DE102005035157A1 - Gestapeltes piezoelektrisches Element und dessen Herstellungsverfahren - Google Patents
Gestapeltes piezoelektrisches Element und dessen Herstellungsverfahren Download PDFInfo
- Publication number
- DE102005035157A1 DE102005035157A1 DE200510035157 DE102005035157A DE102005035157A1 DE 102005035157 A1 DE102005035157 A1 DE 102005035157A1 DE 200510035157 DE200510035157 DE 200510035157 DE 102005035157 A DE102005035157 A DE 102005035157A DE 102005035157 A1 DE102005035157 A1 DE 102005035157A1
- Authority
- DE
- Germany
- Prior art keywords
- piezoelectric
- layer
- internal electrode
- electrode layer
- piezoelectric layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 title claims abstract description 65
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 title claims abstract description 48
- 229910052763 palladium Inorganic materials 0.000 title claims abstract description 39
- 229910052697 platinum Inorganic materials 0.000 title claims abstract description 30
- 239000000463 material Substances 0.000 title abstract description 11
- 239000010949 copper Substances 0.000 claims abstract description 74
- 239000000919 ceramic Substances 0.000 claims abstract description 38
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 27
- 229910052802 copper Inorganic materials 0.000 claims abstract description 27
- 238000004519 manufacturing process Methods 0.000 claims abstract description 15
- 239000010410 layer Substances 0.000 claims description 208
- 229910000510 noble metal Inorganic materials 0.000 claims description 20
- 238000007747 plating Methods 0.000 claims description 18
- 239000011247 coating layer Substances 0.000 claims description 16
- 238000002347 injection Methods 0.000 claims description 15
- 239000007924 injection Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 14
- 239000000243 solution Substances 0.000 claims description 11
- 230000008569 process Effects 0.000 claims description 10
- 229910010293 ceramic material Inorganic materials 0.000 claims description 7
- 238000010304 firing Methods 0.000 claims description 6
- 238000000151 deposition Methods 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 5
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 2
- 229910001431 copper ion Inorganic materials 0.000 claims description 2
- 238000005253 cladding Methods 0.000 claims 1
- 230000008021 deposition Effects 0.000 claims 1
- 150000002940 palladium Chemical class 0.000 claims 1
- 150000003057 platinum Chemical class 0.000 claims 1
- 239000000446 fuel Substances 0.000 description 16
- 229910052751 metal Inorganic materials 0.000 description 16
- 239000002184 metal Substances 0.000 description 16
- 230000005012 migration Effects 0.000 description 14
- 238000013508 migration Methods 0.000 description 14
- 239000000945 filler Substances 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 150000002500 ions Chemical class 0.000 description 7
- 239000010970 precious metal Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 5
- 238000000576 coating method Methods 0.000 description 4
- 238000011049 filling Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 241001417941 Hexagrammidae Species 0.000 description 2
- -1 Palladium salt Chemical class 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000002270 dispersing agent Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 238000010009 beating Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000013530 defoamer Substances 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000002828 fuel tank Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- BDAGIHXWWSANSR-NJFSPNSNSA-N hydroxyformaldehyde Chemical compound O[14CH]=O BDAGIHXWWSANSR-NJFSPNSNSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 229910000464 lead oxide Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910000484 niobium oxide Inorganic materials 0.000 description 1
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 description 1
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229910000018 strontium carbonate Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
- H10N30/063—Forming interconnections, e.g. connection electrodes of multilayered piezoelectric or electrostrictive parts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
- H10N30/067—Forming single-layered electrodes of multilayered piezoelectric or electrostrictive parts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/877—Conductive materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
- H10N30/057—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes by stacking bulk piezoelectric or electrostrictive bodies and electrodes
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Fuel-Injection Apparatus (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPP2004/220694 | 2004-07-28 | ||
| JP2004220694A JP4631342B2 (ja) | 2004-07-28 | 2004-07-28 | 積層型圧電体素子の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE102005035157A1 true DE102005035157A1 (de) | 2006-03-02 |
Family
ID=35745821
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE200510035157 Ceased DE102005035157A1 (de) | 2004-07-28 | 2005-07-27 | Gestapeltes piezoelektrisches Element und dessen Herstellungsverfahren |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4631342B2 (ja) |
| DE (1) | DE102005035157A1 (ja) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB0604467D0 (en) * | 2006-03-06 | 2006-04-12 | Delphi Tech Inc | Ionic barrier coatings |
| JP5589811B2 (ja) * | 2010-12-06 | 2014-09-17 | ブラザー工業株式会社 | 圧電アクチュエータ |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0432213A (ja) * | 1990-05-29 | 1992-02-04 | Toshiba Corp | セラミックコンデンサ |
| JP3042224B2 (ja) * | 1992-10-09 | 2000-05-15 | 昭栄化学工業株式会社 | 積層セラミックコンデンサの製造方法 |
| JPH06314828A (ja) * | 1993-04-28 | 1994-11-08 | Mitsubishi Kasei Corp | 積層型素子の製造方法 |
| JPH10290031A (ja) * | 1997-04-11 | 1998-10-27 | Nissan Motor Co Ltd | 積層型圧電アクチュエータおよびその製造方法 |
| JPH11204847A (ja) * | 1998-01-08 | 1999-07-30 | Nissan Motor Co Ltd | 積層型圧電アクチュエータ |
| US6721166B2 (en) * | 2001-04-05 | 2004-04-13 | Matsushita Electric Industrial Co., Ltd. | Ceramic electronic component and method for manufacturing the same |
| JP2002075774A (ja) * | 2000-09-04 | 2002-03-15 | Furuya Kinzoku:Kk | 電子部品 |
| JP4248777B2 (ja) * | 2000-12-28 | 2009-04-02 | 株式会社デンソー | インジェクタ用圧電体素子及びその製造方法，並びにインジェクタ |
| JP3656612B2 (ja) * | 2001-06-08 | 2005-06-08 | 株式会社村田製作所 | 金属膜およびその製造方法ならびに積層セラミック電子部品およびその製造方法 |
-
2004
- 2004-07-28 JP JP2004220694A patent/JP4631342B2/ja not_active Expired - Fee Related
-
2005
- 2005-07-27 DE DE200510035157 patent/DE102005035157A1/de not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| JP2006041278A (ja) | 2006-02-09 |
| JP4631342B2 (ja) | 2011-02-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R012 | Request for examination validly filed |
Effective date: 20110629 |
|
| R002 | Refusal decision in examination/registration proceedings | ||
| R003 | Refusal decision now final |
Effective date: 20140121 |