DE102004056984A1 - Stromrichteranordnung - Google Patents

Stromrichteranordnung Download PDF

Info

Publication number
DE102004056984A1
DE102004056984A1 DE102004056984A DE102004056984A DE102004056984A1 DE 102004056984 A1 DE102004056984 A1 DE 102004056984A1 DE 102004056984 A DE102004056984 A DE 102004056984A DE 102004056984 A DE102004056984 A DE 102004056984A DE 102004056984 A1 DE102004056984 A1 DE 102004056984A1
Authority
DE
Germany
Prior art keywords
power
converter
component
power semiconductor
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102004056984A
Other languages
German (de)
English (en)
Inventor
Eric Dr. Baudelot
Reinhold Dr. Bayerer
Richard Kenney
Herbert Leibold
Kenneth Dr. Thompson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
EUPEC GmbH
Original Assignee
Siemens AG
EUPEC GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, EUPEC GmbH filed Critical Siemens AG
Priority to DE102004056984A priority Critical patent/DE102004056984A1/de
Priority to PCT/EP2005/056078 priority patent/WO2006056555A2/fr
Publication of DE102004056984A1 publication Critical patent/DE102004056984A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/074—Stacked arrangements of non-apertured devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73267—Layer and HDI connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Dc-Dc Converters (AREA)
  • Inverter Devices (AREA)
  • Rectifiers (AREA)
  • Power Conversion In General (AREA)
DE102004056984A 2004-11-25 2004-11-25 Stromrichteranordnung Withdrawn DE102004056984A1 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE102004056984A DE102004056984A1 (de) 2004-11-25 2004-11-25 Stromrichteranordnung
PCT/EP2005/056078 WO2006056555A2 (fr) 2004-11-25 2005-11-18 Systeme de convertisseur de courant

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102004056984A DE102004056984A1 (de) 2004-11-25 2004-11-25 Stromrichteranordnung

Publications (1)

Publication Number Publication Date
DE102004056984A1 true DE102004056984A1 (de) 2006-06-08

Family

ID=35809698

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102004056984A Withdrawn DE102004056984A1 (de) 2004-11-25 2004-11-25 Stromrichteranordnung

Country Status (2)

Country Link
DE (1) DE102004056984A1 (fr)
WO (1) WO2006056555A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007033288A1 (de) * 2007-07-17 2009-01-22 Siemens Ag Elektronisches Bauelement und Vorrichtung mit hoher Isolationsfestigkeit sowie Verfahren zu deren Herstellung

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112237055A (zh) * 2018-05-25 2021-01-15 米巴能源控股有限公司 具有支承的冷却体的功率结构组件

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10029122A1 (de) * 1999-12-27 2001-07-05 Mitsubishi Electric Corp Wechselstromgenerator
WO2003030247A2 (fr) * 2001-09-28 2003-04-10 Siemens Aktiengesellschaft Procede d'etablissement de contact pour des surfaces de contact electriques situees sur un substrat et dispositif constitue d'un substrat pourvu de surfaces de contact electriques

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1212708B (it) * 1983-02-28 1989-11-30 Ates Componenti Elettron Dispositivo di potenza a semiconduttore costituito da una molteplicita' di elementi attivi uguali collegati in parallelo.
DE3786314D1 (de) * 1986-09-23 1993-07-29 Siemens Ag Halbleiterbauelemente mit leistungs-mosfet und steuerschaltung.
EP0379616A1 (fr) * 1989-01-26 1990-08-01 Siemens Aktiengesellschaft Composant semi-conducteur comprenant des corps semi-conducteurs superposés
US5994739A (en) * 1990-07-02 1999-11-30 Kabushiki Kaisha Toshiba Integrated circuit device
US5637922A (en) * 1994-02-07 1997-06-10 General Electric Company Wireless radio frequency power semiconductor devices using high density interconnect
DE19617055C1 (de) * 1996-04-29 1997-06-26 Semikron Elektronik Gmbh Halbleiterleistungsmodul hoher Packungsdichte in Mehrschichtbauweise
KR100214560B1 (ko) * 1997-03-05 1999-08-02 구본준 반도체 멀티칩 모듈
DE19902462B4 (de) * 1999-01-22 2004-02-05 Infineon Technologies Ag Halbleiterbauelement mit Chip-on-Chip-Aufbau
DE10038968A1 (de) * 2000-08-10 2002-03-07 Infineon Technologies Ag Schaltungsanordnung mit wenigstens zwei Halbleiterkörpern und einem Kühlkörper
DE10141877B4 (de) * 2001-08-28 2007-02-08 Infineon Technologies Ag Halbleiterbauteil und Konvertereinrichtung

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10029122A1 (de) * 1999-12-27 2001-07-05 Mitsubishi Electric Corp Wechselstromgenerator
WO2003030247A2 (fr) * 2001-09-28 2003-04-10 Siemens Aktiengesellschaft Procede d'etablissement de contact pour des surfaces de contact electriques situees sur un substrat et dispositif constitue d'un substrat pourvu de surfaces de contact electriques

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007033288A1 (de) * 2007-07-17 2009-01-22 Siemens Ag Elektronisches Bauelement und Vorrichtung mit hoher Isolationsfestigkeit sowie Verfahren zu deren Herstellung

Also Published As

Publication number Publication date
WO2006056555A3 (fr) 2006-07-27
WO2006056555A2 (fr) 2006-06-01

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
R016 Response to examination communication
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee