DE102004003929A1 - Surface mount optoelectronic component, has thicker electrically conductive base material providing external connections with circuit board, where bottom and side surface of base material couples respective illuminators - Google Patents

Surface mount optoelectronic component, has thicker electrically conductive base material providing external connections with circuit board, where bottom and side surface of base material couples respective illuminators Download PDF

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Publication number
DE102004003929A1
DE102004003929A1 DE200410003929 DE102004003929A DE102004003929A1 DE 102004003929 A1 DE102004003929 A1 DE 102004003929A1 DE 200410003929 DE200410003929 DE 200410003929 DE 102004003929 A DE102004003929 A DE 102004003929A DE 102004003929 A1 DE102004003929 A1 DE 102004003929A1
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base material
optoelectronic component
component according
electrically conductive
optoelectronic
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DE200410003929
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German (de)
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DE102004003929B4 (en
DE102004003929B8 (en
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Tay Kheng Chiong
Lai Khin Shin
Low Tek Beng
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Dominant Opto Technologies Sdn Bhd
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Individual
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Publication of DE102004003929B4 publication Critical patent/DE102004003929B4/en
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Publication of DE102004003929B8 publication Critical patent/DE102004003929B8/en
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)

Abstract

The component has a thicker electrically conductive base material (1) for providing external connections with a printed circuit board. An opaque plastic material (2) houses for the component. A cavity (5) within the plastic material mounts an optoelectronic chip that is connected to the base material by a metallic wire (4). Bottom and side surface of the base material couples top and side illuminators.

Description

Gebiet der ErfindungTerritory of invention

Die Erfindung bezieht sich auf ein mit Surface Mount Technologie bestückbares optoelektronisches Bauelement. Das Bauelement wurde entworfen, um mehrfache Arten der Beleuchtung zu ermöglichen; von oben, der Seite und von unten in Abhängigkeit von der Art der Bestückung. Die Bestückungsverbindungen werden durch das inhärent elektrisch leitende Grundmaterial bereitgestellt. Es ist kein mechanischer Formprozess erforderlich, um die gewünschten Bestückungsverbindungen herzustellen. Die Erfindung ermöglicht eine höhere Wärmeableitung aufgrund des verwendeten dickeren Grundmaterials und der in das Design integrierten Wärmesenke.The The invention relates to a mountable with surface mount technology optoelectronic component. The device was designed to be to enable multiple types of lighting; from the top, the side and from below depending of the type of assembly. The assembly connections are inherent in that provided electrically conductive base material. It is not a mechanical one Molding process required to make the desired assembly connections manufacture. The invention allows a higher one heat dissipation due to the thicker base material used and in the Design integrated heat sink.

Hintergrund der Erfindungbackground the invention

Um die Anforderungen der verschiedenen Kunden zu erfüllen sind heute verschiedene Bauelemente-Konfigurationen auf dem Markt erhältlich. Zwei physikalische Hauptvariationen, die normalerweise im Zusammenhang mit optoelektronischen Bauelementen besprochen werden sind Abstrahlrichtung und Pinanschlüsse. Was die Abstrahlrichtung betrifft, kann der Kunde entweder zwischen einem Topstrahler oder Seitenstrahler wählen. Wie der Name impliziert haben Topstrahler die Beleuchtungsquelle auf der Bauelement-Oberfläche, während Seitenstrahler eine Quelle an der Seite des Bauelements haben. Die Wahl hängt sehr stark von der Anwendung selbst ab. Jede dieser Konfigurationen jedoch ist in Bezug auf physikalische Dimensionen einzigartig und nicht austauschbar. Vom Kunden wird erwartet, dass er den spezifischen Typ für seine Anforderungen bestellt.Around the requirements of different customers are to be met Today various component configurations available on the market. Two main physical variations that are normally related are discussed with optoelectronic devices are radiation and pin connections. As far as the direction of radiation is concerned, the customer can either between choose a top emitter or side emitter. As the name implies Top emitters have the illumination source on the device surface, while side emitters have a source on the side of the device. The choice depends a lot strongly dependent on the application itself. However, each of these configurations is unique in terms of physical dimensions and not interchangeable. The customer is expected to be the specific type for his Requirements ordered.

Zu den herkömmlichen Varianten von Pinanschlüssen, die am Markt erhältlich sind, zählen die J-Krümmung, der Knickflügel, der umgekehrte Knickflügel usw. Dies sind die Konfigurationen der Bestückungsverbindungen auf Untersystemen wie PCBs. Auf der Grundlage derzeitiger Marktinformationen gibt es noch keine mit SM-Technologie bestückbare optoelektronische Bauelemente, die ohne einen mechanischen Formprozess auskommen, um die gewünschten Bestückungsverbindungen zu erzeugen.To the conventional one Variants of pin connections, available on the market are, count the J-curve, the crease wing, the reverse crease wing etc. These are the configurations of the mounting connections on subsystems like PCBs. Based on current market information out there no optoelectronic components that can be equipped with SM technology, which can do without a mechanical molding process to the desired assembly connections to create.

Kurze Beschreibung der ZeichnungenShort description the drawings

Die angefügten Zeichnungen sind:The appended Drawings are:

1A ist ein dreidimensionaler Blick von oben auf die Erfindung. 1A is a three-dimensional view from above of the invention.

1B ist ein dreidimensionaler Blick von unten auf die Erfindung. 1B is a three-dimensional view from below of the invention.

2 ist eine Querschnittszeichnung der Erfindung und zeigt den Aufbau bestehend aus Grundmaterial, Kunststoffgehäuse, optoelektronischen Chip und Eintiefung innerhalb des Kunststoffgehäuses, welches mit einer durchsichtigen oder Licht durchlässigen Harzmasse gefüllt ist. 2 is a cross-sectional drawing of the invention and shows the structure consisting of base material, plastic housing, optoelectronic chip and recess within the plastic housing, which is filled with a transparent or translucent resin composition.

3 zeigt die Erfindung, nachdem sie auf ein PCB aufgesetzt wurde und wobei die seitlich hervorstehenden Flügel als Mittel zur elektrischen Verbindung eingesetzt werden. 3 shows the invention after it has been placed on a PCB and wherein the laterally projecting wings are used as a means for electrical connection.

4 zeigt die Erfindung ähnlich wie in 3 aber in umgekehrter Richtung auf ein PCB aufgesetzt, sodass eine Lichtbestrahlung von der Unterseite aus bereitgestellt wird. 4 shows the invention similar to in 3 but placed in the opposite direction on a PCB, so that a light irradiation is provided from the bottom.

Detailbeschreibung der Erfindungdetailed description the invention

Die Erfindung bezieht sich auf ein mit SM-Technologie bestückbares optoelektronisches Bauelement.The The invention relates to an SM technology mountable optoelectronic component.

Bezugnehmend auf die Erfindung basiert das optoelektronische Bauelement auf der Surface Mount Technologie. Ein dickes elektrisch leitendes Material (1) wird als Grundmaterial für die Bestückung verwendet. Ein Licht undurchlässiges Material (2) wird als Gehäuse für das ganze Bauelement verwendet. Eine Eintiefung (5) ist in das Kunststoffmaterial integriert. Ein optoelektronischer Chip (3) ist innerhalb dieser Eintiefung montiert. Diese Eintiefung wird mit harter durchsichtiger oder Licht durchlässiger Harzmasse gefüllt, sodass Lichtwellen durch dieses Fenster ausgesendet oder empfangen werden können. Elektrische Verbindungen(en) zwischen dem Chip und dem Grundmaterial wird (werden) durch einen metallischen Draht (4) bereitgestellt.With reference to the invention, the optoelectronic device is based on surface mount technology. A thick electrically conductive material ( 1 ) is used as base material for the assembly. A light-impermeable material ( 2 ) is used as the housing for the whole component. A depression ( 5 ) is integrated in the plastic material. An optoelectronic chip ( 3 ) is mounted inside this recess. This recess is filled with hard translucent or translucent resin compound so that light waves can be transmitted or received through this window. Electrical connection (s) between the chip and the base material is (are) through a metallic wire ( 4 ) provided.

Weitere Verbindungen zu externen Untersystemen wie die PCBs werden durch das Grundmaterial selbst bereitgestellt; typischerweise durch Anlöten. Um die externen Verbindungen zu erzeugen sind keine weiteren mechanischen Formungsprozesse erforderlich. Das Grundmaterial erstreckt sich durchgehend von der Mitte bis zur Unterseite (8) und zu einer der Seitenwände (7); es geht so weit, dass es aus dem Kunststoffgehäuse herausragt. Die Oberfläche der Unterseite (8) wird für die Verbindung verwendet, wenn ein Topstrahler erfordert ist. Alternativ kann die seitliche Oberfläche (7) verwendet werden, wenn das Bauelement als Seitenstrahler verwendet werden soll. Diese Eigenschaft ist es, die letzten Endes eine Konstruktion für ein universelles Bauteil hervorbringt, bei dem die Fähigkeiten sowohl als Topstrahler als auch als Seitenstrahler eingesetzt zu werden in einem einzigen Bauteil vereint sind. Das Grundmaterial ragt auch aus den anderen Seiten des Bauteils heraus (6). Diese Seitenflügel wirken als Wärmesenken, um die Wärmeableitung des Bauteils zu verbessern.Further connections to external subsystems such as the PCBs are provided by the host material itself; typically by soldering. To generate the external connections, no further mechanical forming processes are required. The base material extends continuously from the middle to the bottom ( 8th ) and to one of the side walls ( 7 ); it goes so far that it protrudes from the plastic housing. The surface of the underside ( 8th ) is used for the connection when a top emitter is required. Alternatively, the side surface ( 7 ) are used when the device is to be used as a side emitter. It is this property that ultimately leads to a construction for a universal component, where the abilities are both a top-radiator and a masterpiece also be used as a side radiator are united in a single component. The base material also protrudes from the other sides of the component ( 6 ). These side wings act as heat sinks to improve the heat dissipation of the component.

In anderen Bestückungsanordnungen können diese Seitenflügel auch als Mittel verwendet werden, eine Verbindung mit externen Oberflächen wie PCBs herzustellen, wie in 3 und 4 gezeigt. In diesem Fall wird das Bauelement in das Untersystem, d.h. PCB, eingefasst und kann als Topstrahler und auch als Unterseitenstrahler verwendet werden. Diese Bestückungskonfiguration reduziert das Höhenprofil des Bauelements über dem Untersystem, da sich ein Teil des Bauelements unterhalb der Oberfläche des Untersystems befindet. In diesem Fall wirken die beiden anderen freien Oberflächen (7) und (8) stattdessen als Wärmesenken.In other mounting arrangements, these side wings may also be used as means for connecting to external surfaces such as PCBs, as in US Pat 3 and 4 shown. In this case, the device is enclosed in the subsystem, ie PCB, and can be used as a top emitter and also as a bottom emitter. This pop-up configuration reduces the height profile of the device over the subsystem because a portion of the device is below the surface of the subsystem. In this case, the two other free surfaces ( 7 ) and ( 8th ) instead as heat sinks.

Der Konstruktion innewohnend ist es, dass keine Anschlussformung erforderlich ist, da die Verbindungen nach aussen durch das Grundmaterial bereitgestellt werden. Dieses Merkmal schließt die mechanischen Beanspruchungen aus, denen die Bauteile typischerweise während der herkömmlichen Formprozesse ausgesetzt sind. Folglich nimmt die Robustheit und Zuverlässigkeit der Bauteile stark zu.Of the Construction inherent is that no terminal forming required is because the connections are provided to the outside by the base material become. This feature closes the mechanical stresses to which the components typically while the conventional molding processes are exposed. Consequently, the ruggedness and reliability decreases the components too strong.

Ein weiteres der Erfindung innewohnendes Merkmal ist sein relativ dickeres Grundmaterial im Vergleich zu anderen auf dem Markt erhältlichen vergleichbaren Produkten. Dies in Verbindungen mit den 'Wärmesenken' verbessert die Fähigkeit der Bauteile, Wärme abzuleiten, sehr stark. Höhere Ströme und Leistung können eingesetzt werden, um ein besseres Betriebsverhalten der Geräte hervorzubringen.One Another inherent feature of the invention is its relatively thicker Base material compared to other available on the market comparable products. This in combination with the 'heat sinks' improves the ability of the components to dissipate heat, very strong. higher streams and performance can be used to bring about a better performance of the devices.

Claims (8)

Optoelektronisches Bauelement, das auf der SM-Technologie (Surface Mount Technologie) basiert, mit: einem elektrisch leitenden Material (1), einem trüben Kunststoffmaterial (2) sowie einer Eintiefung (5), wobei das elektrisch leitende Material (1) als Grundmaterial für die Bestückung dient, das trübe Kunststoffmaterial (2) ein Gehäuse für das ganze Bauteil bereitstellt und die Eintiefung (5) sich innerhalb des Kunststoffmaterials befindet, worin ein optoelektronischer Chip (3) montiert ist.An optoelectronic device based on SM technology (surface mount technology), comprising: an electrically conductive material ( 1 ), a cloudy plastic material ( 2 ) and a recess ( 5 ), wherein the electrically conductive material ( 1 ) serves as basic material for the assembly, the cloudy plastic material ( 2 ) provides a housing for the whole component and the recess ( 5 ) is located within the plastic material, wherein an optoelectronic chip ( 3 ) is mounted. Optoelektronisches Bauelement nach Anspruch 1, wobei die Eintiefung (5) mit einer durchsichtigen und Licht durchlässigen Harzmasse gefüllt ist.Optoelectronic component according to claim 1, wherein the recess ( 5 ) is filled with a transparent and light-permeable resin composition. Optoelektronisches Bauelement nach Anspruch 1, wobei elektrische Verbindung(en) zwischen dem Chip (3) und dem Grundmaterial mit elektrischem Draht (4) vorgesehen ist (sind).Optoelectronic component according to claim 1, wherein electrical connection (s) between the chip ( 3 ) and the base material with electric wire ( 4 ) is (are) provided. Optoelektronisches Bauelement nach Anspruch 1, wobei das ursprüngliche Grundmaterial die leitenden Verbindungen zu externen Untersystemen wie PCBs bereitstellt.Optoelectronic component according to claim 1, wherein the original one Base material the conductive connections to external subsystems such as PCBs provides. Optoelektronisches Bauelement nach Anspruch 1, wobei das Grundmaterial vom Zentrum zum Boden (8) und zu einer der Seitenwänden (7) herausragt.Optoelectronic component according to claim 1, wherein the base material from the center to the ground ( 8th ) and to one of the side walls ( 7 ) stands out. Optoelektronisches Bauelement nach Anspruch 5, wobei das Grundmaterial aus dem Kunststoffgehäuse herausragt.An optoelectronic component according to claim 5, wherein the base material protrudes from the plastic housing. Optoelektronisches Bauelement nach Anspruch 1, wobei das Grundmaterial aus den zwei anderen Seiten (6) des Kunststoffgehäuses herausragt.Optoelectronic component according to claim 1, wherein the base material consists of the two other sides ( 6 ) of the plastic housing protrudes. Optoelektronisches Bauelement nach Anspruch 1, wobei die seitlich herausragenden Flügel für die elektrischen Verbindungen verwendet werden können.Optoelectronic component according to claim 1, wherein the laterally protruding wings for the electric Connections can be used.
DE102004003929.1A 2004-01-26 2004-01-26 SM-technology optoelectronic component Expired - Lifetime DE102004003929B8 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007019809B4 (en) * 2006-05-01 2015-01-15 Intellectual Discovery Housed circuit with a heat-dissipating lead frame and method of packaging an integrated circuit

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19549818B4 (en) * 1995-09-29 2010-03-18 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor device
DE19615839A1 (en) * 1996-04-20 1997-10-23 Abb Patent Gmbh SMD light emitting diode
JP4065051B2 (en) * 1998-04-17 2008-03-19 スタンレー電気株式会社 Surface mount LED and manufacturing method thereof
DE19928576C2 (en) * 1999-06-22 2003-05-22 Osram Opto Semiconductors Gmbh Surface mountable LED device with improved heat dissipation
JP2001077424A (en) * 1999-09-06 2001-03-23 Sharp Corp Optical semiconductor device and manufacture thereof
DE10117889A1 (en) * 2001-04-10 2002-10-24 Osram Opto Semiconductors Gmbh Leadframe used for a light emitting diode component comprises a chip assembly region, a wire connecting region, external electrical connecting strips, and a support part coupled with a thermal connecting part
JP2002324917A (en) * 2001-04-26 2002-11-08 Citizen Electronics Co Ltd Surface mount light emitting diode and method of manufacturing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007019809B4 (en) * 2006-05-01 2015-01-15 Intellectual Discovery Housed circuit with a heat-dissipating lead frame and method of packaging an integrated circuit

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