DE102010035453A1 - Mehrebenenleiterplatte für Hochfrequenz-Anwendungen - Google Patents

Mehrebenenleiterplatte für Hochfrequenz-Anwendungen Download PDF

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Publication number
DE102010035453A1
DE102010035453A1 DE102010035453A DE102010035453A DE102010035453A1 DE 102010035453 A1 DE102010035453 A1 DE 102010035453A1 DE 102010035453 A DE102010035453 A DE 102010035453A DE 102010035453 A DE102010035453 A DE 102010035453A DE 102010035453 A1 DE102010035453 A1 DE 102010035453A1
Authority
DE
Germany
Prior art keywords
carrier substrate
metallization
circuit board
pcb2
frequency
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102010035453A
Other languages
German (de)
English (en)
Inventor
Ulrich Möller
Maik Schäfer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aumovio Microelectronic GmbH
Original Assignee
Conti Temic Microelectronic GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Conti Temic Microelectronic GmbH filed Critical Conti Temic Microelectronic GmbH
Priority to DE102010035453A priority Critical patent/DE102010035453A1/de
Priority to PCT/DE2011/001625 priority patent/WO2012025100A1/de
Priority to JP2013527470A priority patent/JP5863801B2/ja
Priority to US13/819,052 priority patent/US8878074B2/en
Priority to EP11802260.7A priority patent/EP2609796B1/de
Priority to DE112011102175T priority patent/DE112011102175A5/de
Publication of DE102010035453A1 publication Critical patent/DE102010035453A1/de
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0234—Resistors or by disposing resistive or lossy substances in or near power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
DE102010035453A 2010-08-26 2010-08-26 Mehrebenenleiterplatte für Hochfrequenz-Anwendungen Withdrawn DE102010035453A1 (de)

Priority Applications (6)

Application Number Priority Date Filing Date Title
DE102010035453A DE102010035453A1 (de) 2010-08-26 2010-08-26 Mehrebenenleiterplatte für Hochfrequenz-Anwendungen
PCT/DE2011/001625 WO2012025100A1 (de) 2010-08-26 2011-08-17 Mehrebenenleiterplatte für hochfrequenz-anwendungen
JP2013527470A JP5863801B2 (ja) 2010-08-26 2011-08-17 高周波に使用するための多平面印刷配線板
US13/819,052 US8878074B2 (en) 2010-08-26 2011-08-17 Multi-level circuit board for high-frequency applications
EP11802260.7A EP2609796B1 (de) 2010-08-26 2011-08-17 Mehrebenenleiterplatte für hochfrequenz-anwendungen
DE112011102175T DE112011102175A5 (de) 2010-08-26 2011-08-17 Mehrebenenleiterplatte für Hochfrequenz-Anwendungen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102010035453A DE102010035453A1 (de) 2010-08-26 2010-08-26 Mehrebenenleiterplatte für Hochfrequenz-Anwendungen

Publications (1)

Publication Number Publication Date
DE102010035453A1 true DE102010035453A1 (de) 2012-03-01

Family

ID=45420519

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102010035453A Withdrawn DE102010035453A1 (de) 2010-08-26 2010-08-26 Mehrebenenleiterplatte für Hochfrequenz-Anwendungen
DE112011102175T Withdrawn DE112011102175A5 (de) 2010-08-26 2011-08-17 Mehrebenenleiterplatte für Hochfrequenz-Anwendungen

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE112011102175T Withdrawn DE112011102175A5 (de) 2010-08-26 2011-08-17 Mehrebenenleiterplatte für Hochfrequenz-Anwendungen

Country Status (5)

Country Link
US (1) US8878074B2 (https=)
EP (1) EP2609796B1 (https=)
JP (1) JP5863801B2 (https=)
DE (2) DE102010035453A1 (https=)
WO (1) WO2012025100A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104125760A (zh) * 2013-04-29 2014-10-29 鸿富锦精密工业（深圳）有限公司 防电磁辐射的显示装置
JP6244958B2 (ja) * 2014-02-12 2017-12-13 株式会社村田製作所 半導体装置
JP6187606B2 (ja) * 2014-02-12 2017-08-30 株式会社村田製作所 プリント基板
CN107404806B (zh) * 2016-05-18 2020-12-01 德昌电机(深圳)有限公司 印刷电路板及电机
JP2018018935A (ja) * 2016-07-27 2018-02-01 イビデン株式会社 プリント配線板及びその製造方法
KR102636487B1 (ko) * 2018-10-26 2024-02-14 삼성전자주식회사 신호 전송기 및 이를 구비하는 반도체 소자 검사 장치
CN113727542B (zh) * 2021-08-30 2023-06-20 四创电子股份有限公司 一种超低损耗及高散热的高频印制电路板的制作方法
CN117320254A (zh) * 2022-06-24 2023-12-29 华为技术有限公司 电路板及终端

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5248950A (en) * 1991-04-24 1993-09-28 Sony Corporation High frequency signal processing apparatus with biasing arrangement
US5886597A (en) * 1997-03-28 1999-03-23 Virginia Tech Intellectual Properties, Inc. Circuit structure including RF/wideband resonant vias
DE10042653A1 (de) * 2000-08-31 2002-03-28 Bosch Gmbh Robert Keramische Mehrlagenschaltung
US20040155733A1 (en) * 2002-12-31 2004-08-12 Kun-Ching Chen High frequency substrate
DE10347284A1 (de) * 2003-10-08 2005-05-25 Innosent Gmbh Elektronischer Schaltkreis
US20070164396A1 (en) * 2006-01-13 2007-07-19 Industrial Technology Research Institute Multi-functional composite substrate structure

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0758663B2 (ja) * 1989-12-19 1995-06-21 松下電器産業株式会社 厚膜コンデンサ
JPH0427201A (ja) * 1990-05-22 1992-01-30 Maspro Denkoh Corp 妨害波除去フィルタ
US6104258A (en) * 1998-05-19 2000-08-15 Sun Microsystems, Inc. System and method for edge termination of parallel conductive planes in an electrical interconnecting apparatus
US6775150B1 (en) * 2000-08-30 2004-08-10 Intel Corporation Electronic assembly comprising ceramic/organic hybrid substrate with embedded capacitors and methods of manufacture
JP2003060359A (ja) * 2001-08-20 2003-02-28 Tdk Corp 多層回路基板
US7183651B1 (en) * 2004-06-15 2007-02-27 Storage Technology Corporation Power plane decoupling
JP2006303020A (ja) * 2005-04-18 2006-11-02 Mitsubishi Electric Corp コンデンサ内蔵プリント配線板
WO2008018875A1 (en) * 2006-08-09 2008-02-14 Geomat Insights, Llc Integral charge storage basement and wideband embedded decoupling structure for integrated circuit
JP5155582B2 (ja) * 2007-03-30 2013-03-06 京セラ株式会社 配線基板および電子装置
US8492658B2 (en) * 2010-11-16 2013-07-23 International Business Machines Corporation Laminate capacitor stack inside a printed circuit board for electromagnetic compatibility capacitance

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5248950A (en) * 1991-04-24 1993-09-28 Sony Corporation High frequency signal processing apparatus with biasing arrangement
US5886597A (en) * 1997-03-28 1999-03-23 Virginia Tech Intellectual Properties, Inc. Circuit structure including RF/wideband resonant vias
DE10042653A1 (de) * 2000-08-31 2002-03-28 Bosch Gmbh Robert Keramische Mehrlagenschaltung
US20040155733A1 (en) * 2002-12-31 2004-08-12 Kun-Ching Chen High frequency substrate
DE10347284A1 (de) * 2003-10-08 2005-05-25 Innosent Gmbh Elektronischer Schaltkreis
US20070164396A1 (en) * 2006-01-13 2007-07-19 Industrial Technology Research Institute Multi-functional composite substrate structure

Also Published As

Publication number Publication date
US8878074B2 (en) 2014-11-04
EP2609796B1 (de) 2017-11-08
DE112011102175A5 (de) 2013-04-11
EP2609796A1 (de) 2013-07-03
JP2013539218A (ja) 2013-10-17
US20140083756A1 (en) 2014-03-27
JP5863801B2 (ja) 2016-02-17
WO2012025100A1 (de) 2012-03-01

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Legal Events

Date Code Title Description
R163 Identified publications notified
R118 Application deemed withdrawn due to claim for domestic priority

Effective date: 20110817