DE102007047247A1 - Halbleiterbauelement und Herstellungsverfahren - Google Patents

Halbleiterbauelement und Herstellungsverfahren Download PDF

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Publication number
DE102007047247A1
DE102007047247A1 DE102007047247A DE102007047247A DE102007047247A1 DE 102007047247 A1 DE102007047247 A1 DE 102007047247A1 DE 102007047247 A DE102007047247 A DE 102007047247A DE 102007047247 A DE102007047247 A DE 102007047247A DE 102007047247 A1 DE102007047247 A1 DE 102007047247A1
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DE
Germany
Prior art keywords
container
electrode pad
conductive liquid
external terminal
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102007047247A
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German (de)
English (en)
Inventor
In Hwaseong Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020060121657A external-priority patent/KR101328551B1/ko
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of DE102007047247A1 publication Critical patent/DE102007047247A1/de
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
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    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
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    • H01L2224/8112—Aligning
    • H01L2224/81136—Aligning involving guiding structures, e.g. spacers or supporting members
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
DE102007047247A 2006-10-02 2007-09-26 Halbleiterbauelement und Herstellungsverfahren Withdrawn DE102007047247A1 (de)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
KR10-2006-0097307 2006-10-02
KR20060097307 2006-10-02
KR10-2006-0121657 2006-12-04
KR1020060121657A KR101328551B1 (ko) 2006-10-02 2006-12-04 반도체 장치
US11/858,078 2007-09-19
US11/858,078 US7675171B2 (en) 2006-10-02 2007-09-19 Semiconductor package and fabricating method thereof

Publications (1)

Publication Number Publication Date
DE102007047247A1 true DE102007047247A1 (de) 2008-05-15

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Family Applications (1)

Application Number Title Priority Date Filing Date
DE102007047247A Withdrawn DE102007047247A1 (de) 2006-10-02 2007-09-26 Halbleiterbauelement und Herstellungsverfahren

Country Status (2)

Country Link
JP (1) JP2008091926A (ja)
DE (1) DE102007047247A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5642623B2 (ja) 2011-05-17 2014-12-17 株式会社東芝 半導体発光装置

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