置、及びデバイス製造方法 |
| WO2007055401A1 (en) | 2005-11-10 | 2007-05-18 | Asahi Glass Company, Limited | Method for depositing reflective multilayer film of reflective mask blank for euv lithography and method for producing reflective mask blank for euv lithography |
| US7261430B1 (en) * | 2006-02-22 | 2007-08-28 | Teledyne Licensing, Llc | Thermal and intrinsic stress compensated micromirror apparatus and method |
| EP2243047B1 (en) | 2008-02-15 | 2021-03-31 | Carl Zeiss SMT GmbH | Facet mirror for use in a projection exposure apparatus for microlithography |
| JP5549222B2 (ja) * | 2009-12-28 | 2014-07-16 | 株式会社ニコン | 空間光変調器、露光装置およびそれらの製造方法 |
| DE102015200328A1 (de) | 2015-01-13 | 2016-07-14 | Carl Zeiss Smt Gmbh | Verfahren zum Herstellen eines optischen Elements für ein optisches System, insbesondere für einemikrolithographische Projektionsbelichtungsanlage |
-
2015
- 2015-12-16 DE DE102015225510.7A patent/DE102015225510A1/de not_active Ceased
-
2016
- 2016-12-14 JP JP2016242654A patent/JP6875846B2/ja active Active
- 2016-12-16 US US15/381,910 patent/US20170176741A1/en not_active Abandoned
-
2017
- 2017-12-11 US US15/837,932 patent/US10598921B2/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005026843A2 (en) | 2003-09-12 | 2005-03-24 | Carl Zeiss Smt Ag | Illumination system for a microlithography projection exposure installation |
| DE102006057567A1 (de) | 2006-11-28 | 2008-05-29 | Micronic Laser Systems Ab | Mikrooptisches Element mit einem Substrat, an dem an einer optisch wirksamen Oberfläche mindestens eine Höhenstufe ausgebildet ist, Verfahren zu seiner Herstellung und Verwendungen |
| DE102006057568A1 (de) * | 2006-11-28 | 2008-05-29 | Micronic Laser Systems Ab | Mikrooptisches Element mit einem Substrat und Verfahren zu seiner Herstellung |
| DE102008009600A1 (de) | 2008-02-15 | 2009-08-20 | Carl Zeiss Smt Ag | Facettenspiegel zum Einsatz in einer Projektionsbelichtungsanlage für die Mikro-Lithographie |
| DE102008042212A1 (de) | 2008-09-19 | 2010-04-01 | Carl Zeiss Smt Ag | Reflektives optisches Element und Verfahren zu seiner Herstellung |
| DE102010028488A1 (de) | 2010-05-03 | 2011-11-03 | Carl Zeiss Smt Gmbh | Substrate für Spiegel für die EUV-Lithographie und deren Herstellung |
| DE102010017106A1 (de) * | 2010-05-27 | 2011-12-01 | Carl Zeiss Laser Optics Gmbh | Spiegel mit dielektrischer Beschichtung |
| DE102011003357A1 (de) | 2011-01-31 | 2012-08-02 | Carl Zeiss Smt Gmbh | Spiegel für den EUV-Wellenlängenbereich, Herstellungsverfahren für einen solchen Spiegel, Projektionsobjektiv für die Mikrolithographie mit einem solchen Spiegel und Projektionsbelichtungsanlage für die Mikrolithographie mit einem solchen Projektionsobjektiv |
| WO2015114043A1 (de) | 2014-01-30 | 2015-08-06 | Carl Zeiss Smt Gmbh | Verfahren zum herstellen eines spiegelelements |
| DE102014201622A1 (de) * | 2014-01-30 | 2015-08-20 | Carl Zeiss Smt Gmbh | Verfahren zum Herstellen eines Spiegelelements |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102023205340A1 (de) | 2023-06-07 | 2024-12-12 | Carl Zeiss Smt Gmbh | Verfahren zum Herstellen eines optischen Elements, sowie optisches Element und Beschichtungsanlage |
| WO2024251468A1 (de) | 2023-06-07 | 2024-12-12 | Carl Zeiss Smt Gmbh | Verfahren zum herstellen eines optischen elements, sowie optisches element und beschichtungsanlage |
| WO2025087653A1 (de) | 2023-10-24 | 2025-05-01 | Carl Zeiss Smt Gmbh | Optisches element und euv-lithographiesystem |
| DE102024210151A1 (de) | 2024-10-21 | 2026-04-23 | Carl Zeiss Smt Gmbh | Mikrospiegelelement und mikro-elektro-mechanisches System mit Mikrospiegelelement |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2017126062A (ja) | 2017-07-20 |
| US10598921B2 (en) | 2020-03-24 |
| JP6875846B2 (ja) | 2021-05-26 |
| US20170176741A1 (en) | 2017-06-22 |
| US20180101002A1 (en) | 2018-04-12 |
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