DE212010000229U1 - Light-emitting diode lighting module with its module housing as a heat sink - Google Patents

Abstract

Light-emitting diode lighting module (100), which includes a specific configuration of a thermally conductive module housing (15), a light-emitting diode lighting arrangement and a hinge element (9, 18), characterized in that the upper portion (151) of the module housing (15) without the Using external rib members (400) defines a tubular or open enclosure; the central portion (152) of the module housing (15), without the use of external rib members (400), defines an open mounting space for receiving and engaging a hinge mechanism (22), whereby heat generated by a light emitting diode light source is applied to the module housing (15 ), which serves as a heat sink without the use of external fin elements (400), and the light module (100) becomes compact, slim and aesthetic.

Description

Technical area

The present invention generally relates to a light emitting diode lighting device comprising a light emitting diode lighting module, a circuit package and a sensor. It specifically relates to the light-emitting diode lighting module, which comprises a specific configuration of a thermally conductive module housing and various other corresponding components; and the module case serves as a heat sink.

Technical background

Light-emitting diodes are widely used in lighting design. Except for small low power LEDs, heat sinks must always be designed and used to maintain the LED temperature within the manufacturer's recommended limits. Good heat dissipation increases the life of light emitting diodes and improves their performance.

Currently, fin elements are most commonly used as a heat sink that is in contact with one or more light emitting diode light sources. A major disadvantage of using rib members is that these rib members are externally visible on a light emitting diode housing and often compromise the aesthetics of the light emitting diode housing.

There are also several patents on heat sink designs for light emitting diodes. Some of these are listed below to illustrate the background of relevant heat dissipation knowledge.

The U.S. Patent No. 6,517,218 teaches a light emitting diode with integrated heat sink. An electrically driven light emitting diode array comprises a light emitting diode, first and second electrical leads for conducting electricity to and from the light emitting diode and a heat sink.

The U.S. Patent No. 7,679,096 teaches a light emitting diode with integrated heat sink for use with a high output LED light source. The heat sink is used with a light emitting diode and a conical reflector. The heat sink has a cylindrical back that holds the light emitting diode. The heat sink includes a conically shaped wall having an inner surface, an outer surface and an open front end. The open front end has a margin with notches. The reflector has a flat front surface with arms which are secured with a fastener in the notches. The heat sink includes a plurality of slots formed on the inner and outer surfaces extending between the front and rear ends.

U.S. Patent Application Publication No. 2009/0244897, U.S. Patent Application Publication 2010/0128483 and U.S. Patent German Patent Application Publication 10 2008 055 864 illustrate a housing having one or more externally exposed heat sinks that include heat radiating fins coupled to the back surface of the housing.

US Patent Application Publication No. 2008/0089071 discloses a light emitting diode lamp structure with adjustable projection angle. A lamp housing is integrally molded and extruded. The lamp housing includes a substantially H-shaped base. A plurality of heat sinks extend from a horizontal plate of the base. A heat dissipating channel is disposed between any two adjacent heat sinks.

Summary of the invention

A light-emitting diode lighting device essentially comprises a light-emitting diode lighting module which is hinged to the upper side of a circuit housing, which is electrically connected to a sensor.

As a primary object, the present invention is to provide a specific configuration of a thermally conductive module package having a light emitting diode light emitting module therein serving as a heat sink.

Another object of the present invention is to provide a light-emitting diode lighting module which is compact, slim and aesthetic.

The further object of the present invention is to adapt the position of the light-emitting diode lighting module in a wide angular range.

Still another object of the present invention is to provide sufficient cooling space in the thermally conductive module housing in the form of a partitioned plate array.

This primary and other objects are accomplished by a particular configuration of a thermally conductive module housing, either an extrusion or a casting, in contact with at least one light emitting diode light source, whereby the heat generated by the light emitting diode (s) is directed to the thermally conductive module Module housing is transmitted as a heat sink, without external Rib elements are used. As a result, the light module becomes compact, slim and aesthetic. The upper portion of the module housing defines a tubular or open enclosure without the use of external rib members. The central portion of the module housing defines an open mounting space without the use of external fin elements that receive a light emitting diode light assembly. The lower portion of the module housing defines an open enclosure without the use of external rib members to receive and engage a hinge mechanism that allows the light module to pivot and rotate to allow wide angular range positioning. The light emitted by the light module can be adjustably focused.

The present invention also teaches a light emitting diode lighting module in which the thermally conductive module housing is molded in the form of a partitioned plate array.

Brief description of the drawings

In order that the present invention may be more readily understood, the following exemplary description is given regarding a thermally conductive module housing, either an extrusion or a casting. Reference is made to the accompanying drawings, in which:

1a 3 is a perspective view of a light emitting diode lighting device which is a light emitting diode lighting module mounted on a circuit housing electrically connected to a sensor;

1b a front view of in 1a is shown light-emitting diode lighting device,

1c a side view of in 1a is shown light-emitting diode lighting device,

1d FIG. 4 is an exploded diagram of a first embodiment of a light emitting diode lighting module constructed of a thermally conductive extrusion module housing and various other corresponding components. FIG.

1e a side cross-section of a composite view of the in 1d shown light-emitting diode lighting module, which shows the heat flow directions,

1f 3 is a perspective view of a light-emitting diode lighting device provided with external rib elements in a second embodiment of the present invention;

2a is a perspective view of a light emitting diode lighting module with a thermally conductive cast module housing in the form of a partitioned plate array,

2 B a front view of the in 2a plate field is shown,

2c a perspective rear view of the in 2a plate field is shown,

2d is a side view of the plate array in cross-section showing the heat flow directions,

2e is a rear perspective view, which partially has a lateral cross section of the in 2a shown plate field shows.

Disclosure of the invention

Detailed description

According to a first exemplary embodiment of the present invention, a light emitting diode lighting module ( 100 ) essentially a thermally conductive module housing ( 15 ), which is preferably an extrusion or casting, along with other corresponding components. For a better understanding, an extrusion and casting module housing ( 15 ) provide common components and elements with the same reference numerals.

On 1a . 1b and 1c Referring to FIG. 1, a first embodiment of the light-emitting diode lighting module (FIG. 100 ) hingedly at the top of a circuit housing ( 200 ), which is electrically connected to a sensor ( 300 ) connected is. The technology for a hinge mechanism ( 22 ) is well known. The sensor ( 300 ) is electrically connected to a known motion and / or twilight activation circuit. This circuit is also known and will not be further elaborated.

On 1d Referring to FIG. 12, various other corresponding components in relative positions are ready for assembly to the first embodiment of the light emitting diode lighting module (FIG. 100 ). The components can be roughly inserted into a thermally conductive extrusion module housing ( 15 ), a light-emitting diode lighting arrangement and a joint element ( 18 ) are grouped.

The upper section ( 151 ) of the extrusion module housing ( 15 ) defines a tubular or open enclosure without the use of external rib elements ( 400 ). The empty space inside The tubular or open enclosure provides an air cooling or insulation effect. The tubular or open enclosure is also extruded throughout with the remaining sections, namely the middle section (FIG. 152 ) and the lower section ( 153 ).

The middle section ( 152 ) of the extrusion module housing ( 15 ) defines an open attachment space without the use of external rib elements ( 400 ) which receives a light-emitting diode lighting arrangement, which will be explained later.

The lower section ( 153 ) of the extrusion module housing ( 15 ) defines an open enclosure without the use of external fin elements ( 400 ) to a hinge mechanism ( 22 ), which makes it possible for the composite light-emitting diode ( 100 ) allows to pivot and rotate to allow positioning in a wide angular range. In other words, with a light-emitting diode ( 20 ) equipped light emitting diode lighting module ( 100 ) tiltable and adjustable. Since the thermally conductive extrusion module housing ( 15 ) is preferably curved, can light, which from the light window ( 20 ) in the middle section ( 152 ) of the extrusion module housing ( 15 ) is emitted, adjustable to be focused.

As a result of the teaching of the present invention, the light emitting diode lighting module ( 100 ) compact, slim and aesthetic.

It is a thickened substrate ( 21 ) in the middle section ( 152 ) of the extrusion module housing ( 15 ), which is in contact with a printed circuit board ( 7 ) with metal core, which carries at least one light-emitting diode light source. The light from the light-emitting diode light source is emitted by a reflector ( 5 ) collected and collimated. This collected and collimated light is applied to at least one light emitting diode lens ( 2 ). The light-emitting diode lens ( 2 ) is on the light emitting diode ( 20 ) attached to a frame ( 1 ) is provided. These components and seals, including a lens seal ( 3 ) and a reflector seal ( 6 ), together form the above-mentioned light-emitting diode lighting arrangement.

On 1e Referring to FIG. 5, short arrows are drawn to indicate the heat flow directions in the extrusion module housing (FIG. 15 ) to show. The light-emitting diode light source is thus in contact with the extrusion module housing ( 15 ), whereby the light emitting diode lighting module ( 100 ), the heat generated by the light-emitting diode light source being applied to the extrusion module housing ( 15 ), which serves as a heat sink, without external rib elements ( 400 ) be used. The present embodiment using a module housing ( 15 ) as a heat dissipator can dissipate heat generated by at least one light emitting diode. The number and power of light-emitting diodes finally used determine the dimensions of the light-emitting diode lighting module ( 100 ).

When more powerful LED light is to be emitted, as in 1f , more heat is generated. A variety of short rib elements ( 400 ) are additionally on the back of the extrusion module housing ( 15 ) to dissipate the extra heat. Since much of the heat generated is already due to the original heat sink design of the extrusion module housing ( 15 ), the dimensions of these rib elements ( 400 ) greatly reduced. In other words, as the LED power increases, a plurality of short rib elements (FIG. 400 ) integral to the back of the extrusion module housing ( 15 ) intended. The above can be considered as a second embodiment of the light emitting diode lighting module ( 100 ), which is provided with external short rib elements.

The thermally conductive module housing ( 15 ) may also be cast in the form of a partitioned plate array as shown in FIG 2a - 2e is shown. The module housing ( 15 ) cooperates with a light-emitting diode lighting arrangement and other corresponding components to form a light-emitting diode lighting module ( 100 ) train. The partitioned disk field is cast with a partitioned top section ( 151 ), a partitioned middle section ( 152 ) and a partitioned lower section ( 153 ). Adjacent partition sections in the upper section (FIG. 151 ), the middle section ( 152 ) and the lower section ( 153 ), which serve as heat dissipating elements, are installed and essentially hidden.

On 2c Referring to the upper section (FIG. 151 ) of the cast module housing ( 15 ) an open enclosure. The empty airspace provides an air cooling or insulation effect. The open enclosure is also cast continuously with the remaining sections, namely the middle section ( 152 ) and the lower section ( 153 ).

The middle section ( 152 ) of the cast module housing ( 15 ) defines an open mounting space which accommodates a previously discussed light emitting diode lighting assembly.

The lower section ( 153 ) of the cast module housing ( 15 ) defines an open enclosure. A joint element ( 9 ) is at the back of the cast module housing ( 15 ) arranged in the direction of its base. The joint element ( 9 ) subsequently takes the hinge mechanism ( 22 ) and comes engaged with him. As explained above, this hinge mechanism ( 22 ) the light emitting diode lighting module ( 100 ), and rotate to allow positioning in a wide range of angles. In other words, with a light-emitting diode ( 20 ) equipped light emitting diode lighting module ( 100 ) tiltable and adjustable.

On 2d and 2e Referring to FIG. 1, the above casting design includes a plurality of adjacent wall sections which serve as heat dissipating elements adjacent to those through its upper section (FIG. 151 ) and its lower section ( 153 ) are arranged free spaces. The partitioned air spaces in the panel provide another air cooling or isolating effect. It is important to note that these heat dissipating elements are substantially hidden away. The middle section ( 152 ) with the light emitting diode array serves as the emitting side of the plate array, and this emitting side forms the above view.

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• US 6517218 [0005]
• US 7679096 [0006]
• DE 102008055864 [0007]

Claims (6)

Light-emitting diode lighting module ( 100 ), which has a specific configuration of a thermally conductive module housing ( 15 ), a light-emitting diode lighting arrangement and a joint element ( 9 . 18 ), characterized in that the upper section ( 151 ) of the module housing ( 15 ) without the use of external rib elements ( 400 ) defines a tubular or open enclosure; the middle section ( 152 ) of the module housing ( 15 ) without the use of external rib elements ( 400 ) defines an open attachment space to a hinge mechanism ( 22 ), thereby causing heat generated by a light-emitting diode light source to be applied to the module housing ( 15 ) transmitted without the use of external rib elements ( 400 ) serves as a heat sink, and the light module ( 100 ) becomes compact, slim and aesthetic. Light-emitting diode lighting module ( 100 ) according to claim 1, wherein the light-emitting diode lighting arrangement comprises a light-emitting diode light source, a printed circuit board ( 7 ) with metal core, a reflector seal ( 6 ), a reflector ( 5 ), a light-emitting diode lens ( 2 ), a lens seal ( 3 ) and a frame ( 1 ) with a light-emitting diode window ( 20 ) includes. Light-emitting diode lighting module ( 100 ) according to claim 1, wherein the hinge mechanism ( 22 ) the light emitting diode lighting module ( 100 ) allows to pivot and rotate to allow positioning in a wide angular range; and the light module ( 100 ) with the light-emitting diode illumination window ( 20 ) is tiltable and adjustable, wherein of the light emitting diode ( 20 ) emitted light is adjustably focused. Light-emitting diode lighting module ( 100 ) according to claim 1, wherein a plurality of rib elements ( 400 ) in addition to the back of an extrusion module housing ( 15 ) are arranged. Light-emitting diode lighting module ( 100 ) according to claim 1, wherein the module housing ( 15 ) is a casting. Light-emitting diode lighting module ( 100 ) according to claim 1, wherein the thermally conductive module housing ( 15 ) is cast in the form of a partitioned disk array, further comprising a partitioned upper portion ( 151 ), a partitioned middle section ( 152 ) and a partitioned lower section ( 153 ); wherein adjacent partition wall sections in the upper section (FIG. 151 ), in the middle section ( 152 ) and the lower section ( 153 ), which serve as heat dissipation elements, are incorporated and substantially hidden, with the partitioned air spaces in the panel providing further air cooling or insulating effect.

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